Printed and Chipless RFID Forecasts, Technologies & Players 2009-2019

Published by: IDTechEx Ltd

Published: Apr. 1, 2009 - 280 Pages

Table of Contents

1. INTRODUCTION

1.1. Roadmap for RFID 2008-2018

1.2. What are printed and chipless RFID tags?

1.3. Why are they needed in supply chains?

1.3.1. Consumer Packaged Goods (CPG)

1.3.2. Pharmaceuticals

1.4. Where else will chipless RFID be needed?

1.4.1. Ubiquitous Sensor Networks

1.4.2. Self adjusting use by date

1.4.3. Assets

1.4.4. Laundry and rented garments

1.4.5. Books at manufacture

1.4.6. Postal items

1.4.7. Conveyances, logistics, traffic management

1.5. Silicon chips and EPCglobal

1.5.1. Shortcomings of silicon chip RFID

1.5.2. Shortcomings of Gen2 EPC - universality by tag complexity

1.5.3. Robustness of the layered approach backed by EPCglobal

1.5.4. Implications

1.6. Constraints on market growth

1.6.1. Impediments to highest volume RFID

1.7. Ultimate potential

1.7.1. Potential for different applications

1.7.2. Tag price sensitivity at highest volumes

1.7.3. Price sensitivity curve for RFID (adoption curve)

2. PRINTED AND CHIPLESS RFID TECHNOLOGIES

2.2. Comparison - first generation

2.3. Commercial successes

2.3.1. Acoustomagnetic tags - error prevention

2.3.2. SAW tags - X-CYTE, MicroDesign, iRay Technologies, Thoronics, CTR

2.4. HID Barkhausen cards - secure access

2.5. Lessons from the limited success or failure of other approaches

2.6. Electromagnetic - Flying Null, Link-Sure, Confirm Technologies, REMOSO, Holotag, Zebra Technologies, Scipher TSSI, MXT, Fuji Electric, Unitika

2.7. Swept RF LC array - Miyake, Lintec, CWOSRFID, Navitas, Checkpoint, Tagsense, RFCode

3. SECOND GENERATION CHIPLESS RFID - POTENTIALLY OPEN SYSTEMS

3.1. The main contenders compared

3.2. Electromagnetic conductive ink stripe RFID - Mreal, VTT, Panipol, ACREO, Somark Innovations, Menippos, Printed Systems

3.2.1. New ink stripe format

3.2.2. Potential advantages and disadvantages vs silicon

3.2.3. Market thrust

3.2.4. Technical development

3.2.5. The Somark Innovations product new in 2006

3.2.6. The Mreal/ VTT Technologies/ Panipol product

3.2.7. ACREO

3.2.8. Menippos and Printed Systems GmbH

3.3. Printed radar arrays, InkSure and Vubiq

3.3.1. Inksure

3.3.2. Vubiq

3.4. Surface Acoustic Wave - RFSAW, Thoronics

3.4.1. Potential advantages and disadvantages vs silicon

3.4.2. Market thrust

3.4.3. Technical development

3.4.4. SAW Standards EPCglobal

3.4.5. Companies seeking SAW open systems - RFSAW, IBM Global Services, Thoronics

3.4.6. IBM Global Services success in 2006/2007

3.4.7. RFID location with passive tags

3.4.8. Case study: Highway non-stop tolling USA - RFSAW

3.5. Thin Film Transistor Circuits (TFTCs)

3.6. Other

3.6.1. How to Eat RFID

3.7. Lowest cost antenna design

3.7.1. Choice of electrodes and interconnects

4. THIN FILM TRANSISTOR CIRCUITS (TFTCS)

4.1. Potential advantages and disadvantages vs silicon

4.1.1. TFTCs best suited for non-RFID applications in the short term?

4.1.2. A key limitation is frequency

4.1.3. Printed TFTC RFID cannot tackle UHF and microwave?

4.1.4. Low cost not guaranteed

4.2. Market thrust and technical progress

4.3. Opportunities for passive TFTC RFID labels

4.3.1. RFID printed directly on products and packaging

4.4. Opportunities for active TFTC RFID

4.5. TFTC value chain - companies change position

4.6. Technical development - geometry, carrier mobility, substrate

4.6.1. Transistor geometry or mobility?

4.6.2. The compromises in choosing substrates

4.7. Printed memory for RFID- HP, Ricoh, Matsushita, Thin Film Electronics, Motorola, Fuji Film and others

4.8. Thirty Three TFTC players compared - market thrust

EXECUTIVE SUMMARY AND CONCLUSIONS

1. INTRODUCTION

1.1. Roadmap for RFID 2009-2019

1.2. What are printed and chipless RFID tags?

1.3. Why are they needed in supply chains?

1.3.1. Consumer Packaged Goods (CPG)

1.3.2. Pharmaceuticals

1.4. Where else will chipless RFID be needed?

1.4.1. Ubiquitous Sensor Networks

1.4.2. Transit

1.4.3. Self adjusting use by date

1.4.4. Assets

1.4.5. Laundry and rented garments

1.4.6. Books at manufacture

1.4.7. Postal items

1.4.8. Conveyances, logistics, traffic management

1.5. Silicon chips and EPCglobal

1.5.1. Shortcomings of silicon chip RFID

1.5.2. Shortcomings of Gen2 EPC - universality by tag complexity

1.5.3. Robustness of the layered approach backed by EPCglobal

1.5.4. Implications

1.6. Constraints on market growth

1.6.1. Impediments to highest volume RFID

1.7. Ultimate potential

1.7.1. Potential for different applications

1.7.2. Tag price sensitivity at highest volumes

1.7.3. Price sensitivity curve for RFID (adoption curve)

2. PRINTED AND CHIPLESS RFID TECHNOLOGIES

2.2. Comparison - first generation

2.3. Commercial successes

2.3.1. Acoustomagnetic tags - error prevention

2.3.2. SAW tags - X-CYTE, MicroDesign, iRay Technologies, Thoronics, CTR

2.4. HID Barkhausen cards - secure access

2.5. Lessons from the limited success or failure of other approaches

2.6. Electromagnetic - Flying Null, Link-Sure, Confirm Technologies, REMOSO, Holotag, Zebra Technologies, Scipher TSSI, MXT, Fuji Electric, Unitika

2.7. Swept RF LC array - Miyake, Lintec, CWOSRFID, Navitas, Checkpoint, Tagsense, RFCode

3. SECOND GENERATION CHIPLESS RFID - POTENTIALLY OPEN SYSTEMS

3.1. The main contenders compared

3.2. Electromagnetic conductive ink stripe RFID - Mreal, VTT, Panipol, ACREO, Somark Innovations, Menippos, Printed Systems

3.2.1. New ink stripe format

3.2.2. Potential advantages and disadvantages vs silicon

3.2.3. Market thrust

3.2.4. Technical development

3.2.5. The Somark Innovations product

3.2.6. The Mreal/ VTT Technologies/ Panipol product

3.2.7. ACREO

3.2.8. Menippos

3.3. Printed radar arrays, InkSure, Nicanti and Vubiq

3.3.1. Inksure

3.3.2. Nicanti

3.3.3. Vubiq

3.4. Surface Acoustic Wave - RFSAW, Thoronics

3.4.1. Potential advantages and disadvantages vs silicon

3.4.2. Market thrust

3.4.3. Technical development

3.4.4. SAW Standards EPCglobal

3.4.5. Companies seeking SAW open systems - RFSAW, IBM Global Services, Thoronics

3.4.6. Case study: Highway non-stop tolling USA - RFSAW

3.4.7. Case study: SAW tags in space on the International Space Station

3.5. Thin Film Transistor Circuits (TFTCs)

3.6. Other

3.6.1. How to Eat RFID

3.7. Lowest cost antenna design

3.7.1. Choice of electrodes and interconnects

3.8. Inorganic conductors

3.8.2. Comparison of metal options

3.8.3. Polymer - metal suspensions

3.8.4. Silver solution

3.9. Progress with new conductive ink chemistries and cure processes

4. THIN FILM TRANSISTOR CIRCUITS (TFTCS)

4.1. Potential advantages and disadvantages vs silicon

4.2. Technical development - geometry, carrier mobility, substrate

4.2.1. Transistor geometry or mobility?

4.2.2. The compromises in choosing substrates

4.2.3. TFTCs best suited for non-RFID applications in the short term?

4.2.4. A key limitation is frequency

4.2.5. Low cost not guaranteed

4.3. Why TFTCs will be the biggest breakthrough in electronic smart packaging

4.4. Thin film silicon vs organics or inorganics

4.4.1. First came thin film silicon

4.4.2. Organic semiconductors - two choices

4.4.3. PolyIC developments

4.4.4. Dai Nippon Printing semiconductor development

4.4.5. OrganicID, Weyerhauser

4.4.6. Power conservation - CMOS

4.4.7. Progress towards flexible/biodegradable substrates for organic TFTs

4.4.8. Move to inorganic semiconductors

4.4.9. Kovio - inorganic semiconductors

4.4.10. Carbon Nanotubes

4.5. The main options for the printed semiconductor

4.5.2. Do organic transistors have a future?

4.5.3. RFID printed directly on products and packaging

4.6. Opportunities for active TFTC RFID

4.6.1. Company strategy and value chain

4.7. TFTC players compared

4.8. Printed memory for RFID- HP, Ricoh, Matsushita, Thin Film Electronics, Motorola, Fuji Film and others

5. DISPLAYS AND SENSORS FOR PRINTED RFID

5.1. Choice of displays

5.1.2. Thermochromic

5.1.3. Electrochromic

5.1.4. Electrophoretic

5.1.5. Applications of E-paper displays

5.2. Choice of sensors

6. MARKETS FOR CHIPLESS RFID 2009-2019

6.1. Historical sales of chipless tags

6.1.2. Cumulative sales chip vs chipless

6.2. Chipless share of RFID market by numbers 2009-2019

6.3. Chipless RFID by technology 2009-2019

6.4. Unit price trends by chipless technology 2009-2019

6.5. Chipless share of total RFID market value 2009-2019

6.6. Chipless vs chip share of total RFID market by value 2009-2019

6.7. RFID market by system component 2009-2019

6.8. RFID market by location of tag 2009-2019 and chipless targets

6.9. Move of markets to East Asia 2009, 2014, 2019

6.10. Market for EPC and other interrogators 2009-2019

6.11. Ultra low cost RFID labels - market size

6.12. RFID printed directly onto products and packaging - market size

6.13. Low cost active RFID - market size

6.14. Radiation tolerant RFID - market size

6.15. Fault tolerant RFID - market size

6.16. Ultra thin low cost RFID - market size

6.17. Real Time Locating Systems (RTLS) - market size

7. TIMELINES FOR PRINTED AND CHIPLESS/PRINTED RFID MARKET PENETRATION

7.1. Timelines for developments in second generation chipless RFID

7.2. Timeline for printed RFID

7.3. Timeline for printed organic electronics

7.4. Timeline for direct printing of chipless RFID onto products and packaging

8. SUPPLIER AND DEVELOPER PROFILES

8.1. 3M, USA

8.2. ACREO, Sweden

8.3. BASF

8.4. Dai Nippon Printing

8.5. IBM, USA

8.6. Inksure, Israel and USA

8.7. Kovio USA

8.8. M-real, Sweden

8.9. OrganicID, USA

8.10. Panipol, Finland

8.11. Philips

8.12. PolyIC, Germany

8.13. RFSAW, USA

8.14. Soligie

8.15. Toppan Forms

8.16. Toppan Printing

Abstract

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