Flexible Printed Circuit Boards : Market Research Report

Flexible Printed Circuit Boards

Published by: Global Industry Analysts

Published: Feb. 1, 2010 - 493 Pages

I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS: Study Reliability and Reporting Limitations; Disclaimers; Data Interpretation & Reporting Level; Product Definitions and Scope of Study
II. EXECUTIVE SUMMARY: 1.GLOBAL OUTLOOK; Current Scenario and Outlook; Japan Continues to Dominate Flexible Circuits Production;China Catching Up Fast; Overview of End-Use Markets; Global PCB Industry - An Overview; PCB Production Across Major Producing Nations Declines; 2.MARKET TRENDS; Increased R&D Efforts in Substrate Materials; Polyimide Leads the FPC Substrate Materials Domain Demand for New Materials to Surge; Product Related Advantages Fuel Market Growth; Wireless Telecommunications Spawning Significant Demand; Less Complex FPCs Dominate Global FPC Market; 3.PRODUCT OVERVIEW; Flexible Circuits- An Introduction; Introduction to Flexible Circuit Technology; History and Evolution of Flexible Circuits; Types of Flexible Circuits; Multilayered Flex Circuits; Rigid-Flex Circuits; Other Select Types; Materials Used in Flexible Circuit Manufacture; Base Material; Conductor Materials; Copper as a Conducting Material; Adhesives; Protective Coatings; Manufacturing of Flexible Circuits; Key Advantages of Flexible Circuits; 4.PRODUCT INTRODUCTIONS; IMEC Develops a Novel 3-Dimensional Flex Circuit Integration Process; DuPont Launches a New APR Copper Clad Resistor Laminate, Pyralux®; Pacothane Technologies Introduces PACOFLEX 5000; All Flex Develops Customized Flexible Heater circuits; Oki Electric Cable Pioneers the Launch of a Three-Dimensional FPC; Oki Electric Cable Launches High-Speed Transmission Flexible Circuits; 5.RECENT INDUSTRY ACTIVITY; Midwest and Bartlett to Integrate PCB Manufacturing Businesses; Bomin Electronics Sets-up Facility to Produce PCBs and HDI Board Falcon Holdings Takes Over MBM Flexible Circuits; Molex Acquires AFlextech; FTG Corp. Inks Supply Deal with Honeywell Aerospace; 3M and Arrow Electronics Extend Distribution Agreement; Honeywell Inks New Collaborative Agreement with the USDC; Circuitronics Takes Over Price Printed Circuits; Hanita Coatings Takes Over Stakes in Cidav Printed Circuits; Vulcan Flex Circuit Buys and Installs Real-Time X-Ray Inspection System, XRI-1; Vulcan Flex Circuit Completes Acquisition of Polar Impedance Test System; Flextronics Obtains EC Clearance for Acquiring Solectron; Molex Expands Production of Copper Flex Circuits and Assemblies; AirBorn Takes Over StrataFlex; Tohoku Fujikura to Initiate Construction of US$16.3 Million FPC Facility; Fair Friend Group Acquires J & T Flex; Cirflex Signs Agreement with PRECO; Nistica and Fujikura Sign a Strategic Partnership; ITRI Sets up First Flexible Electronics R&D Laboratory in Taiwan; Vitex Systems Signs Strategic Partnership with Samsung America; General Electric Takes Over GE Fuji Drives America; Tonka Bay Completes Acquisition of All Flex Inc; 6.FOCUS ON SELECT GLOBAL PLAYERS; 3M (US); Amphenol Corp. (US); Benchmark Electronics, Inc. (USA); Career Technology (MFG.) Co., Ltd. (Taiwan); Flexible Circuit Technologies, Inc. (USA); Fujikura Ltd. (Japan); Hutchinson Technology, Inc. (US); Innovex, Inc. (USA); MFS Technology Ltd. (Singapore); Minco Products, Inc. (USA); Molex, Inc. (USA); Multek Flexible Circuits Inc. (USA); Multi-Fineline Electronix, Inc. (US); Nan Ya PCB Co., Ltd. (Taiwan); Nippon Mektron, Ltd. (Japan); Nitto Denko Corp. (Japan); Northpoint Technologies, Inc. (USA); Parlex Corp. (USA); Si Flex Co., Ltd. (South Korea); Sony Chemical & Information Device Corp. (Japan); Sumitomo Bakelite Co., Ltd. (Japan); Sumitomo Electric Industries, Ltd. (JAPAN); Youngpoong Electronics Co., Ltd. (South Korea); 7.GLOBAL MARKET PERSPECTIVE; By Region; Table 7: World Recent Past, Current & Future Analysis for Flexible Printed Circuit Board Market by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart); Table 8: World Historic Analysis for Flexible Printed Circuit Board Market by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart); Table 9: World 15-year Perspective for Flexible Printed Circuit Board Market by Geographic Region - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets for Years 2003, 2009 & 2015 (includes corresponding Graph/Chart); By End-Use Segment; Table 10: World Recent Past, Current & Future Analysis for Flexible Printed Circuit Board Market by End-Use Segment- Automotive, Communication, Computing, Consumer Electronics, Defense & Aerospace, Industrial/Medical and Packaging Markets Independently Analyzed with Annual Sales in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart); Table 11: World Historic Analysis for Flexible Printed Circuit Board Market by End-Use Segment- Automotive, Communication, Computing, Consumer Electronics, Defense & Aerospace, Industrial/Medical and Packaging Markets Independently Analyzed with Annual Sales in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart); Table 12: World 15-year Perspective for Flexible Printed Circuit Board Market by End-Use Segment - Percentage Breakdown of Dollar Sales for Automotive, Communication, Computing, Consumer Electronics, Defense & Aerospace, Industrial/Medical and Packaging Markets for Years 2003, 2009 & 2015 (includes corresponding Graph/Chart)
III. MARKET: 1.NORTH AMERICA; Industry Overview; Flexible Circuit Production Statistics; Slowdown Affects Shipments and Bookings; Market Participants; 1a.THE UNITED STATES; A. Market Analysis; B. Market Analytics; 1b.CANADA; A. Market Analysis; B. Market Analytics; 2.JAPAN; A. Market Analysis; B. Market Analytics; 3.EUROPE; A. Market Analysis; B. Market Analytics; 4.ASIA-PACIFIC; A. Market Analysis; B. Market Analytics; 4a.CHINA; A. Market Analysis; B. Market Analytics; 4b.REST OF ASIA-PACIFIC; A. Market Analysis; B. Market Analytics; 5.REST OF WORLD; A. Market Analysis; B. Market Analytics
IV. COMPETITIVE LANDSCAPE: Total Companies Profiled: 154 (including Divisions/Subsidiaries - 160); Region/CountryPlayers; The United States46; Canada3; Japan14; Europe60; France5; Germany25; The United Kingdom12; Italy6; Rest of Europe12; Asia-Pacific (Excluding Japan)35; Middle East2

Abstract

This report analyzes the worldwide markets for Flexible Printed Circuit Boards in US$ Millions by the following end-use markets: Automotive, Communication, Computing, Consumer Electronics, Defense & Aerospace, Industrial/Medical, and Packaging. The report provides separate comprehensive analytics for US, Canada, Japan, Europe, Asia-Pacific and Rest of World. Annual forecasts are provided for each region for the period 2007 through 2015. The report profiles 154 companies including many key and niche players worldwide such as 3M, Amphenol Corp, Benchmark Electronics, Inc., Career Technology (MFG.) Co., Ltd., Flexible Circuit Technologies, Inc., Fujikura Ltd., Hutchinson Technology, Inc., Innovex, Inc., MFS Technology Ltd., Minco Products, Inc., Molex, Inc., Multek Flexible Circuits Inc., Multi-Fineline Electronix, Inc., Nan Ya PCB Co., Ltd., Nippon Mektron, Ltd., Nitto Denko Corp., Northpoint Technologies, Inc., Parlex Corp, Si Flex Co., Ltd., Sony Chemical & Information Device Corp., Sumitomo Bakelite Co., Ltd., Sumitomo Electric Industries, Ltd., and Youngpoong Electronics Co., Ltd. Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.

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Flexible Printed Circuit Boards

Table of Contents

Abstract