Advanced Electronic Packaging - International Technology & Market Trends : Market Research Report

Advanced Electronic Packaging - International Technology & Market Trends

Published: Nov. 1, 2009 - 191 Pages

1. METHODOLOGY: Study Reliability and Reporting Limitations; Disclaimers; Quantitative Techniques & Reporting Level
2. CURRENT AND FUTURE ANALYSIS: Industry Faces Challenging Times
3. INDUSTRY OVERVIEW: A Brief Insight; Market Share Scenario
4. TRENDS AND ISSUES: Suppliers Outsource Packaging To Curtail Costs; BGAs on a Tremendous Growth Path; Glue Logic Makers Move to Advanced Packaging; Contractors Move Towards High Pin-Count Packages; Wafer Scale Packaging Anticipated to Cut Costs; Disparity in Scale Sizes - A Reason for Concern; Miniaturization Impels Adoption of Wafer- Level Chip Scale Packaging; Challenges Facing Assembly and Packaging; Technology Trends
5. GROWTH DRIVERS: Portable Equipment Drives Growth in Flip Chips12; Drivers for Electronic Packaging Technologies; Shrinking Die Sizes to Drive New Packaging Technologies; Factors Driving Growth in the Chip Scale Packaging Market; Market Technology Drivers by Major End- Use Sectors
6. PRODUCT FACTS: Ball Grid Arrays; Chip Scale Packaging (CSP); Multi Chip Modules (MCM)
7. CORPORATE DEVELOPMENTS: Telit Introduces M2M BGA Module; TSI Group Acquires Three Los Angeles Based Brazing and Machining Businesses; Ferro Creates New Electronic Packaging Materials Unit; A Group of US Based Investors Establish Chip-Packaging Plant in Vietnam; Blackstone Acquires Klockner; Micronic Gets Another Asian Customer for FPS5100 Laser Pattern Generator; RJR Polymers Introduces LCP Compatible Epoxies
8. MAJOR PLAYERS: Advanced Semiconductor Engineering Group (Taiwan); ASAT Holdings Limited (Hong Kong); Amkor Technology Inc. (US); ASM International NV (The Netherlands); CARSEM (Malaysia); Chipbond Technology Corp (Taiwan); ChipMos Technologies (Taiwan); FlipChip International (US); Fujitsu Ltd (Japan); NEC Electronics Corporation (Japan); Orient Semiconductor Electronics (Taiwan); Siliconware Precision Industries Co., Ltd. (Taiwan); STATS ChipPAC Ltd. (Singapore); Tessera, Inc. (US); Toshiba America Electronic Components Inc. (US)
9. MARKET ANALYTICS
10. THE UNITED STATES: Chip Manufacturers - Looking for Greener Pastures
11. CANADA
12. JAPAN: Weakness in the Industry Structure; Japanese Companies on Comeback Trial
13. EUROPE: a.France; b.Germany; c.Italy; d.The United Kingdom; e.Rest of Europe
14. ASIA-PACIFIC: A Brief Review; China - A Promising Market; Taiwan - Looking Ahead
15. REST OF WORLD
EXHIBITS: Table 1: Percentage Breakdown of Semiconductor Capital Equipment Manufacturers in the World - 2005; Table 2: Percentage Breakdown of Semiconductor Plastic Packaging Materials Market in the World - 2005; Table 3: Advanced Electronic Packaging Technology Trends (2010 & 2015); Table 4: Percentage Breakdown of Laminate Substrate Market by Technology in the World - 2005; Table 5: Percentage Breakdown of Leading Fabless Packaging Techniques in the World - 2005; Table 6: Percentage Breakdown Leading Foundry Manufacturing Regions in the World - 2005; Table 7: Percentage Breakdown of Leading IC Socket Manufacturers in the World - 2005; Table 8: Percentage Breakdown of Leading CSP Substrate Suppliers in the World - 2005; Table 9: Percentage Breakdown of Leading Chip Packaging Manufacturers in the World - 2005; Table 10: Trends in Flip Chip Production Worldwide (2005): Percentage Breakdown by End Product; Table 11: Global Advanced Electronic Packaging Market by Region for the Period 2007-2015 (Sales in US$ Million); Table 12: Percentage Breakdown of Global Advanced Electronic Packaging Market by Region for the Years 2008 & 2012; Table 13: Global Ball Grid Arrays Market by Region for the Period 2007-2015 (Sales in US$ Million); Table 14: Percentage Breakdown of Global Ball Grid Arrays Market by Region for the Years 2008 & 2012; Table 15: Global Chip Scale Packages Market by Region for the Period 2007- 2015 (Sales in US$ Million); Table 16: Percentage Breakdown of Global Chip Scale Packages Market by Region for the Years 2008 & 2012; Table 17: Global Multi Chip Modules Market by Region for the Period 2007-2015 (Sales in US$ Million); Table 18: Percentage Breakdown of Global Multi Chip Modules Market by Region for the Years 2008 & 2012; Table 19: Advanced Electronic Packaging Market by Product Segment in the US: 2007-2015 (Sales in US$ Million); Table 20: Percentage Breakdown of Advanced Electronic Packaging Market by Product Segment in the US for the Years 2008 & 2012; Table 21: Advanced Electronic Packaging Market by Product Segment in Canada: 2007-2015 (Sales in US$ Million); Table 22: Percentage Breakdown of Advanced Electronic Packaging Market by Product Segment in Canada for the Years 2008 & 2012; Table 23: Advanced Electronic Packaging Market by Product Segment in Japan: 2007-2015 (Sales in US$ Million); Table 24: Percentage Breakdown of Advanced Electronic Packaging Market by Product Segment in Japan for the Years 2008 & 2012; Table 25: Advanced Electronic Packaging Market by Region in Europe: 2007-2015 (Sales in US$ Million); Table 26: Percentage Breakdown of Advanced Electronic Packaging Market by Region in Europe for the Years 2008 & 2012; Table 27: Advanced Electronic Packaging Market by Product Segment in Europe: 2007-2015 (Sales in US$ Million); Table 28: Percentage Breakdown of Advanced Electronic Packaging Market by Product Segment in Europe for the Years 2008 & 2012; Table 29: Advanced Electronic Packaging Market by Product Segment in France: 2007-2015 (Sales in US$ Million); Table 30: Percentage Breakdown of Advanced Electronic Packaging Market by Product Segment in France for the Years 2008 & 2012; Table 31: Advanced Electronic Packaging Market by Product Segment in Germany: 2007-2015 (Sales in US$ Million); Table 32: Percentage Breakdown of Advanced Electronic Packaging Market by Product Segment in Germany for the Years 2008 & 2012; Table 33: Advanced Electronic Packaging Market by Product Segment in Italy: 2007-2015 (Sales in US$ Million); Table 34: Percentage Breakdown of Advanced Electronic Packaging Market by Product Segment in Italy for the Years 2008 & 2012; Table 35: Advanced Electronic Packaging Market by Product Segment in the UK: 2007-2015 (Sales in US$ Million); Table 36: Percentage Breakdown of Advanced Electronic Packaging Market by Product Segment in the UK for the Years 2008 & 2012; Table 37: Advanced Electronic Packaging Market by Product Segment in Rest of Europe: 2007-2015 (Sales in US$ Million); Table 38: Percentage Breakdown of Advanced Electronic Packaging Market by Product Segment in Rest of Europe for the Years 2008 & 2012; Table 39: Advanced Electronic Packaging Market by Product Segment in Asia-Pacific: 2007-2015 (Sales in US$ Million); Table 40: Percentage Breakdown of Advanced Electronic Packaging Market by Product Segment in Asia-Pacific for the Years 2008 & 2012; Table 41: Advanced Electronic Packaging Market by Product Segment in Rest of World: 2007-2015 (Sales in US$ Million); Table 42: Percentage Breakdown of Advanced Electronic Packaging Market by Product Segment in Rest of World for the Years 2008 & 2012
COMPANIES PROFILED

Abstract

With the burgeoning demand for portable devices, demand for advanced electronic packaging for accommodating the integrated circuits that support the aforesaid devices is on rise. Decreasing device size demands low cost electronic packages that are capable of rendering high speed, finer pitch, higher pin count and reliable interconnects. Despite the fact that higher pin count increases cost, manufacturers are finding ways to deliver the most cost effective advanced electronic packages to address the needs of the industry.

Advanced Electronic Packaging industry has grown to a position where its technology has outpaced the semiconductor technology, the parent industry it addresses. Increasing silicon complexity and integration has made it mandatory for packaging technology to provide finer lead pitch, higher I/O counts, improved heat dissipation, and rapid, reliable interconnect. Simultaneously, the industry is also pushing towards decreased printed circuit board area and complexity, which is exerting further pressure on packaging requirements.

These and other market data and trends are presented in "Advanced Electronic Packaging: International Technology & Market Trends" by BizAcumen LLC. Our reports are designed to be most comprehensive in geographic coverage and vertical market analyses.

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Advanced Electronic Packaging - International Technology & Market Trends

Table of Contents

Abstract