HB LED & LED Packaging 2009 : Market Research Report

HB LED & LED Packaging 2009

Published: Oct. 1, 2009 - 250 Pages

Content
Introduction
Executive summary
Acronyms & definitions
LED market status: Market segmentation; Market Volume; Market Revenue; General Lighting; GaN-based White LEDs; Wafer Needs for General Lighting
LED Performance: Lumens. Depending on Applications; Internal Quantum Efficiency; Evolution Under High Current; Output Heat; Overall Performances; Expected Performances for White LED
LED Packaging Status: Introduction; Package families; Assembly Process Flow; Technology Roadmap
Packaging of Regular LED: Flow Chart for Regular LED
Market Volume
DICING: Location of Dicing Process; Saw Dicing; Laser Dicing; Saw VS Laser; Supply Chain; Market Volume for Sapphire Wafers; Market Revenue for Dicing Services; Market of equipments in number of units; Market in $M
DIE BONDING: Location of the process; The Basics; Dispensing equipment from Asymtek; Material for LED; Main players; Market Volume for Die Attach Material; Market Revenue for Die Attach Material; Market of equipments in number of units; Market of equipments in $M
INTERCONNECT: Location of the process; Overview of wire bonding; Electrical connection : the basics; Wire Bonding Processes; Ball bonding VS Wedge bonding; Ribbon bond VS wire bond; Main players; Market revenue - Assumptions; Market revenue for gold wire bonding
ENCAPSULATION, LENS & PHOSPHOR: Location of the process; Encapsulation method for LED lamp; Casting process for encapsulation; Encapsulation for SMD; Compression molding process; Materials for encapsulation; Market estimation of molding compound; How does LED generate white light?; Phosphor chemistry; Phosphor placement in white LED; Main phosphor technologies in use; Main phosphor suppliers; Optics; Main players; Market revenue for phosphor material
CONCLUSIONS
PACKAGING OF HB/UHB LED: Introduction; What package for what LED?; Package type; Evolution of the packaging; Impact of the heat; HB/UHB LED packaging function; Different levels of packaging; Considerations of HB LED design; Materials challenges and solutions; Market Metrics - Packaged LED Market
Volume
SCRIBING AND DICING: Location of the process; Scribing & Dicing: Definition; Techniques, Throughputs and Costs; Number of dice / wafer; Laser Scribing & Dicing; Diamond Scribing & Dicing; Example of JPSA Scribing & Dicing tool; Example of NWR Scribing & Dicing tool; Laser Microjet Technology from Synova; Example of Synova Scribing & Dicing tool; Example of Oxford Lasers
Scribing & Dicing tool: Example of ALSI Lasers Dicing tool; Stealth Dicing Technology; Stealth Dicing Roadmap; Example of Stealth Laser Dicing tool; Example of Jenoptik-Votan dicing tool; Market Data - Assumptions; Laser vs saw; Market Revenue for HB/UHB LEDs; Market of equipment in number of units; Market revenue of equipments in $M
DIE BONDING: Location of the process; Choosing die attach material; New material for HB/UHB LED - AuSn; AuSn - Strength and weakness of deposition methods; Summary; Market Volume for Die Attach Material; Market Revenue for Die Attach Material; Market in number of die bonding equipment; Die bonding equipment - market in $M
INTERCONNECT: Location of the process; What’s new?; Evolution in wirebonding; Matrix LED - features; Flip Chip Technology; Wirebond VS Flip Chip; Flip-chip coupled with back-face contact reflector; Stud Bumping; Example of Lumileds Luxeon K2; Laser Lift-Off (LLO) & Flip-Chip; Laser Lift Off Technique: definition; Laser Lift Off Technique: OSRAM; LLO equipment; LLO technique & Flip-chip mounting
TEMPORARY BONDING: introduction; Thin-wafer handling: different solutions; Principle; Main methods: a comparison; Wax; Adhesive tapes; EVG temporary bonding tools
THERMAL MANAGEMENT: Location of the process; Thermal Solutions; Thermal solutions - Managing the LED; Thermal System Configuration; Substrates; Substrates - SMD organic; Substrates - Metal Core Printed Circuit Board; Substrates - FR4 Board &
Flexible Substrate: Substrates - Ceramic Substrates; Substrates - Direct Bonded Copper; Substrates - Trends for DBC; Substrates - Summary; Substrates - Trends : Chip On Board; Substrates - Main Players; Substrates - Market Data; Substrates - Market Volumes; Substrates - Market Revenue; HB LED submount - Market Breakdown; HB LED submount - Supply Chain; Thermal Interface Material; Thermal Interface Material - Main Players; Heatsink; Heatsink - Main Players; Summary - LED Package with optimized heat transfer
ENCAPSULATION, LENS & PHOSPHOR: Location of the process; Optical extraction techniques; Remote phosphor; Silicon Product - Shin Etsu
WAFER LEVEL PACKAGING: Main challenges for Power LED WLSP; Market drivers - Power LED Packaging; Power LED Packaging Manufacturer
Motivations & Segmentation: 3D-TSV developments for Power LEDs; Overview of power LED packaging types; Drivers for LED silicon packaging solutions; Supply chain focus on ESD protection using Si submounts for HB LEDs; Hymite: Silicon HB-LED packages; Silicon interposer for MEMS / LED
Applications: 3-D interposer to combine MOSFET +
ASIC LED driver: WLP : VisEra technologies; Estimation of 6” Silicon wafer demand for LED submount and WLP
CONCLUSION & CHALLENGES
ANNEXES

Abstract

LED market analysis report with detailed descriptions of process, equipment and materials for LED assembly

The market is a high-growth field in the semiconductor industry. The supply chain is filled with various players from LED die manufacturers (Epistar, Forepi,…), to LED assembly suppliers (Harvatek, Citizen, Liteon, Samsung,….) to fully integrated players (Lumileds, Osram, Toyoda Gosei…). In the wide range of LED packaging solutions, this report describes the existing packaging process flow, materials and equipment and the main evolution in the coming years.

LED devices have been split in 2 categories:

Regular LED
High Brightness, Ultra High Brightness LED

The main processes are presented for both categories:

Dicing
Die bonding
Electrical interconnect
Thermal management
Encapsulation

The report highlights the main technical challenges, current solutions and future trends.

This report also includes market analysis on equipment, materials and services.

KEY FEATURES OF THE REPORT

Detailed process flow of LED packaging (dicing step, electrical interconnect, substrates,….)
Market trends and figures for linked material and equipment (in million $, in number of units, ASP,…..)
Key drivers for each technology & material in use
Supply chain analysis: who is doing what?

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HB LED & LED Packaging 2009

Table of Contents

Abstract