Impact of Wafer-level Camera Modules on the CCM Industry Supply Chain

Published by: Market Intelligence & Consulting Institute

Published: Feb. 23, 2009 - 7 Pages

Table of Contents

1. Small Size and Low Cost Are Advantages of Wafer-level Camera Modules

2. Changes in the CCM Industry Supply Chain

MIC Perspective

Appendix

List of Topics

Analysis of advantages and disadvantages of different CCM assembly methods

Emergence of wafer-level camera modules and their technological characteristics

Impact of wafer-level camera modules on the existing CCM industry supply chain, including impact on different component suppliers

Companies and organizations analyzed or mentioned in the report include: Aptina, Digital Optics, Eyesquad, FotoNation, Foxonn, Fujinon, Heptagon, Kantatsu, Kolen, Konica Minolta, Largan, MagnaChip, Mitsumi, OV, Panasonic, Samsung, Samsung Tech, SEMCO, Sharp, Shellcase, Siliconfile, Sony, ST Micro, Tessera, Toshiba, VisEra Technologies, VistaPoint, Xintec

List of Tables

Table 1 Key Players in the Worldwide CCM Supply Chain

List of Figures

Figure 1 The Evolving CCM Supply Chain

Abstract

CCMs are developing towards smaller sizes and lower costs. However, traditional CCM assembly methods are restricted by materials and technology, and there are bottlenecks in terms of product cost control. As a result, wafer-level camera modules have emerged. Wafer-level camera modules make use of semiconductor production processes to manufacture optical components, and are integrated with the image sensor. This process can enable companies to achieve their goals of making modules smaller and lowering prices. Large-scale production and low prices will threaten existing camera module makers, and could also lead to changes in the CCM industry supply chain. However, a challenge for wafer-level modules is yield rate, which will have to increase significantly before they will have a significant impact.

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