Worldwide Mobile Phone Semiconductor 2009-2013 Forecast : Market Research Report

Worldwide Mobile Phone Semiconductor 2009-2013 Forecast

Published by: IDC

Published: Oct. 14, 2009 - 38 Pages

Table of Contents
IDC Opinion
In This Study
Scope
Methodology
Situation Overview
Tough Economic Conditions Provide Opportunities and Challenges
Future Outlook
Forecast and Assumptions
4G Opportunity Starting to Emerge, 3.5G Holding Strong, But Industry in Doldrums Overall in 2009
Asia/Pacific and Rest of World Will Drive Mobile Phone Semiconductor Growth
Connectivity and Multimedia Storage and Processing Continue as Largest Semiconductor Growth Drivers
Mobile Phone Semiconductor BOM Costs Under Pressure
Memory Content Grows and Device Mix Continues to Shift in Favor of DRAM and NAND Memory
Connectivity Chipsets Continue Growth Despite Slowdown
Forecast Assumptions
Market Context
Essential Guidance
Surviving the Downturn and Positioning for the Recovery
Learn More
Related Research
Appendix: Detailed Bill of Materials Costs
Definitions
Subsystems
Semiconductor Components
Systems
Cellular Air Interface Standards
Methodology
Historical Market Values and Exchange Rates
Synopsis
Table: Worldwide Mobile Phone Semiconductor Revenue by Air Interface Standard, 2008–2013 ($B)
Table: Worldwide Mobile Phone Semiconductor Revenue by Region, 2008–2013 ($B)
Table: Worldwide Mobile Phone Semiconductor Revenue by Device, 2008–2013 ($M)
Table: Worldwide Weighted Average Mobile Phone Semiconductor BOM Cost by Air Interface Standard, 2008–2013 ($)
Table: Key Forecast Assumptions for the Worldwide Mobile Phone Semiconductor Market, 2009–2013
Table: Worldwide Mobile Phone Semiconductor Revenue, 2005–2013: Comparison of December 2008 and October 2009 Forecasts ($B)
Table: Worldwide Average 4G Mobile Phone Semiconductor BOM Cost by Detailed Subsystem, 2008–2013 ($)
Table: Worldwide Average 3.5G Mobile Phone Semiconductor BOM Cost by Detailed Subsystem, 2008–2013 ($)
Table: Worldwide Average 3G Mobile Phone Semiconductor BOM Cost by Detailed Subsystem, 2008–2013 ($)
Table: Worldwide Average 2.5G Mobile Phone Semiconductor BOM Cost by Detailed Subsystem, 2008–2013 ($)
Table: Worldwide Average 2G Mobile Phone Semiconductor BOM Cost by Detailed Subsystem, 2008–2013 ($)
Table: Worldwide Weighted Average Mobile Phone Semiconductor BOM Cost by Detailed Subsystem, 2008–2013 ($)
Table: Worldwide Cellular Air Interface Standards
Table: Exchange Rates, 2003–2008 (%)
Figure: Worldwide Mobile Phone Semiconductor Revenue by Air Interface Standard, 2008–2013
Figure: Worldwide Mobile Phone Semiconductor Revenue Share by Region, 2009 and 2013
Figure: Worldwide Weighted Average Mobile Phone Semiconductor BOM Cost by Air Interface Standard, 2008–2013
Figure: Worldwide Mobile Phone Memory Share by Memory Type, 2008–2013
Figure: Worldwide Mobile Phone Semiconductor Revenue by Selected Connectivity Type, 2008–2013
Figure: Worldwide Mobile Phone Semiconductor Revenue, 2005–2013: Comparison of December 2008 and October 2009 Forecasts

Abstract

This IDC study includes market forecast data and analysis on a worldwide basis for the mobile phone semiconductor market for 2009 through 2013. This document provides segmentation by various air interface standards in 2G, 2.5G, 3G, 3.5G, and 4G technologies; major semiconductor device type; and geographic region. It also provides comprehensive data on semiconductor BOM costs by air interface standard and component subsystem. Further detail is provided by component for each air interface. Key forecast assumptions are identified, and their potential impact on the mobile phone semiconductor market is discussed. A comparison of the current forecast with the prior forecast is also noted.

"Worldwide mobile phone semiconductor revenue is expected to drop by 12.4% this year to $39.3 billion in response to the sharp global economic slowdown over the last year. We expect consumers to gradually return to their past replacement cycles through 2010 and 2011 to help rebuild industry revenue, although 2008 levels will not be retraced until after 2013." — Flint Pulskamp, analyst, Wireless/Mobile Semiconductors

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