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Flip-Chip Technologies and Global Markets

Flip-Chip Technologies and Global Markets

The global market for flip-chip technology totaled $24.9 billion in 2015. The market should total $27.2 billion and $41.4 billion in 2016 and 2021 respectively, increasing at a compound annual growth rate (CAGR) of 8.8% from 2016 to 2021.

This report provides:
An overview of the global markets for flip-chip technologies, a process to interconnect IC’s and other microelectronics devices (MEMS) to the external circuitry by means of a solder bumping process deposit on pads.
Analyses of global market trends, with data from 2015, 2016, and projections of compound annual growth rates (CAGRs) through 2021.
Discussion of the evolution, architecture, and value chain of flip-chip technologies.
Examination of market dynamics, including drivers, restraints, and opportunities.
Analysis of the flip-chip assembly markets by geography, including North America, Europe, Asia-Pacific, and others.
Coverage of the competitive landscape, including mergers and acquisitions, collaborations and agreements, and new product development.
Profiles of major players in the industry.


SCOPE OF REPORT

The market for flip-chip technology is segmented by the following categories:
Wafer bumping process.
Copper (Cu) pillar.
Lead (Pb)-free solder.
Tin-lead (Sn-Pb) eutectic solder.
Gold stud + plated solder.
Application area.
2-D logic system-on-a-chip (SoC).
Memory.
Imaging, high-brightness light-emitting diode (HB-LED) small logic.
Radio-frequency (RF), power, analog, and mixed-signal integrated circuits (ICs).
µ-bumping for 2.5-D/3-D system-in-package/system-on-a-chip (SiP/SoC).
End use.
Smartphones.
Laptops.
Desktop CPUs.
Graphics processing units (GPUs) and chipsets.
Other computing devices.
Automotive.
Robotics.
Medical devices.
Smart technologies.
High-performance/industrial applications.
Region.
North America (the U.S., Canada and Mexico).
Europe (Italy, France, Germany, U.K., and other countries).
Asia-Pacific (China, Japan, Taiwan, South Korea, India. and other countries).
ROW (Middle East and Africa).

This report also provides a competitive analysis of the industry, a patent analysis, and a chapter including company profiles. All estimated values used are based on manufacturers’ total revenues, and are given in current U.S. dollars, unadjusted for inflation.

CHAPTER 1 Introduction
STUDY GOALS AND OBJECTIVES
REASONS FOR CONDUCTING THE STUDY
SCOPE OF REPORT
INTENDED AUDIENCE
INFORMATION SOURCES
ANALYST'S CREDENTIALS
RELATED BCC RESEARCH REPORTS
BCC RESEARCH WEBSITE
DISCLAIMER
CHAPTER 2 SUMMARY
SUMMARY TABLE GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY WAFER BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
SUMMARY FIGURE GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY WAFER BUMPING PROCESS, 2015-2021 ($ MILLIONS)
CHAPTER 3 OVERVIEW
MARKET DEFINITION
EVOLUTION OF FLIP-CHIP WAFER BUMPING TECHNOLOGIES
FIGURE 1 DEVELOPMENT OF WAFER BUMPING TECHNOLOGIES, 1960-2004
SOLDER EVAPORATION
FIGURE 2 SOLDER EVAPORATION PROCESS
ELECTROPLATING OF SOLDER ALLOYS
FIGURE 3 SOLDER ALLOY ELECTROPLATING PROCESS
SOLDER PASTE SCREENING
FIGURE 4 SOLDER PASTE SCREENING PROCESS
SOLDER BALL REPLACEMENT
C4NP PROCESS
SIGNIFICANT PATENTS ON FLIP-CHIP TECHNOLOGIES
METHOD FOR FLIP CHIP PACKAGING CO-DESIGN
Abstract
USE OF ELECTROLYTIC PLATING TO CONTROL SOLDER WETTING
Abstract
LEADLESS MULTI-LAYERED CERAMIC CAPACITOR STACKS
Abstract
FLIP-CHIP LED PACKAGE
Abstract
MEMS SENSOR INTEGRATED WITH A FLIP-CHIP
Abstract
COPPER PILLAR BUMP WITH COBALT-CONTAINING SIDEWALL PROTECTION
LAYER
Abstract
LOW NOISE FLIP-CHIP PACKAGES AND FLIP-CHIPS THEREOF
Abstract
COPPER POST SOLDER BUMPS ON SUBSTRATES
Abstract
MATRIX LID HEATSPREADER FOR FLIP CHIP PACKAGE
Abstract
FLIP-CHIP MMIC HAVING MOUNTING STIFFENER
Abstract
FLIP-CHIP BONDER AND FLIP-CHIP BONDING METHOD
Abstract
RED FLIP-CHIP LIGHT EMITTING DIODE, PACKAGE AND METHOD OF MAKING
THE SAME
Abstract
FLIP-CHIP TYPE LASER DIODE
Abstract
SELF-ALIGNED PROTECTION LAYER FOR COPPER POST STRUCTURE
Abstract
COPPER PILLAR SIDEWALL PROTECTION
Abstract
ENHANCED FLIP CHIP STRUCTURE USING COPPER COLUMN INTERCONNECT
Abstract
METHOD OF FORMING COPPER PILLAR BUMP WITH NON-METAL SIDEWALL SPACER AND METAL TOP CAP
Abstract
SUBSTRATES FOR PACKAGING FLIP-CHIP LIGHT EMITTING DEVICE AND FLIP-CHIP LIGHT EMITTING DEVICE PACKAGE STRUCTURES
Abstract
FLIP-CHIP SOLAR CELL CHIP AND FABRICATION METHOD THEREOF
Abstract
FLIP CHIP OVERMOLD PACKAGE
Abstract
FLIP-CHIP LIGHT EMITTING DIODE PACKAGE STRUCTURE
Abstract
ELECTRICAL CONNECTING ELEMENT HAVING NANO-TWINNED COPPER, METHOD OF FABRICATING THE SAME, AND ELECTRICAL CONNECTING
STRUCTURE COMPRISING THE SAME
Abstract
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR ASSEMBLY WITH LEAD-FREE SOLDER
Abstract
LEAD-FREE SOLDER ALLOY
Abstract
DUMMY FLIP CHIP BUMPS FOR REDUCING STRESS
Abstract
ELECTRONIC ASSEMBLY WITH COPPER PILLAR ATTACH SUBSTRATE
Abstract
FLIP-CHIP ASSEMBLY COMPRISING AN ARRAY OF VERTICAL CAVITY SURFACE
EMITTING LASERS (VCSELSS), AND AN OPTICAL TRANSMITTER ASSEMBLY
THAT INCORPORATES THE FLIP-CHIP ASSEMBLY
Abstract
LEAD-FREE SOLDER BUMP BONDING STRUCTURE
Abstract
EXPOSED DIE OVERMOLDED FLIP CHIP PACKAGE AND FABRICATION
METHOD
Abstract
APPARATUS FOR LEAD FREE SOLDER INTERCONNECTIONS FOR INTEGRATED
CIRCUITS
Abstract
HIGH VOLTAGE FLIP-CHIP LED STRUCTURE AND MANUFACTURING METHOD
THEREOF
Abstract
FLIP-CHIP INTERCONNECTION STRUCTURE
Abstract
STUD BUMP STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Abstract
FLIP-CHIP PACKAGE
Abstract
LOCALIZED HEATING FOR FLIP CHIP BONDING
Abstract
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Abstract
CU PILLAR BUMP WITH ELECTROLYTIC METAL SIDEWALL PROTECTION
Abstract
FLIP-CHIP PACKAGE FOR MONOLITHIC SWITCHING REGULATOR
Abstract
CHAPTER 4 FLIP-CHIP TECHNOLOGY MARKET BY WAFER BUMPING
PROCESS
INTRODUCTION
MARKET DYNAMICS
DRIVERS
Expansion of Semiconductor Business
Application of Flip Chips in Packaging
End-User Demand Among Consumers
RESTRAINTS
Stringent Government Regulations
European Union
High Investment Cost
Structural Problems in Solder Bumps
OPPORTUNITIES
Lead-Free Flip-Chip Assembly
TABLE 1 GLOBAL MARKET SHARES FOR FLIP-CHIP TECHNOLOGY BY WAFER BUMPING PROCESS, 2015 AND 2021 (%)
FIGURE 5 GLOBAL MARKET SHARES FOR FLIP-CHIP TECHNOLOGY BY WAFER BUMPING PROCESS, 2015 AND 2021 (%)
TABLE 2 GLOBAL FLIP-CHIP UNIT SALES BY WAFER BUMPING PROCESS, THROUGH 2021 (MILLION UNITS)
FIGURE 6 GLOBAL FLIP-CHIP UNIT SALES BY WAFER BUMPING PROCESS, 2015-2021 (MILLION UNITS)
TABLE 3 GLOBAL FLIP-CHIP TECHNOLOGY AVERAGE PRICE PER UNIT BY WAFER BUMPING PROCESS, 2015-2021 ($)
Copper Pillar
TABLE 4 GLOBAL MARKET FOR COPPER (CU) PILLAR FLIP CHIPS BY END USE, THROUGH 2021 ($ MILLIONS)
FIGURE 7 GLOBAL MARKET FOR COPPER (CU) PILLAR FLIP CHIPS BY END USE, 2015-2021 ($ MILLIONS)
Copper Bumping Features
Tin-Lead Eutectic Solder
TABLE 5 MECHANICAL PROPERTIES OF TIN-LEAD (SN-PB)
TABLE 6 PHYSICAL PROPERTIES OF TIN-LEAD (SN-PB)
TABLE 7 GLOBAL MARKET FOR TIN-LEAD (SN-PB) FLIP CHIPS BY END USE, THROUGH 2021 ($ MILLIONS)
FIGURE 8 GLOBAL MARKET FOR TIN-LEAD (SN-PB) FLIP CHIPS BY END USE, 2015-2021 ($ MILLIONS)
Advantages of Tin-Lead Eutectic Solder
Lead-Free Solder
TABLE 8 CHARACTERISTICS OF VARIOUS ELEMENTS
TABLE 9 CHARACTERISTICS OF VARIOUS MIXED COMPOSITIONS
Properties of Some Commonly Used Alloy Systems
58Bi-42Sn
52In-48Sn
TABLE 10 GLOBAL MARKET FOR LEAD (PB)-FREE FLIP CHIPS BY END USE, THROUGH 2021 ($ MILLIONS)
FIGURE 9 GLOBAL MARKET FOR LEAD (PB)-FREE FLIP CHIPS BY END USE, 2015-2021 ($ MILLIONS)
Gold Stud Bumping
TABLE 11 GLOBAL MARKET FOR GOLD STUD BUMPED FLIP CHIPS BY END USE, THROUGH 2021 ($ MILLIONS)
FIGURE 10 GLOBAL MARKET FOR GOLD STUD BUMPED FLIP CHIPS BY END USE, 2015-2021 ($ MILLIONS)
CHAPTER 5 FLIP-CHIP TECHNOLOGY MARKET BY APPLICATION
INTRODUCTION
FIGURE 11 MARKET SEGMENTATION BY APPLICATION
MARKET DYNAMICS
DRIVERS
New and Improved 3-D Integrated Circuits
Invention of Double Data Rate Fourth-Generation (DDR4) Memory
RESTRAINTS
Challenges in Transition
OPPORTUNITIES
DDR5 Memory for the Future
TABLE 12 GLOBAL MARKET DEMAND FOR FLIP-CHIP TECHNOLOGIES BY APPLICATION, THROUGH 2021 ($ MILLIONS)
FIGURE 12 GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGIES BY APPLICATION, 2015-2021 ($ MILLIONS)
2-D LOGIC SYSTEM-ON-A-CHIP
FIGURE 13 STRUCTURE OF MULTI-CHIP MODULE
FIGURE 14 STRUCTURE OF SYSTEM-ON-CHIP
TABLE 13 GLOBAL MARKET FOR FLIP CHIPS USED IN 2-D LOGIC SYSTEM-ON-CHIP BY REGION, THROUGH 2021 ($ MILLIONS)
FIGURE 15 GLOBAL MARKET FOR FLIP CHIPS USED IN 2-D LOGIC SYSTEM-ON-CHIP BY REGION, 2015-2021 ($ MILLIONS)
MEMORY
TABLE 14 COMPARATIVE ANALYSES OF VARIOUS TYPES OF MEMORY
TABLE 15 GLOBAL MARKET FOR FLIP CHIPS USED IN MEMORY APPLICATIONS
BY REGION, THROUGH 2021 ($ MILLIONS)
FIGURE 16 GLOBAL MARKET FOR FLIP CHIPS USED IN MEMORY APPLICATIONS BY REGION, 2015-2021 ($ MILLIONS)
IMAGING
TABLE 16 GLOBAL MARKET FOR FLIP CHIPS USED IN IMAGING TECHNOLOGIES BY REGION, THROUGH 2021 ($ MILLIONS)
FIGURE 17 GLOBAL MARKET FOR FLIP CHIPS USED IN IMAGING TECHNOLOGIES BY REGION, 2015-2021 ($ MILLIONS)
HIGH-BRIGHTNESS LIGHT-EMITTING DIODE (HB-LED)
FIGURE 18 STRUCTURE OF HB-LED
TABLE 17 GLOBAL MARKET FOR FLIP CHIPS USED IN HB-LED APPLICATIONS BY REGION, THROUGH 2021 ($ MILLIONS)
FIGURE 19 GLOBAL MARKET FOR FLIP CHIPS USED IN HB-LED APPLICATIONS BY REGION, 2015-2021 ($ MILLIONS)
SMALL LOGIC, RADIO FREQUENCY, POWER, ANALOG, AND MIXED-SIGNAL
INTEGRATED CIRCUITS
TABLE 18 GLOBAL MARKET FOR FLIP CHIPS USED IN RF APPLICATIONS BY REGION, THROUGH 2021 ($ MILLIONS)
FIGURE 20 GLOBAL MARKET FOR FLIP CHIPS USED IN RF APPLICATIONS BY REGION, 2015-2021 ($ MILLIONS)
2.5-D AND 3-D SYSTEM-IN-PACKAGE/SYSTEM-ON-A-CHIP
FIGURE 21 ARCHITECTURE OF 2.5-D INTEGRATED CIRCUIT
FIGURE 22 STRUCTURE OF 3-D INTEGRATED CIRCUIT
TABLE 19 GLOBAL MARKET FOR FLIP CHIPS USED IN 2.5-D/3-D APPLICATIONS BY REGION, THROUGH 2021 ($ MILLIONS)
FIGURE 23 GLOBAL MARKET FOR FLIP CHIPS USED IN 2.5-D/3-D APPLICATIONS BY REGION, 2015-2021 ($ MILLIONS)
CHAPTER 6 FLIP-CHIP TECHNOLOGY MARKET BY END USE
INTRODUCTION
MARKET DYNAMICS
DRIVERS
Increased Application of Flip Chip in Automotive
Application of Smart Technologies
Extensive Research and Development
RESTRAINTS
Time Consumption for New Innovation
OPPORTUNITIES
Household Robots in the Future
TABLE 20 GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY END USE, THROUGH 2021 ($ MILLIONS)
FIGURE 24 GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY END USE, 2015-2021 ($ MILLIONS)
SMARTPHONES
TABLE 21 GLOBAL FLIP-CHIP MARKET IN SMARTPHONES BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
FIGURE 25 GLOBAL FLIP-CHIP MARKET IN SMARTPHONES BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
LAPTOPS
TABLE 22 GLOBAL FLIP-CHIP MARKET IN LAPTOPS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
FIGURE 26 GLOBAL FLIP-CHIP MARKET IN LAPTOPS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
DESKTOP CENTRAL PROCESSING UNITS
TABLE 23 GLOBAL FLIP-CHIP MARKET IN DESKTOP CENTRAL PROCESSING UNITS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
FIGURE 27 GLOBAL FLIP-CHIP MARKET IN DESKTOP CENTRAL PROCESSING UNITS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
GRAPHICS PROCESSING UNIT AND CHIPSETS
TABLE 24 GLOBAL FLIP-CHIP MARKET IN GRAPHIC PROCESSING UNITS AND CHIPSETS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
FIGURE 28 GLOBAL FLIP-CHIP MARKET IN GRAPHICS PROCESSING UNITS AND CHIPSETS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
OTHER COMPUTING DEVICES
TABLE 25 GLOBAL FLIP-CHIP MARKET IN OTHER COMPUTING DEVICES BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
FIGURE 29 GLOBAL FLIP-CHIP MARKET IN OTHER COMPUTING DEVICES BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
AUTOMOTIVE
TABLE 26 GLOBAL FLIP-CHIP MARKET IN AUTOMOTIVE APPLICATIONS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
FIGURE 30 GLOBAL FLIP-CHIP MARKET IN AUTOMOTIVE APPLICATIONS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
ROBOTICS
TABLE 27 GLOBAL FLIP-CHIP MARKET IN ROBOTICS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
FIGURE 31 GLOBAL FLIP-CHIP MARKET IN ROBOTICS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
MEDICAL DEVICES
TABLE 28 GLOBAL FLIP-CHIP MARKET IN MEDICAL DEVICES BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
FIGURE 32 GLOBAL FLIP-CHIP MARKET IN MEDICAL DEVICES BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
SMART TECHNOLOGIES
TABLE 29 GLOBAL FLIP-CHIP MARKET IN SMART TECHNOLOGIES BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
FIGURE 33 GLOBAL FLIP-CHIP MARKET IN SMART TECHNOLOGIES BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
INDUSTRIAL APPLICATIONS
TABLE 30 GLOBAL FLIP-CHIP MARKET IN INDUSTRIAL APPLICATIONS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
FIGURE 34 GLOBAL FLIP-CHIP MARKET IN INDUSTRIAL APPLICATIONS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
CHAPTER 7 FLIP-CHIP TECHNOLOGY MARKET BY REGION
INTRODUCTION
FIGURE 35 REGIONAL SEGMENTATION OF THE FLIP-CHIP MARKET
MARKET SNAPSHOT
TABLE 31 GLOBAL MARKET FOR FLIP-CHIP PRODUCTION BY REGION, THROUGH 2021 ($ MILLIONS)
TABLE 32 GLOBAL MARKET FOR FLIP-CHIP END-USE DEMAND BY REGION, THROUGH 2021 ($ MILLIONS)
NORTH AMERICA
OVERVIEW
TABLE 33 NORTH AMERICAN MARKET FOR FLIP-CHIP PRODUCTION BY COUNTRY, THROUGH 2021 ($ MILLIONS)
TABLE 34 NORTH AMERICAN MARKET FOR FLIP-CHIP END-USE DEMAND BY COUNTRY, THROUGH 2021 ($ MILLIONS)
TABLE 35 NORTH AMERICAN FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($ MILLIONS)
TABLE 36 NORTH AMERICAN FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($ MILLIONS)
RULES AND REGULATIONS IN NORTH AMERICA
EUROPE
OVERVIEW
TABLE 37 EUROPEAN MARKET FOR FLIP-CHIP PRODUCTION BY COUNTRY, THROUGH 2021 ($ MILLIONS)
TABLE 38 EUROPEAN MARKET FOR FLIP-CHIP END-USE DEMAND BY COUNTRY, THROUGH 2021 ($ MILLIONS)
TABLE 39 EUROPEAN FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($ MILLIONS)
TABLE 40 EUROPEAN FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($ MILLIONS)
RULES AND REGULATIONS IN EUROPE
RoHS
RoHS 2
ASIA-PACIFIC REGION
OVERVIEW
TABLE 41 ASIA-PACIFIC MARKET FOR FLIP-CHIP PRODUCTION BY COUNTRY, THROUGH 2021 ($ MILLIONS)
TABLE 42 ASIA-PACIFIC MARKET FOR FLIP-CHIP END-USE DEMAND BY COUNTRY, THROUGH 2021 ($ MILLIONS)
TABLE 43 ASIA-PACIFIC FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($ MILLIONS)
TABLE 44 ASIA-PACIFIC FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($ MILLIONS)
RULES AND REGULATIONS OF VARIOUS ASIA-PACIFIC ECONOMIES
China
REST OF THE WORLD
OVERVIEW
TABLE 45 ROW FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($ MILLIONS)
TABLE 46 ROW FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($ MILLIONS)
CHAPTER 8 INDUSTRY STRUCTURE AND COMPETITIVE ANALYSIS
INDUSTRY STRUCTURE
INFLUENTIAL FACTORS
FORECAST COMPONENTS
FIGURE 36 INDUSTRY REVENUE MODEL
MARKET SHARE ANALYSIS
TABLE 47 GLOBAL FLIP-CHIP MARKET SHARES BY KEY PLAYERS, 2014 (%)
FACTORS IMPACTING THE FLIP-CHIP MARKET
SUPPLIERS' POWER
BARGAINING POWER OF BUYERS
THREAT FROM SUBSTITUTES
THREAT FROM NEW ENTRANTS
DEGREE OF COMPETITION
PATENT ANALYSIS
PATENTS BY REGION
FIGURE 37 REGIONAL ANALYSIS OF PATENTS, DECEMBER
2012-DECEMBER 2015
PATENTS BY YEAR
FIGURE 38 NUMBER OF PATENTS FILED BY YEAR, DECEMBER
2012-DECEMBER 2015 (NO OF PATENTS)
CHAPTER 9 COMPANY PROFILES
AMKOR TECHNOLOGY INC.
OVERVIEW AND PRIMARY BUSINESS
FINANCIALS
BUSINESS STRATEGIES
Innovation in Product Portfolio Through Research and Development
RECENT DEVELOPMENTS
ASE GROUP
OVERVIEW AND PRIMARY BUSINESS
FINANCIALS
BUSINESS STRATEGIES
Business Expansion Through Licensing Agreement
RECENT DEVELOPMENTS
FARADAY TECHNOLOGY CORP.
OVERVIEW AND PRIMARY BUSINESS
FINANCIALS
BUSINESS STRATEGIES
Strengthening Product Portfolio
RECENT DEVELOPMENTS
FLIPCHIP INTERNATIONAL LLC
OVERVIEW AND PRIMARY BUSINESS
FINANCIALS
BUSINESS STRATEGIES
Expanding Business Portfolio Through Agreements
RECENT DEVELOPMENTS
GIGPEAK INC.
OVERVIEW
FINANCIALS
BUSINESS STRATEGIES
Business Expansion by Acquisition
RECENT DEVELOPMENTS
GLOBALFOUNDRIES INC.
OVERVIEW AND PRIMARY BUSINESS
FINANCIALS
BUSINESS STRATEGIES
Strengthening Product Portfolio
RECENT DEVELOPMENTS
IBM CORP.
OVERVIEW AND PRIMARY BUSINESS
FINANCIALS
BUSINESS STRATEGIES
Business Expansion Through Acquisition
RECENT DEVELOPMENTS
INTEL CORP.
OVERVIEW AND PRIMARY BUSINESS
FINANCIALS
BUSINESS STRATEGIES
Acquisitions to Extend Product Portfolio
RECENT DEVELOPMENTS
KYOCERA AMERICA INC.
OVERVIEW AND PRIMARY BUSINESS
FINANCIALS
BUSINESS STRATEGIES
New Product Development
RECENT DEVELOPMENTS
NANIUM SA
OVERVIEW AND PRIMARY BUSINESS
FINANCIALS
BUSINESS STRATEGIES
New Product Development
Business Expansion Through Partnership
RECENT DEVELOPMENTS
NICHIA CORP.
OVERVIEW AND PRIMARY BUSINESS
FINANCIALS
BUSINESS STRATEGIES
Expanding Business Through Agreements
RECENT DEVELOPMENTS
NTK TECHNOLOGIES INC.
OVERVIEW AND PRIMARY BUSINESS
FINANCIALS
BUSINESS STRATEGIES
Business Expansion
RECENT DEVELOPMENTS
PHILIPS LUMILEDS LIGHTING CO.
OVERVIEW AND PRIMARY BUSINESS
FINANCIALS
BUSINESS STRATEGIES
Innovation in Product Portfolio
RECENT DEVELOPMENTS
POWERTECH TECHNOLOGY INC.
OVERVIEW AND PRIMARY BUSINESS
FINANCIALS
BUSINESS STRATEGIES
Business Expansion Through Agreements
RECENT DEVELOPMENTS
RENESAS ELECTRONICS AMERICA INC.
OVERVIEW AND PRIMARY BUSINESS
FINANCIALS
BUSINESS STRATEGIES
New Product Development
RECENT DEVELOPMENTS
SAMSUNG ELECTRONICS CO. LTD.
OVERVIEW AND PRIMARY BUSINESS
FINANCIALS
BUSINESS STRATEGIES
New Product Development
Business Expansion Through Acquisition
RECENT DEVELOPMENTS
SIGNETICS CORP.
OVERVIEW AND PRIMARY BUSINESS
FINANCIALS
BUSINESS STRATEGIES
Business Expansion
RECENT DEVELOPMENTS
SILICONWARE PRECISION INDUSTRIES CO. LTD.
OVERVIEW AND PRIMARY BUSINESS
FINANCIALS
BUSINESS STRATEGIES
Strategic Business Agreement
RECENT DEVELOPMENTS
SK HYNIX INC.
OVERVIEW AND PRIMARY BUSINESS
FINANCIALS
BUSINESS STRATEGIES
New Product Development
Research and Development
RECENT DEVELOPMENTS
STATS CHIPPAC PTE. LTD.
OVERVIEW AND PRIMARY BUSINESS
FINANCIALS
BUSINESS STRATEGIES
New Product Development
RECENT DEVELOPMENTS
STMICROELECTRONICS NV
OVERVIEW AND PRIMARY BUSINESS
FINANCIALS
BUSINESS STRATEGIES
Strengthening Product Portfolio
RECENT DEVELOPMENTS
SUSS MICROTEC AG
OVERVIEW AND PRIMARY BUSINESS
FINANCIALS
BUSINESS STRATEGIES
New Product Development
RECENT DEVELOPMENTS
TAIWAN SEMICONDUCTOR MANUFACTURING CO.
OVERVIEW AND PRIMARY BUSINESS
FINANCIALS
BUSINESS STRATEGIES
Business Expansion Through Collaboration
RECENT DEVELOPMENTS
TEKTRONIX COMPONENT SOLUTIONS INC.
OVERVIEW AND PRIMARY BUSINESS
FINANCIALS
BUSINESS STRATEGIES
Strengthening Product Portfolio
RECENT DEVELOPMENTS
TESSERA TECHNOLOGIES INC.
OVERVIEW AND PRIMARY BUSINESS
FINANCIALS
BUSINESS STRATEGIES
Strengthening Product Portfolio
RECENT DEVELOPMENTS
TEXAS INSTRUMENTS INC.
OVERVIEW AND PRIMARY BUSINESS
FINANCIALS
BUSINESS STRATEGIES
Strengthening Product Portfolio
RECENT DEVELOPMENTS
TOKYO ELECTRON LTD.
OVERVIEW AND PRIMARY BUSINESS
FINANCIALS
BUSINESS STRATEGIES
Strengthening Product Portfolio Through New Product Development
RECENT DEVELOPMENTS
TOSHIBA ELECTRONICS EUROPE GMBH
OVERVIEW AND PRIMARY BUSINESS
FINANCIALS
BUSINESS STRATEGIES
New Product Development
RECENT DEVELOPMENTS
UNISEM (M) BERHAD
OVERVIEW AND PRIMARY BUSINESS
FINANCIALS
BUSINESS STRATEGIES
Business Expansion
RECENT DEVELOPMENTS
UTAC HOLDINGS LTD.
OVERVIEW AND PRIMARY BUSINESS
FINANCIALS
BUSINESS STRATEGIES
Strengthening Product Portfolio
RECENT DEVELOPMENTS

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