Evolving High Speed Connectors : Market Research Report

Evolving High Speed Connectors

Published: Mar. 1, 2009

Chapter 1 - Report Scope And Methodology: Report Scope And Methodology; Methodology and Approach; Connector Manufacturer Survey; Users Survey
Chapter 2 - Introduction And Definitions: Preface; Introduction
Chapter 3 - High Speed Connector Basics: High Speed Connector Basics; Common Backplane Architecture; Midplane Architecture; Orthogonal Midplane Architecture; High-Speed Transmission Line Issues; Defining Features of High-Speed Interfaces; Connector Selection Criteria; Bandwidth Rating of Connectors; The Second Sourcing Imperative; Performance Measurement Systems; Test and Analysis Equipment; Comparison of Electrical Performance; Design Support Provided by Connector Manufacturers
Chapter 4 - The Need For Speed: The Need For Speed; Market Drivers to Higher Speed Interfaces; Speed Versus Density; The Influence of Industry Standards
Chapter 5 - High Speed Interconnect System Elements: High-Speed Interconnect System Elements; Driver and Receiver Technology; Printed Circuit Board Materials; Printed Circuit Board Design and Fabrication
Chapter 6 - High-Speed Connector And Market Trends, 2006-2008: High-Speed Connector And Market Trends 2006-2008; High-Speed Backplane Connector Families
Chapter 7 - Overview Of Current High-Speed Backplane / Midplane: Connectors; Overview Of Current High-Speed Backplane / Midplane Connectors; Amphenol TCS; VHDM, VHDM-HSD, VHDM H-Series, e-HSD, GbX, Ventura, Aptera,; Crossbow, XCede, VIPER; ERNI Components; ERmetZD, ERmet zero XT and ERmetZD plus; FCI Electronics; Metral 4000®, AirMax VS®, ZipLine™; 3M Electronic Solutions Division; HSHM, UHM; Molex; VHDM / VHDM-HSD, GbX, GbX I-Trac, Impact, EdgeLine; Tyco Electronics; Z-Pack HS3, Z-PACK™ HM-Zd, Z-PACK™ HM-Zd+,; TinMan, TinMan+ MultiGig RT, Z-Pack Slim UHD, STRADA; Whisper
Chapter 8 - High-Speed Copper Connector And Cable: Assemblies; High-Speed Copper Cable Connectors And Assemblies; Bringing Cable To The Backplane; Cable Assembly Construction; High-Speed Cable Assembly Types; Typical Applications
Chapter 9 - Overview Of Selected High-Speed Copper: Backplane Cable Assembly Suppliers; Overview Of Selected High-Speed Backplane Cable Assembly; Suppliers; W.L. Gore & Associates; Meritec; Molex; Samtec; Sanmina-SCI; Carlisle Interconnect Technologies; FCI Electronics; Tyco Electronics; Amphenol InterCon Systems; 3M Electro Communications Business Group; LEONI
Chapter 10 - Backplane And Cable Connector Design Feature: Charts; Backplane And Cable Connector Design Feature; Introduction; Backplane Connector Design Features; Amphenol TCS; Amphenol ABS; ERNI Electronics; FCI Electronics; Molex; Tyco Electronics; 3M
Chapter 11 - Market Analysis / Forecasts: Market Analysis - Forecast; Measurement Criteria; World Connector Market; High-Speed Backplane & Midplane Connectors; Market Forecast by World Region; High-Speed Backplane & Midplane Connectors; World Market - End User Forecast; High Speed Backplane & Midplane Connectors; World Market Forecast; High-Speed Copper Cable Assemblies; Market Forecast by World Region; 3- 12+ Gb/s Copper Cable Assemblies; World Market - End User Forecast; High Speed Copper Cable Assemblies
Chapter 12 - High-Speed Connector Innovation: High-Speed Connector Innovation; Introduction
Chapter 13 - Major Findings And Conclusions: Major Findings And Conclusions; General; Backplane Connectors; Midplane Connectors; High-Speed Cable Connectors and Assemblies
Appendix A - Terms And Definitions
Appendix B - List Of Contributors

Abstract

Bishop and Associates, Inc. has just released a new 13-chapter research report providing a complete analysis of Evolving High-Speed Connectors. This new report details backplane, midplane, and high-speed backplane cable assemblies. Connector values are provided for each category for the years 2007, 2008,2009, and 2013, as well as region of the world.

Connectors designed to operate in multi-gigabit applications have proliferated over the past four years providing system designers greatly expanded interconnect options and performance levels. Advances in connector as well as signal conditioning technology have pushed interface bandwidth from 3 Gb/s to 20+ Gb/s, with at least one supplier introducing a 40 Gb backplane connector. This market research report addresses the many aspects of the highspeed interconnect market from what is driving demand for faster channels, to defining the key characteristics of the leading connector families that are currently available. Detailed market estimates and forecasts extending to 2013 for backplane and cable connectors by application and region of the world are featured.

A variety of factors associated with high-speed channels have a major influence on their behavior. Chapters are devoted to reviewing related system elements including driver and receiver technology, printed circuit board materials, as well as channel modeling, and performance measurement systems.

A new chapter focused on innovation provides examples of new creative approaches to addressing some of the challenges associated with interconnection and packaging of next generation electronic equipment.

This market research report also includes several tutorial chapters on connector and high-speed design issues that enable a non-technical reader to gain from the information provided.

Get Full Details About This Report >>

US: 800.298.5699

Int'l: +1.240.747.3093

About MarketResearch.com
MarketResearch.com is an online aggregator selling over 250,000 market research reports, company profiles and country profiles from over 650 research firms. Our reports will provide you with the critical business and competitive intelligence you need for strategic planning and marketing research. Coverage includes the US, UK, Europe, Asia and global markets.

Evolving High Speed Connectors

Table of Contents

Abstract