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Thermal Management Technologies (Heat Sinks)

Published by: Global Industry Analysts

Published: Jul. 1, 2009 - 678 Pages


Table of Contents


I.INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

Study Reliability and Reporting Limitations

Disclaimers

Data Interpretation & Reporting Level

Quantitative Techniques & Analytics

Product Definitions and Scope of Study

Metal Extruded Heat Sinks

Stamped Heat Sinks

Bonded or Fabricated Fin Heat sinks

Folded fin Heat Sinks

Computers

Telecommunication

Medical

Industrial Electronics

Aerospace/Military

Consumer Electronics

Automotive

II. EXECUTIVE SUMMARY

1.INDUSTRY OVERVIEW

Thermal Management - A Critical Function

Global Thermal Management Solutions Market: AnOverview

Heat Sinks - Market Outlook

Heat Sinks Market Estimates and Forecasts by Region

Heat Sinks Market Estimates and Forecasts byProduct Segment

Heat Sinks Market Estimates and Forecasts byEnd-use Segment

2.MARKET TRENDS AND ISSUES

Technological Advancements Drive Growth in Heatsink Market

PC Market Stimulates Growth

Pricing Trends in the Heat sinks Market

Hybrid Technologies Gaining Popularity Over TraditionalHeat Sinks

Polymers: The Future in Heat Sink Technology

Liquid Cooling: The Next Big Thing in ThermalTechnology

3.INNOVATIONS IN HEAT SINK TECHNOLOGY

New Aluminum Silicon Carbide (AlSiC) Heat Sinks

Heat sink System for Circuit Boards

Heat Sink BGA Package

New Mounting Assembly for Heat Sink

Dual Material Heat Sinks

New Heat Sink, Interfacing Multiple Components

Heat Sinks with Fins

New Fastening Structure Method For Heat Sinks

New Heat Sink Attached to the Module with Adhesive

New Method to Set Up Posts on Heat Sinks

New Heat Sink System for Circuit Boards Developed

New Bi-level Heat Sinks

New Ceramic-based Heat Sink

Heat Sink Attached to Two Separate PCBs

New Heat Sink Bonds with Dielectric Material

4.PRODUCT OVERVIEW

Heat Sinks

Composition and Structure of a Heat Sink:

Comparison between Aluminum and Copper by PhysicalParameters - Thermal Conductivity, Cost, Weight,Production Method and Pressure on mounting devise

Usage Criteria for a Heat sink

Necessity of a Heat Sink:

Characteristics of an Ideal Heat Sink

Measuring and Boosting the Thermal Performance ofa Heat Sink

Classification of Heat Sinks

Active Heat Sink

Characteristics of an active Heat Sink

Passive Heat Sink

Extruded Heat Sinks

Stamped Heat sinks

Bonded or Fabricated Fins

Folded Fins

Castings

Comparing Active and Passive Heat Sinks

5.END USE APPLICATIONS OF HEAT SINKS

Computers

Telecommunication

Medical

Industrial Electronics

Aerospace/Military

Consumer Electronics

Automotive

6.THERMAL MANAGEMENT PRODUCTS - CLASSIFICATION

Hardware

Heat Pipes

Micro Channels

Spray Cooling

Electronic Cooling Fans

Metal Backplanes

BGAs

Table 1: Leading Players in the Worldwide Thermal Management Hardware Market (2006 & 2007) - Percentage Share Breakdown by Value Sales forAavid Thermalloy, Thermacore, Lytron, and Others(includes corresponding Graph/Chart)

Software

Computational Methods of Heat Transfer (CHT) andFluid Dynamics (CFD)

Electronic Design Automation (EDA) Software,Electronic Computer Aided Design (ECAD) Software,and Technology Computer Aided Design (TCAD)Software

Interfaces and Substrates

Thermal Compounds and Thermal Interface Materials

7.RECENT INDUSTRY ACTIVITY

Thermacore Awarded Research Contract by DARPA(US)

Celsia Technologies Inks Strategic Deal withThermapower (Taiwan)

Modine to Shut Down Pemberville and OtherManufacturing Unit (USA)

Modine Sells Thermacore (USA)

Furukawa America to Merge with Furukawa Electric (USA)

Alexandria Extrusion Takes Over M&M Metals (USA)

Waytronx Takes Over CUI (USA)

Avnet Electronics Enters into Agreement withNuventix (America)

Graphics Product and Celsia Form Partnership (US)

Modine Sets up Production Unit (India)

Wakefield Acquires Simon Industries (NA)

Celsia Launches Next Generation NanoSpreader (USA)

ATS Launched the New Star™ Series Heat Sinks (USA)

New Improved Heat Sinks from Hitachi (Japan)

Honeywell to Extend Its Research and DevelopmentCenter (USA)

Vette Corp. Forms Allies with Asia Aluminum (China)

OnScreen Inks a Licensing and Royalty Deal withThermaltake Technologies (Taiwan)

ONSC Inks a Licensing Deal with CUI (US)

Modine to Construct Second Facility (Hungary)

Onscreen Technologies Revamps Business Strategy (US)

Digi-Key Inks Global Distribution Agreement with ATS

Mouser Signs Distribution Agreement with ComairRotron (US)

Laird Expands Distribution Agreement with Sager (US)

Denki Kagaku Plans Capacity Expansion for CeramicHeat Sinks (Japan)

Vette Corp Announces Production Expansion (North America)

ANSYS, Inc to acquire Aavid Thermal Technologies (US)

Celsia Technologies Enters Into a Collaboration Yeh-Chiang Technology (Taiwan)

CPS Enters Into Partnership with DiamondTechnologies (US)

Vette Takes Over ERM Thermal Technologies (USA)

Celsia Technologies Sign Strategic Contract with KuboKinzoku (Japan)

OnScreen™ Acquires Proprietary Rights forWayCool™ (US)

iCurie Re-named as Celsia Technologies (US)

AET Receives Approval on HS-400 Heat Sink Design (US)

Thermal Solutions Acquires Woven Electronics (USA)

Laird Announces Acquisition of Supercool (Sweden)

Intel Acquires 5% Stake in Neng Tyi (Taiwan)

Modine Acquires Radiadores (Brazil)

Celsia Unveils Web Portal

AET’s eGRAF® HS-400 Heat Sinks to Featurein LS/X Supercomputer (USA)

Vette Announces New BGA Thermal Solutionsfor Integrated Circuits (US)

Vette Acquires EUMAX (China)

Wakefield Extends Bonded Fin Heat Sink Line (US)

Wakefield Expands DC/DC Converter HeatSink Line (US)

8.HEAT SINKS AND RELATED PRODUCT LAUNCHES AND DEVELOPMENTS

Thermalright Unveils T-RAD2 (US)

Alpha Launches FS/FSR Series Active Heat Sinks (Japan)

Alpha Unveils Heat Sinks with 3.45mm AttachmentHoles (Japan)

Alpha Releases New Push Pin Tabs Integrated HeatSinks (Japan)

Alpha Launches Low Profile LPD Series HeatSinks (Japan)

Alpha Unveils Heat Sinks with Incorporated AttachmentTabs (Japan)

Alpha Releases UB13070 Heat Sink (Japan)

Alpha Expands LPD Series Heat Sinkswith LPD90 (Japan)

ASUS Expands Triton Family with New Triton 81 CPUCoolers (Taiwan)

Vantec Unveils New AeroFlow FX Series CPUCoolers (US)

Thermalright Launches HR-09 Type 4 MosfetCooler (US)

Thermalright Rolls Out TRUE Copper (US)

Spire Announced Plans to Launch New ThermaxCooling Solutions (US)

ATS Offers Two New Heat Sinks for BGA Packages(US)

ATS Launches ATS-552 Heat Sink Cooling Solutionfor Freescale Processors (US)

ATS Offers New Heat Sink Cooling Solutions for LinearLED Lighting Products (US)

Ohmite Offers Heat Sinks to Combat OvertorqueIssues (US)

ASUS Launches Silent Cooling Solutions (Taiwan)

Alpha Replaces SB Series Heat Sinks with LT Series HeatSinks (Japan)

Alpha Launches ST Series Heat Sinks (Japan)

Thermalright Launches HR-03 GT VGA Cooler (US)

Thermalright Announces Availability of HR-03 PlusVGA Cooler (US)

Thermalright Unveils HR-07 Duo Ram Cooler (US)

Thermalright Launches HR-01 X CPU Cooler (US)

Thermalright Launches HR-11 Backside Cooler (US)

Thermalright Rolls Out IFX-14 CPU Cooler (US)

Thermalright Unveils HR-09 Mosfet Cooler (US)

ATS Rolls out maxiFLOW Heat Sinks (US)

ATS’s maxiGRIP™ Clears Stringent MilitaryTesting (US)

ATS Offers Passive and Active Heat Sinks forFreescale’s Processors (US)

MEC International to Offer Heat sinks From Seifert (UK)

New Heatsink from Advanced Thermal for BGAComponents (US)

Tyco Launches CardBus Connector TechnologyIntegrated Heatsink (US)

Schaffner Expands Product Line with SeifertElectronics Products (Switzerland)

ATS Unveils New Thermal Management Design Kit (US)

Andigilog® Unveils New Thermal ManagementSystem Controllers (US)

THERMALTAKE Presents Two Turion CPUCoolers (US)

GlacialTech Rolls Out Igloo 7210 M CPU Coolers (US)

ATS Launches HFC-100™ Heat Flux Controller (US)

ATS Offers Online Tutorials for ThermalManagement (US)

Cooler Master Unveils New Hyper Z600 CPU Cooler(Taiwan)

Advanced Thermal Solutions (ATS) Launches NewThree Devices (US)

Emulation Technology Launches Heat Sinks withElliptical Fin BGA Chipset (US)

Advanced Thermal Solutions Launches blackDIAMONDHeat Sink (US)

9.FOCUS ON SELECT GLOBAL PLAYERS

Aavid Thermalloy, LLC (USA)

Aerocool Advanced Technologies Corp. (Taiwan)

ADDA Corp. (Taiwan)

Advanced Thermal Solutions, Inc. (USA)

Ajigo Corp. (USA)

Akasa Group (UK)

Alpha Company Ltd. (Japan)

Asia Vital Components Co. Ltd. (Taiwan)

ASUSTeK Computer Inc. (Taiwan)

Chaun Choung Technology Corp. (Taiwan)

Cooler Master Co. Ltd. (Taiwan)

Dynatron Corp. (USA)

Enertron Inc. (USA)

GlacialTech, Inc. (Taiwan)

JMC Products, Inc. (USA)

Melcor Corp. (USA)

Neng Tyi Co. Ltd (Taiwan)

Polo Tech Co. Ltd. (Taiwan)

R-Theta Thermal Solutions, Inc. (Canada)

Radian Heat Sinks (US)

Sumitomo Electric Industries, Ltd. (Japan)

Swiftech (US)

Taisol Electronics Co. Ltd. (China)

TennMax United (USA)

Thermal Integration Technology, Inc (Taiwan)

Thermacore (USA)

Thermalright, Inc. (USA)

Thermaltake Technology Co., Ltd (Taiwan)

Titan Computer Co. Ltd (Taiwan)

Verax Ventilatoren GmbH (Germany)

Vette Corp. (USA)

Wakefield Thermal Solutions, Inc. (US)

10.GLOBAL MARKET PERSPECTIVE

Table 2: World Recent Past, Current & Future Analysisfor Heat Sinks Market by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Millionfor Years 2006 through 2015 (includes corresponding Graph/Chart)



Table 3: World 10-year Perspective for Heat Sinks Marketby Geographic Region - Percentage Share of Dollar Salesfor North America, Japan, Europe, Asia-Pacific andRest of World for 2006, 2009, and 2015 (includescorresponding Graph/Chart)

Analysis by Product Segment

Table 4: World Recent Past, Current & Future Analysis forMetal Extruded Heat Sinks Market by Geographic Region -US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Salesin US$ Million for Years 2006 through 2015(includes corresponding Graph/Chart)



Table 5: World 10-year Perspective for Metal Extruded Heat Sinks Market by Geographic Region - Percentage Share Breakdown of Dollar Sales for North America, Japan, Europe,Asia-Pacific and Rest of World for 2006, 2009, and 2015(includes corresponding Graph/Chart)



Table 6: World Recent Past, Current & Future Analysis for Stamped Heat Sinks Market by Geographic Region - US,Canada, Japan, Europe, Asia-Pacific and Rest of WorldMarkets Independently Analyzed with Annual Salesin US$ Million for Years 2006 through 2015(includes corresponding Graph/Chart)



Table 7: World 10-year Perspective for Stamped Heat Sinks Market by Geographic Region - Percentage Share Breakdown of Dollar Sales for North America, Japan,Europe, Asia-Pacific and Rest of World for 2006, 2009,and 2015 (includes corresponding Graph/Chart)



Table 8: World Recent Past, Current & Future Analysis for Bonded Fins Heat Sinks Market by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Salesin US$ Million for Years 2006 through 2015(includes corresponding Graph/Chart)



Table 9: World 10-year Perspective for Bonded Fins Heat Sinks Market by Geographic Region - Percentage Share Breakdown of Dollar Sales for North America, Japan,Europe, Asia-Pacific and Rest of World for 2006, 2009,and 2015 2015 (includes corresponding Graph/Chart)



Table 10: World Recent Past, Current & Future Analysis for Folded Fins Heat Sinks Market by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific and Rest of WorldMarkets Independently Analyzed with Annual Salesin US$ Million for Years 2006 through 2015(includes corresponding Graph/Chart)



Table 11: World 10-year Perspective for Folded Fins HeatSinks Market by Geographic Region - Percentage Share Breakdown of Dollar Sales for North America, Japan,Europe, Asia-Pacific and Rest of World for 2006, 2009,and 2015 2015 (includes corresponding Graph/Chart)

Analysis By End-Use Market

Table 12: World Recent Past, Current & Future Analysisfor Heat Sinks in Computers Sector by Geographic Region -US, Canada, Japan, Europe, Asia-Pacific and Rest ofWorld Markets Independently Analyzed with Annual Salesin US$ Million for Years 2006 through 2015(includes corresponding Graph/Chart)



Table 13: World 10-year Perspective for Heat Sinks inComputers Sector by Geographic Region - PercentageShare of Dollar Sales for US, Canada, Japan, Europe,Asia-Pacific and Rest of World Markets for 2006,2009 & 2015 (includes corresponding Graph/Chart)



Table 14: World Recent Past, Current & Future Analysisfor Heat Sinks in Telecom Sector by Geographic Region -US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzedwith Annual Sales in US$ Million for Years2006 through 2015 (includes correspondingGraph/Chart)



Table 15: World 10-year Perspective for Heat Sinks inTelecom Sector by Geographic Region - Percentage Shareof Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets for 2006, 2009 &2015 (includes corresponding Graph/Chart)



Table 16: World Recent Past, Current & Future Analysisfor Heat Sinks in Consumer Electronics Sector byGeographic Region - US, Canada, Japan, Europe,Asia- Pacific and Rest of World Markets IndependentlyAnalyzed with Annual Sales in US$ Million forYears 2006 through 2015 (includes correspondingGraph/Chart)



Table 17: World 10-year Perspective for Heat Sinks in Consumer Electronics Sector by Geographic Region - Percentage Share of Dollar Sales for US, Canada,Japan, Europe, Asia-Pacific and Rest of WorldMarkets for 2006, 2009 & 2015 (includescorresponding Graph/Chart)



Table 18: World Recent Past, Current & Future Analysisfor Heat Sinks in Medical Electronics and Office Equipment Sectors by Geographic Region - US, Canada, Japan,Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years2006 through 2015 (includes correspondingGraph/Chart)



Table 19: World 10-year Perspective for Heat Sinks inMedical and Office Equipment Sectors by GeographicRegion - Percentage Share of Dollar Sales for US,Canada, Japan, Europe, Asia-Pacific and Rest of WorldMarkets for 2006, 2009 & 2015 (includescorresponding Graph/Chart)



Table 20: World Recent Past, Current & Future Analysisfor Heat Sinks in Industrial and Military Sector byGeographic Region - US, Canada, Japan, Europe,Asia-Pacific and Rest of World Markets IndependentlyAnalyzed with Annual Sales in US$ Million forYears 2006 through 2015 (includes correspondingGraph/Chart)



Table 21: World 10-year Perspective for Heat Sinks inIndustrial and Military Sector by Geographic Region -Percentage Share of Dollar Sales for US, Canada,Japan, Europe, Asia-Pacific and Rest of World Marketsfor 2006, 2009 & 2015 (includes correspondingGraph/Chart)



Table 22: World Recent Past, Current & Future Analysisfor Heat Sinks in Automotive Sector by Geographic Region -US, Canada, Japan, Europe, Asia-Pacific and Rest ofWorld Markets Independently Analyzed with AnnualSales in US$ Million for Years 2006 through 2015(includes corresponding Graph/Chart)



Table 23: World 10-year Perspective for Heat Sinks inAutomotive Sector by Geographic Region - PercentageShare of Dollar Sales for US, Canada, Japan, Europe,Asia-Pacific and Rest of World Markets for 2006, 2009 &2015 (includes corresponding Graph/Chart)

III. MARKET

1.THE UNITED STATES

A. Market Analysis

Market Overview

Product Innovations

Product Launches/Developments

Strategic Corporate Developments

Select Players

Aavid Thermalloy, LLC (USA)

Advanced Thermal Solutions, Inc. (USA)

Ajigo Corp. (USA)

CTS Corp. (USA)

Cool Innovations, Inc. (USA)

Dynatron Corp. (USA)

Enertron, Inc. (USA)

JMC Products, Inc. (USA)

Melcor Corp. (USA)

Radian Heat sinks (US)

Swiftech (US)

Tennmax United (USA)

Thermacore (USA)

Thermalright, Inc. (USA)

United Thermal Engineering Corp. (USA)

Vantec Thermal Technologies, Inc. (US)

Vette Corp. (USA)

Wakefield Thermal Solutions, Inc. (US)

B. Market Analytics

Table 24: US Recent Past, Current & Future Analysisfor Heat Sinks Market by Product Segment - MetalExtruded, Stamped, Bonded Fin, and Folded Fin HeatSinks Markets Independently Analyzed with AnnualSales in US$ Million for Years 2006 through 2015(includes corresponding Graph/Chart)



Table 25: US 10-year Perspective for Heat Sinks Market by Product Segment - Percentage Share Breakdown of Dollar Sales for Metal Extruded, Stamped, Bonded Fin, andFolded Fin Heat Sinks for 2006, 2009, and 2015(includes corresponding Graph/Chart)



Table 26: US Recent Past, Current & Future Analysis for Heat Sinks by End-Use Sector - Computers, Telecom, Consumer Electronics, Medical and Office Equipment, Industrial and Military, and Automotive MarketsIndependently Analyzed with Annual Sales Figuresin US$ Million for Years 2006 through 2015(includes corresponding Graph/Chart)



Table 27: US 10-Year Perspective for Heat Sinks byEnd-Use Sector: Percentage Share Breakdown ofDollar Sales for Computers, Telecom, ConsumerElectronics, Medical and Office Equipment,Industrial and Military and AutomotiveMarkets for 2006, 2009 & 2015 (includescorresponding Graph/Chart)

2.CANADA

A. Market Analysis

Current and Future Analysis

Select Player

B. Market Analytics

Table 28: Canadian Recent Past, Current & FutureAnalysis for Heat Sinks Market by Product Segment -Metal Extruded, Stamped, Bonded Fin, and FoldedFin Heat Sinks Markets Independently Analyzed withAnnual Sales in US$ Million for Years 2006 through2015 (includes corresponding Graph/Chart)



Table 29: Canadian 10-year Perspective for Thermal Management Heat Sinks Market by Product Segment - Percentage Share Breakdown of Dollar Sales for MetalExtruded, Stamped, Bonded Fin, and Folded FinHeat Sinks for 2006, 2009, and 2015 (includescorresponding Graph/Chart)



Table 30: Canadian Recent Past, Current & FutureAnalysis for Heat Sinks by End-Use Sector - Computers, Telecom, Consumer Electronics, Medical/OfficeEquipment, Industrial and Military, and AutomotiveMarkets Independently Analyzed with Annual SalesFigures in US$ Million for Years 2006 through2015 (includes corresponding Graph/Chart)



Table 31: Canadian 10-Year Perspective for HeatSinks by End-Use Sector: Percentage ShareBreakdown of Dollar Sales for Computers,Telecom, Consumer Electronics, Medical and Office Equipment, Industrial/ Military, andAutomotive Markets for 2006, 2009 & 2015(includes corresponding Graph/Chart)

3.JAPAN

A. Market Analysis

Current and Future Analysis

Product Innovations

Strategic Corporate Developments

Select Players

Alpha Company Ltd. (Japan)

Sumitomo Electric Industries, Ltd. (Japan)

B. Market Analytics

Table 32: Japanese Recent Past, Current & FutureAnalysis for Thermal Management Heat sinks Marketby Product Segment - Metal Extruded, Stamped,Bonded Fin, and Folded Fin Heat Sinks Markets Independently Analyzed with Annual Sales in US$Million for Years 2006 through 2015 (includescorresponding Graph/Chart)



Table 33: Japanese 10-year Perspective for Heat Sinks Market by Product Segment - Percentage Share Breakdown of Dollar Sales for Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks for 2006, 2009, and 2015 (includes corresponding Graph/Chart)



Table 34: Japanese Recent Past, Current & FutureAnalysis for Heat Sinks by End-Use Sector - Computers, Telecom, Consumer Electronics, Medical/OfficeEquipment, Industrial and Military, and AutomotiveMarkets Independently Analyzed with Annual SalesFigures in US$ Million for Years 2006 through 2015(includes corresponding Graph/Chart)



Table 35: Japanese 10-Year Perspective for Heat Sinks by End-Use Segment - Percentage Share Breakdown of Dollar Sales for Computers, Telecom, Consumer Electronics, Medical and Office Equipment, Industrial and Military, and Automotive Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart)

4.EUROPE

A. Market Analysis

Current and Future Analysis

Product Launches/Developments

Strategic Corporate Developments

Select Players

Akasa Group (UK)

Verax Ventilatoren GmbH (Germany)

B. Market Analytics

Table 36: European Recent Past, Current & FutureAnalysis for Heat Sinks Market by Product Segment -Metal Extruded, Stamped, Bonded Fin, and FoldedFin Heat Sinks Markets Independently Analyzed withAnnual Sales in US$ Million for Years 2006 through2015 (includes corresponding Graph/Chart)



Table 37: European 10-year Perspective for HeatSinks Market by Product Segment - Percentage ShareBreakdown of Dollar Sales for Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks for 2006,2009, and 2015 (includes correspondingGraph/Chart)



Table 38: European Recent Past, Current & FutureAnalysis for Heat Sinks by End-Use Sector - Computers, Telecom, Consumer Electronics, Medical/OfficeEquipment, Industrial and Military, and AutomotiveMarkets Independently Analyzed with Annual SalesFigures in US$ Million for Years 2006 through2015 (includes corresponding Graph/Chart)



Table 39: European 10-Year Perspective for HeatSinks by End-Use Sector: Percentage ShareBreakdown of Dollar Sales for Computers, Telecom, Consumer Electronics, Medical and Office Equipment, Industrial/ Military, and AutomotiveMarkets for 2006, 2009 & 2015 (includescorresponding Graph/Chart)

5.ASIA PACIFIC

A. Market Analysis

Current and Future Analysis

Mainland China Heat Sinks Market

Taiwan Market Scenario

Product Innovations

Product Launches/Developments

Strategic Corporate Developments

Select Players

Act-Rx Technology Corp. (Taiwan)

Aerocool Advanced Technologies Corp. (Taiwan)

ADDA Corp. (Taiwan)

Arkua Technology Co., Ltd (Taiwan)

Asia Vital Components Co. Ltd. (Taiwan)

ASUSTeK Computer, Inc. (Taiwan)

Chaun Choung Technology Corp. (Taiwan)

Cooler Master Co. Ltd. (Taiwan)

EVERCOOL Thermal Co., Ltd. (Taiwan)

GlacialTech, Inc. (Taiwan)

Kuang Thousand Technology Co., Ltd. (Taiwan)

Neng Tyi Co. Ltd (Taiwan)

Polo Tech Co. Ltd (Taiwan)

Taisol Electronics Co. Ltd. (China)

Thermal Integration Technology, Inc (Taiwan)

Thermaltake Technology Co., Ltd (Taiwan)

Titan Computer Co. Ltd. (Taiwan)

B. Market Analytics

Table 40: Asia Pacific Recent Past, Current & Future Analysis for Heat Sinks Market by Product Segment -Metal Extruded, Stamped, Bonded Fin, and FoldedFin Heat Sinks Markets Independently Analyzed withAnnual Sales in US$ Million for Years 2006 through2015 (includes corresponding Graph/Chart)



Table 41: Asia Pacific 10-year Perspective for HeatSinks Market by Product Segment - Percentage Share Breakdown of Dollar Sales for Metal Extruded,Stamped, Bonded Fin, and Folded Fin Heat Sinksfor 2006, 2009, and 2015 (includescorresponding Graph/Chart)



Table 42: Asia Pacific Recent Past, Current & Future Analysis for Heat Sinks by End-Use Sector - Computers, Telecom, Consumer Electronics, Medical/OfficeEquipment, Industrial and Military, and AutomotiveMarkets Independently Analyzed with Annual SalesFigures in US$ Million for Years 2006 through2015 (includes corresponding Graph/Chart)



Table 43: Asia Pacific 10-Year Perspective forHeat Sinks by End-Use Sector: PercentageShare Breakdown of Dollar Sales for Computers, Telecom, Consumer Electronics, Medical and Office Equipment, Industrial/ Military, andAutomotive Markets for 2006, 2009 & 2015(includes corresponding Graph/Chart)

6.REST OF WORLD

A. Market Analysis

Current and Future Analysis

Strategic Corporate Developments

B. Market Analytics

Table 44: Rest of World Recent Past, Current & Future Analysis for Heat Sinks Market by Product Segment -Metal Extruded, Stamped, Bonded Fin, and FoldedFin Heat Sinks Markets Independently Analyzedwith Annual Sales in US$ Million for Years 2006through 2015 (includes correspondingGraph/Chart)



Table 45: Rest of World 10-year Perspective forHeat Sinks Market by Product Segment - PercentageShare Breakdown of Dollar Sales for Metal Extruded, Stamped, Bonded Fin, and FoldedFin Heat Sinks for 2006, 2009, and2015 (includes corresponding Graph/Chart)



Table 46: Rest of World Recent Past, Current &Future Analysis for Heat Sinks by End-Use Sector - Computers, Telecom, Consumer Electronics,Medical/ Office Equipment, Industrial and Military,and Automotive Markets Independently Analyzedwith Annual Sales Figures in US$ Million forYears 2006 through 2015 (includescorresponding Graph/Chart)



Table 47: Rest of World 10-Year Perspective forHeat Sinks by End-Use Sector: Percentage ShareBreakdown of Dollar Sales for Computers,Telecom, Consumer Electronics, Medicaland Office Equipment, Industrial/ Military,and Automotive Markets for 2006, 2009 &2015 (includes correspondingGraph/Chart)

IV. COMPETITIVE LANDSCAPE

Total Companies Profiled:

Region/Country Players

The United States

Canada

Japan

Europe

France

Germany

The United Kingdom

Italy

Spain

Rest of Europe

Asia-Pacific (Excluding Japan)

Abstract

This report analyzes the worldwide markets for Thermal Management Technologies (Heat Sinks) in Millions of US$. The report on ‘Thermal Management Technologies (Heat Sinks)’ analyzes the Heat Sinks market by the following product segments: Metal Extruded Heat Sinks, Stamped Heat Sinks, Bonded or Fabricated Fin Heat Sinks, and Folded Fin Heat Sinks. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual forecasts are provided for each region for the period of 2006 through 2015. The report profiles 180 companies including many key and niche players worldwide such as Aavid Thermalloy, LLC, Aerocool Advanced Technologies Corp., ADDA Corp., Advanced Thermal Solutions, Inc., Ajigo Corp., Akasa Group, Alpha Company Ltd., Asia Vital Components Co. Ltd., ASUSTeK Computer Inc., Chaun Choung Technology Corp., Cooler Master Co. Ltd., Dynatron Corp., Enertron Inc., GlacialTech, Inc.. JMC Products, Inc., Melcor Corp., Neng Tyi Co. Ltd., Polo Tech Co. Ltd., R-Theta Thermal Solutions, Inc., Radian Heat Sinks, Sumitomo Electric Industries, Ltd., Swiftech, Taisol Electronics Co. Ltd., TennMax United, Thermal Integration Technology, Inc., Thermacore, Thermalright, Inc., Thermaltake Technology Co., Ltd., Titan Computer Co. Ltd., Verax Ventilatoren GmbH, Vette Corp., and Wakefield Thermal Solutions, Inc. Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.

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