3D IC & 2.5D IC Packaging Market Research Report by Technology (2.5D, 3D TSV, and 3D Wafer-Level Chip-Scale Packaging), by End User (Automotive, Consumer Electronics, and Industrial Sector), by Application, by Region (Americas, Asia-Pacific, and Europe,

3D IC & 2.5D IC Packaging Market Research Report by Technology (2.5D, 3D TSV, and 3D Wafer-Level Chip-Scale Packaging), by End User (Automotive, Consumer Electronics, and Industrial Sector), by Application, by Region (Americas, Asia-Pacific, and Europe, Middle East & Africa) - Global Forecast to 2026 - Cumulative Impact of COVID-19

The Global 3D IC & 2.5D IC Packaging Market size was estimated at USD 44.32 billion in 2020 and expected to reach USD 56.52 billion in 2021, at a CAGR 27.86% to reach USD 193.66 billion by 2026.

Market Statistics:

The report provides market sizing and forecast across five major currencies - USD, EUR GBP, JPY, and AUD. It helps organization leaders make better decisions when currency exchange data is readily available. In this report, the years 2018 and 2019 are considered historical years, 2020 as the base year, 2021 as the estimated year, and years from 2022 to 2026 are considered the forecast period.


Market Segmentation & Coverage:

This research report categorizes the 3D IC & 2.5D IC Packaging to forecast the revenues and analyze the trends in each of the following sub-markets:

Based on Technology, the market was studied across 2.5D, 3D TSV, and 3D Wafer-Level Chip-Scale Packaging.

Based on End User, the market was studied across Automotive, Consumer Electronics, Industrial Sector, Medical Devices, Military & Aerospace, Smart Technologies, and Telecommunication.

Based on Application, the market was studied across Imaging & Optoelectronics, LED, Logic, MEMS/Sensors, Memory, Photonics, Power, Analog and Mixed Signal, RF, and Photonics, and RF.

Based on Region, the market was studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, and Thailand. The Europe, Middle East & Africa is further studied across France, Germany, Italy, Netherlands, Qatar, Russia, Saudi Arabia, South Africa, Spain, United Arab Emirates, and United Kingdom.

Cumulative Impact of COVID-19:

COVID-19 is an incomparable global public health emergency that has affected almost every industry, and the long-term effects are projected to impact the industry growth during the forecast period. Our ongoing research amplifies our research framework to ensure the inclusion of underlying COVID-19 issues and potential paths forward. The report delivers insights on COVID-19 considering the changes in consumer behavior and demand, purchasing patterns, re-routing of the supply chain, dynamics of current market forces, and the significant interventions of governments. The updated study provides insights, analysis, estimations, and forecasts, considering the COVID-19 impact on the market.

Competitive Strategic Window:

The Competitive Strategic Window analyses the competitive landscape in terms of markets, applications, and geographies to help the vendor define an alignment or fit between their capabilities and opportunities for future growth prospects. It describes the optimal or favorable fit for the vendors to adopt successive merger and acquisition strategies, geography expansion, research & development, and new product introduction strategies to execute further business expansion and growth during a forecast period.

FPNV Positioning Matrix:

The FPNV Positioning Matrix evaluates and categorizes the vendors in the 3D IC & 2.5D IC Packaging Market based on Business Strategy (Business Growth, Industry Coverage, Financial Viability, and Channel Support) and Product Satisfaction (Value for Money, Ease of Use, Product Features, and Customer Support) that aids businesses in better decision making and understanding the competitive landscape.

Market Share Analysis:

The Market Share Analysis offers the analysis of vendors considering their contribution to the overall market. It provides the idea of its revenue generation into the overall market compared to other vendors in the space. It provides insights into how vendors are performing in terms of revenue generation and customer base compared to others. Knowing market share offers an idea of the size and competitiveness of the vendors for the base year. It reveals the market characteristics in terms of accumulation, fragmentation, dominance, and amalgamation traits.

Competitive Scenario:

The Competitive Scenario provides an outlook analysis of the various business growth strategies adopted by the vendors. The news covered in this section deliver valuable thoughts at the different stage while keeping up-to-date with the business and engage stakeholders in the economic debate. The competitive scenario represents press releases or news of the companies categorized into Merger & Acquisition, Agreement, Collaboration, & Partnership, New Product Launch & Enhancement, Investment & Funding, and Award, Recognition, & Expansion. All the news collected help vendor to understand the gaps in the marketplace and competitor’s strength and weakness thereby, providing insights to enhance product and service.

Company Usability Profiles:

The report profoundly explores the recent significant developments by the leading vendors and innovation profiles in the Global 3D IC & 2.5D IC Packaging Market, including 3M Company, Advanced Semiconductor Engineering, Inc., Amkor Technology, Apple Inc, ASE Group, BeSang Inc., Broadcom Ltd, Fujitsu Limited, IBM Corporation, Intel Corporation., Jiangsu Changjiang Electronics Technology Co. Ltd, Monolithic 3D Inc., Pure Storage, Inc., Samsung Electronics Co. Ltd, Siliconware Precision Industries Co., STMicroelectronics NV, Taiwan Semiconductor Manufacturing Company Limited, Texas Instruments Incorporated, Tezzaron Semiconductor Corporation, Toshiba Electronic Devices & Storage Corporation, United Microelectronics Corporation, and Xilinx Inc..

The report provides insights on the following pointers:

1. Market Penetration: Provides comprehensive information on the market offered by the key players
2. Market Development: Provides in-depth information about lucrative emerging markets and analyze penetration across mature segments of the markets
3. Market Diversification: Provides detailed information about new product launches, untapped geographies, recent developments, and investments
4. Competitive Assessment & Intelligence: Provides an exhaustive assessment of market shares, strategies, products, certification, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players
5. Product Development & Innovation: Provides intelligent insights on future technologies, R&D activities, and breakthrough product developments

The report answers questions such as:

1. What is the market size and forecast of the Global 3D IC & 2.5D IC Packaging Market?
2. What are the inhibiting factors and impact of COVID-19 shaping the Global 3D IC & 2.5D IC Packaging Market during the forecast period?
3. Which are the products/segments/applications/areas to invest in over the forecast period in the Global 3D IC & 2.5D IC Packaging Market?
4. What is the competitive strategic window for opportunities in the Global 3D IC & 2.5D IC Packaging Market?
5. What are the technology trends and regulatory frameworks in the Global 3D IC & 2.5D IC Packaging Market?
6. What is the market share of the leading vendors in the Global 3D IC & 2.5D IC Packaging Market?
7. What modes and strategic moves are considered suitable for entering the Global 3D IC & 2.5D IC Packaging Market?


1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders
2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update
3. Executive Summary
3.1. Introduction
4. Market Overview
4.1. Introduction
4.2. Cumulative Impact of COVID-19
5. Market Dynamics
5.1. Introduction
5.2. Drivers
5.2.1. Demand for advanced design in electronic products
5.2.2. Increasing inclination to miniaturization of electronic devices
5.2.3. Augment of gaming devices and tablet smartphones
5.3. Restraints
5.3.1. Greater levels of integration causes thermal issues
5.4. Opportunities
5.4.1. Rising demand for high-end computing, data centers, and servers
5.4.2. Advent of innovative products from manufacturers and advanced packaging
5.5. Challenges
5.5.1. High cost per unit of 3D IC and 2.5D IC
6. 3D IC & 2.5D IC Packaging Market, by Technology
6.1. Introduction
6.2. 2.5D
6.3. 3D TSV
6.4. 3D Wafer-Level Chip-Scale Packaging
7. 3D IC & 2.5D IC Packaging Market, by End User
7.1. Introduction
7.2. Automotive
7.3. Consumer Electronics
7.4. Industrial Sector
7.5. Medical Devices
7.6. Military & Aerospace
7.7. Smart Technologies
7.8. Telecommunication
8. 3D IC & 2.5D IC Packaging Market, by Application
8.1. Introduction
8.2. Imaging & Optoelectronics
8.3. LED
8.4. Logic
8.5. MEMS/Sensors
8.6. Memory
8.7. Photonics
8.8. Power, Analog and Mixed Signal, RF, and Photonics
8.9. RF
9. Americas 3D IC & 2.5D IC Packaging Market
9.1. Introduction
9.2. Argentina
9.3. Brazil
9.4. Canada
9.5. Mexico
9.6. United States
10. Asia-Pacific 3D IC & 2.5D IC Packaging Market
10.1. Introduction
10.2. Australia
10.3. China
10.4. India
10.5. Indonesia
10.6. Japan
10.7. Malaysia
10.8. Philippines
10.9. Singapore
10.10. South Korea
10.11. Taiwan
10.12. Thailand
11. Europe, Middle East & Africa 3D IC & 2.5D IC Packaging Market
11.1. Introduction
11.2. France
11.3. Germany
11.4. Italy
11.5. Netherlands
11.6. Qatar
11.7. Russia
11.8. Saudi Arabia
11.9. South Africa
11.10. Spain
11.11. United Arab Emirates
11.12. United Kingdom
12. Competitive Landscape
12.1. FPNV Positioning Matrix
12.1.1. Quadrants
12.1.2. Business Strategy
12.1.3. Product Satisfaction
12.2. Market Ranking Analysis
12.3. Market Share Analysis, By Key Player
12.4. Competitive Scenario
12.4.1. Merger & Acquisition
12.4.2. Agreement, Collaboration, & Partnership
12.4.3. New Product Launch & Enhancement
12.4.4. Investment & Funding
12.4.5. Award, Recognition, & Expansion
13. Company Usability Profiles
13.1. 3M Company
13.2. Advanced Semiconductor Engineering, Inc.
13.3. Amkor Technology
13.4. Apple Inc
13.5. ASE Group
13.6. BeSang Inc.
13.7. Broadcom Ltd
13.8. Fujitsu Limited
13.9. IBM Corporation
13.10. Intel Corporation.
13.11. Jiangsu Changjiang Electronics Technology Co. Ltd
13.12. Monolithic 3D Inc.
13.13. Pure Storage, Inc.
13.14. Samsung Electronics Co. Ltd
13.15. Siliconware Precision Industries Co.
13.16. STMicroelectronics NV
13.17. Taiwan Semiconductor Manufacturing Company Limited
13.18. Texas Instruments Incorporated
13.19. Tezzaron Semiconductor Corporation
13.20. Toshiba Electronic Devices & Storage Corporation
13.21. United Microelectronics Corporation
13.22. Xilinx Inc.
14. Appendix
14.1. Discussion Guide
14.2. License & Pricing
List of Figures
FIGURE 1. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2020 VS 2026 (USD BILLION)
FIGURE 2. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 3. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET: MARKET DYNAMICS
FIGURE 4. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2020 VS 2026 (%)
FIGURE 5. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2020 VS 2026 (USD BILLION)
FIGURE 6. COMPETITIVE STRATEGIC WINDOW FOR GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2026
FIGURE 7. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY 2.5D, 2018-2026 (USD BILLION)
FIGURE 8. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY 2.5D, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 9. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY 3D TSV, 2018-2026 (USD BILLION)
FIGURE 10. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY 3D TSV, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 11. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY 3D WAFER-LEVEL CHIP-SCALE PACKAGING, 2018-2026 (USD BILLION)
FIGURE 12. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY 3D WAFER-LEVEL CHIP-SCALE PACKAGING, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 13. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2020 VS 2026 (%)
FIGURE 14. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2020 VS 2026 (USD BILLION)
FIGURE 15. COMPETITIVE STRATEGIC WINDOW FOR GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2026
FIGURE 16. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY AUTOMOTIVE, 2018-2026 (USD BILLION)
FIGURE 17. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 18. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2026 (USD BILLION)
FIGURE 19. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 20. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY INDUSTRIAL SECTOR, 2018-2026 (USD BILLION)
FIGURE 21. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY INDUSTRIAL SECTOR, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 22. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MEDICAL DEVICES, 2018-2026 (USD BILLION)
FIGURE 23. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MEDICAL DEVICES, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 24. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MILITARY & AEROSPACE, 2018-2026 (USD BILLION)
FIGURE 25. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MILITARY & AEROSPACE, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 26. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY SMART TECHNOLOGIES, 2018-2026 (USD BILLION)
FIGURE 27. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY SMART TECHNOLOGIES, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 28. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TELECOMMUNICATION, 2018-2026 (USD BILLION)
FIGURE 29. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TELECOMMUNICATION, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 30. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2020 VS 2026 (%)
FIGURE 31. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2020 VS 2026 (USD BILLION)
FIGURE 32. COMPETITIVE STRATEGIC WINDOW FOR GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2026
FIGURE 33. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY IMAGING & OPTOELECTRONICS, 2018-2026 (USD BILLION)
FIGURE 34. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY IMAGING & OPTOELECTRONICS, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 35. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY LED, 2018-2026 (USD BILLION)
FIGURE 36. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY LED, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 37. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY LOGIC, 2018-2026 (USD BILLION)
FIGURE 38. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY LOGIC, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 39. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MEMS/SENSORS, 2018-2026 (USD BILLION)
FIGURE 40. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MEMS/SENSORS, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 41. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MEMORY, 2018-2026 (USD BILLION)
FIGURE 42. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MEMORY, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 43. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY PHOTONICS, 2018-2026 (USD BILLION)
FIGURE 44. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY PHOTONICS, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 45. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY POWER, ANALOG AND MIXED SIGNAL, RF, AND PHOTONICS, 2018-2026 (USD BILLION)
FIGURE 46. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY POWER, ANALOG AND MIXED SIGNAL, RF, AND PHOTONICS, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 47. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY RF, 2018-2026 (USD BILLION)
FIGURE 48. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY RF, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 49. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 50. ARGENTINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 51. BRAZIL 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 52. CANADA 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 53. MEXICO 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 54. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 55. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 56. AUSTRALIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 57. CHINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 58. INDIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 59. INDONESIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 60. JAPAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 61. MALAYSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 62. PHILIPPINES 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 63. SINGAPORE 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 64. SOUTH KOREA 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 65. TAIWAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 66. THAILAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 67. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 68. FRANCE 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 69. GERMANY 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 70. ITALY 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 71. NETHERLANDS 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 72. QATAR 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 73. RUSSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 74. SAUDI ARABIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 75. SOUTH AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 76. SPAIN 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 77. UNITED ARAB EMIRATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 78. UNITED KINGDOM 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 79. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET: FPNV POSITIONING MATRIX
FIGURE 80. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET: SHARE, BY KEY PLAYER, 2020
FIGURE 81. COMPETITIVE SCENARIO ANALYSIS IN GLOBAL 3D IC & 2.5D IC PACKAGING MARKET, BY TYPE
List of Tables
TABLE 1. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET: MARKET SEGMENTATION & COVERAGE
TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2016–2020
TABLE 3. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 4. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2026 (USD BILLION)
TABLE 5. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY 2.5D, BY REGION, 2018-2026 (USD BILLION)
TABLE 6. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY 3D TSV, BY REGION, 2018-2026 (USD BILLION)
TABLE 7. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY 3D WAFER-LEVEL CHIP-SCALE PACKAGING, BY REGION, 2018-2026 (USD BILLION)
TABLE 8. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2026 (USD BILLION)
TABLE 9. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2026 (USD BILLION)
TABLE 10. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2026 (USD BILLION)
TABLE 11. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY INDUSTRIAL SECTOR, BY REGION, 2018-2026 (USD BILLION)
TABLE 12. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MEDICAL DEVICES, BY REGION, 2018-2026 (USD BILLION)
TABLE 13. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MILITARY & AEROSPACE, BY REGION, 2018-2026 (USD BILLION)
TABLE 14. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY SMART TECHNOLOGIES, BY REGION, 2018-2026 (USD BILLION)
TABLE 15. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TELECOMMUNICATION, BY REGION, 2018-2026 (USD BILLION)
TABLE 16. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2026 (USD BILLION)
TABLE 17. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY IMAGING & OPTOELECTRONICS, BY REGION, 2018-2026 (USD BILLION)
TABLE 18. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY LED, BY REGION, 2018-2026 (USD BILLION)
TABLE 19. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY LOGIC, BY REGION, 2018-2026 (USD BILLION)
TABLE 20. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MEMS/SENSORS, BY REGION, 2018-2026 (USD BILLION)
TABLE 21. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MEMORY, BY REGION, 2018-2026 (USD BILLION)
TABLE 22. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY PHOTONICS, BY REGION, 2018-2026 (USD BILLION)
TABLE 23. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY POWER, ANALOG AND MIXED SIGNAL, RF, AND PHOTONICS, BY REGION, 2018-2026 (USD BILLION)
TABLE 24. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY RF, BY REGION, 2018-2026 (USD BILLION)
TABLE 25. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 26. ARGENTINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 27. BRAZIL 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 28. CANADA 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 29. MEXICO 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 30. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 31. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 32. AUSTRALIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 33. CHINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 34. INDIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 35. INDONESIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 36. JAPAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 37. MALAYSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 38. PHILIPPINES 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 39. SINGAPORE 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 40. SOUTH KOREA 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 41. TAIWAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 42. THAILAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 43. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 44. FRANCE 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 45. GERMANY 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 46. ITALY 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 47. NETHERLANDS 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 48. QATAR 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 49. RUSSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 50. SAUDI ARABIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 51. SOUTH AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 52. SPAIN 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 53. UNITED ARAB EMIRATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 54. UNITED KINGDOM 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 55. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET: SCORES
TABLE 56. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET: BUSINESS STRATEGY
TABLE 57. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET: PRODUCT SATISFACTION
TABLE 58. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET: RANKING
TABLE 59. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET: SHARE, BY KEY PLAYER, 2020
TABLE 60. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET: MERGER & ACQUISITION
TABLE 61. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET: AGREEMENT, COLLABORATION, & PARTNERSHIP
TABLE 62. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET: NEW PRODUCT LAUNCH & ENHANCEMENT
TABLE 63. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET: INVESTMENT & FUNDING
TABLE 64. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET: AWARD, RECOGNITION, & EXPANSION
TABLE 65. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET: LICENSE & PRICING

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