IPD 2009 - Integrated Passive & Active devices

Published by: Yole Developpement

Published: Jul. 1, 2009 - 630 Pages

Table of Contents

1. Introduction, definitions & scope of the report

Overview of discrete versus integrated passives solutions

Integrated active and passives structures definitions (inductor, capacitor, resistors, diodes, combinations…)

Comparison between thin film / thick film IPD technologies (including ceramic LTCC)

2. Thin film IPD applications and market drivers

IPD categories (ESD/EMI protection IPD, high brightness LED silicon submount, RF IPD, Digital & Mixed Signal IPD)

IPD current and future applications

IPD benefits and market drivers description for each IPD category and application

3. Thin film IPD Market status and 2008-2015 forecasts

IPD market forecasts are provided both in M$, Munits and in wafer eq. with attached growth rates

Volume shipments for IPD per applications (cell-phone, mp3 players, medical, automotive…)

IPD shipments per category (ESD/EMI protection, LED silicon submount, RF IPDs, Digital & Mixed signal IPDs)

Specific applicative breakdown and forecasted evolution for each category

IPD shipments per substrate type (Silicon, Glass, GaAs, SOI…) and wafer size (4” / 6” / 8” / 12”)

IPD shipments per integration choice (discrete, Above IC, SiP package…)

IPD shipments per packaging platform (WLP, Wire bond, Flip-chip, Embedded, Silicon submount, 3D TSV interposer, Fan-Out plastic laminate…

IPD player market shares and revenues

“Top 15” IPD players 2008 revenues

Overall players market shares based on 2008 IPD revenues

Specific market share breakdown for ESD/EMI protection IPD applications

- Specific market share breakdown for RF IPD applications

4. Thin film IPD technologies

IPD components requirements and technology options

Performance and integration capabilities

Inductors (multilayer planar inductors, 3D inductors…)

Capacitors (planar versus trench geometries, SiO2 versus SiN versus BST versus PZT capacitors…)

Others structures (resistors, diodes…)

IPD Manufacturing challenges and related equipment & material tool-box

Substrate choice technology comparisons: high resistivity Silicon / Glass / SOI / GaAs / Plastic laminate

Dielectric layers options (low k / high k)

Available photoresists, oxide and other layer solutions, impact of layer thickness

Metallic layers formation (Al, Copper, Gold…)

Process options (line width, multiple layer IPDs, lithographic versus non lithographic patterning, advanced depositions…)

IPD Design, Simulation and predictability through system level co-design

5. Thin film IPD architectures, assembly & packaging

Integration, packaging and assembly platforms options for IPDs

Through silicon Via manufacturing: a necessary step to reach the 3rd dimension

Fan-Out Wafer level packaging and embedded die concepts

Overall IPD Technology roadmap

6. Thin film IPD Supply chain & Players

Geographical mapping of different players

Business models analysis for IPD (speciality foundries, Integrated Device Manufacturers, Turnkey packaging providers, module makers, fabless & end integrators)

Summary of IPD players capabilities (manufacturing, design/library, packaging & assembly…)

Present and future challenges ahead for successful commercialization of IPDs

7. Conclusions & Perspectives

8. "Top 30" COMPANY PROFILES

APM / UMC, ASE, AVX / Kyocera, CMD, Flip-Chip International, Fujikura, IBM, IMEC, Infineon, ipdia, ITRI, KST-World, Leti, LG Innotek, Murata / Sychip, NXP, OnChip Devices, On Semiconductor, Replisaurus, Shinko, Silex Microsystems, STATS ChipPAC, STMicroelectronics, Telephus / SEMCO, Touch Microsystems Technology and more...

Abstract

From a commodity technology initially developed to replace bulky discrete passive components, thin-film Integrated Passive Devices (IPD’s) are now a growing industry trend driven by RF, High Brightness LEDs, Digital & Mixed Signal applications.

Yole’s new research study on Thin-film Integrated Passive and Active devices estimates the total IPD market to grow from more than $600M this year to over $1B by 2013. Whether it is to reduce space on the application board, to enhance performance or to reduce cost at the system level, IPD’s are spreading to most electronic sectors, from low volume to mass market businesses in aerospace, military, medical, industrial, lighting, communications, and PC applications.

Over the past few years, IPD’s have become an essential enabler of System-in-Packages (SiP) realizations. Looking to tomorrow, IPD’s are paving the way to the bright future of the “More than Moore” heterogeneous integration as they contribute greatly to bridging the increasing gap between the evershrinking geometries of CMOS IC’s and the lagging packaging technologies. IPD’s enable the assembly of increasingly complete and autonomous systems with the integration of diverse electronic functions such as sensors, RF transceivers, MEMS, power amplifiers, power management units and digital processors.

At the frontier between the back-end and the front-end of the semiconductor industry, Thin-film IPD’s are poised to extend the use of Wafer-Level Packaging (WLP) and Through silicon Via (TSV) technology platforms to many IC package solutions as well as to the discrete passive component industry. Being a “bridge platform”, IPD’s involve the complete semiconductor value chain: equipment; material providers; fabless semiconductor players; integrated device manufacturers; CMOS foundries; MEMS players; substrate suppliers; and OSAT industry, are all concerned by the need to increase their value proposition in the future through the extensive integration of thin film integrated passive and active devices. In this report, you will find comprehensive links between the different IPD technologies and each of their applications. Market share, supply value chain and strategies of the current major players and those looking at entering this business have been identified.

IPD technology trends, manufacturing options and challenges to be addressed are discussed and detailed. Finally, a complete market segmentation for the commercialization of IPD’s is proposed.Market forecasts and attached growth rates for each segment are provided for 2008-2015.

KEY FEATURES OF THE STUDY

• Four application fields investigated (ESD/EMI protection, HB-LED silicon submounts, RF and Digital & Mixed signal IPD)
• Market trends and figures provided both in M$, Munits and wafer size equivalent
• Complete technologies and material tool-box analysis
• 30 detailed company profiles of key IPD players
• 320+ pages

- Each market sub-segment is exhaustively detailed with:

• Drivers and benefits of IPDs
• Sub-segment size and expected growth rate
• Value chain analysis
• Global market evaluation per application: volume in units, wafers, and market size ($).
• Evaluation of the major market players (market share)

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