Energy Harvesting and Storage for Electronic Devices 2009-2019

Published by: IDTechEx Ltd

Published: Jan. 1, 2009 - 282 Pages

Table of Contents

1. INTRODUCTION

1.1. What is energy harvesting?

1.2. What it is not

1.3. Power requirements of different devices

1.4. Harvesting options to meet these requirements

1.5. Battery advances fail to keep up - implications

1.6. Some key enablers for the future - printed electronics, smart substrates, MEMS

1.6.1. Printed and thin film

1.6.2. Smart substrates

1.6.3. MEMS

2. APPLICATIONS AND POTENTIAL APPLICATIONS

2.1. Aerospace and military

2.2. Industrial

2.2.1. Standards - EnOcean Alliance and Buildings

2.2.2. Real Time Locating Systems

2.2.3. Wireless Sensor Networks (WSN)

2.2.4. Aircraft, engines and machinery

2.3. Consumer

2.3.1. Mobile phones, wristwatches, radio, lamps etc

2.3.2. E-Labels, E-Packaging, E-signage, E-posters

2.4. Healthcare

2.5. Third World

2.6. Environmental

3. HARVESTING-TOLERANT ELECTRONICS, DIRECT USE OF POWER, STORAGE OPTIONS

3.1. Harvesting tolerant electronics and direct use of power

3.1.1. Progress with harvesting tolerant electronics

3.2. New battery options

3.2.1. Smart Dust

3.2.2. Lithium laminar batteries

3.2.3. Planar Energy Devices

3.2.4. Cymbet Corporation - integrated battery management

3.2.5. Transparent printed organic batteries

3.2.6. Biobatteries do their own harvesting

3.2.7. Need for shape standards for laminar batteries

3.3. Alternatives to batteries

3.3.1. Supercapacitors

3.3.2. Supercabatteries

3.3.3. Mini fuel cells

4. LIGHT HARVESTING FOR SMALL DEVICES

4.1. Comparison of options

4.1.1. Important parameters

4.1.2. Principles of operation

4.1.3. Options for the future

4.1.4. Many types of photovoltaics needed for harvesting

4.2. Limits of cSi and aSi technologies

4.3. Limits of CdTe

4.4. GaAsGe multilayers

4.5. DSSC

4.6. CIGS

4.7. Organic

4.8. Nanosilicon ink

4.9. Nantennas

4.10. Other options

4.10.1. Nanowire solar cells

5. MOVEMENT HARVESTING

5.1. Vibration harvesting

5.2. Movement harvesting options

5.2.1. Piezoelectric - conventional, ZnO and polymer

5.2.2. Electrostatic

5.2.3. Magnetostrictive

5.2.4. Energy harvesting electronics

5.3. Electroactive polymers

5.4. MEMS

5.5. Electrodynamic

6. HEAT HARVESTING

6.1. Thermoelectrics

6.1.1. Thermoelectric construction

6.1.2. Advantages of thermoelectrics

6.1.3. Heat pumps

7. OTHER HARVESTING OPTIONS

7.1. Electromagnetic field harnessing

7.2. Microbial and other fuel cells

8. PROFILES OF 200 PARTICIPANTS IN 22 COUNTRIES

8.1. Active Business Company GmbH

8.2. AdaptivEnergy

8.3. AdHoc Electronics

8.4. Advanced Cerametrics

8.5. Agency for Defense Development

8.6. AIST Tsukuba

8.7. Alabama A.&M. University

8.8. Alps Electric

8.9. Alvi Technologies

8.10. Ambient Research

8.11. AmbioSystems LLC

8.12. Applied Digital Solutions

8.13. Argonne National Laboratory

8.14. Arizona State University

8.15. Australian National University - Department of Engineering

8.16. BAE Systems

8.17. Biberach University of Applied Sciences

8.18. bk-electronic GmbH

8.19. BootUp GmbH

8.20. BSC Computer GmbH

8.21. California Institute of Technology

8.22. California Institute of Technology/Jet Propulsion Laboratory

8.23. California State University - Northridge

8.24. Carnegie Mellon University

8.25. CEA (Atomic Energy Commission of France)

8.26. Chinese University of Hong Kong

8.27. Chungbuk National University

8.28. Citizen Holding Co Ltd

8.29. China National Space Administration

8.30. Clarkson University

8.31. Cymtox Ltd

8.32. DigiTower Cologne

8.33. Distech Controls

8.34. Drexel University

8.35. East Japan Railway Company

8.36. EchoFlex Solutions

8.37. EDF R&D

8.38. Electronics and Telecommunications Research Institute (ETRI)

8.39. Eltako GmbH

8.40. Ember Corporation

8.41. Encrea srl

8.42. Energie Agentur

8.43. Engenuity Systems

8.44. EnOcean GmbH

8.45. European Space Agency

8.46. Exergen

8.47. Fast Trak Ltd

8.48. Fatih University

8.49. Ferro Solutions, Inc.

8.50. Fraunhofer Institut Integrierte Schaltungen

8.51. Freeplay Foundation

8.52. G24 Innovations

8.53. Ganssle Group

8.54. Georgia Institute of Technology

8.55. GreenPeak Technologies

8.56. Harvard University

8.57. High Merit Thermoelectrics

8.58. Hi-Tech Wealth

8.59. Holst Centre

8.60. Honeywell

8.61. Idaho National Laboratory

8.62. IMEC

8.63. Imperial College

8.64. India Space Research Organisation

8.65. Ingenieurbüro Zink GmbH

8.66. INGLAS Innovative Glassysteme GmbH & Co. KG

8.67. INSYS Electronics

8.68. IntAct

8.69. Intel

8.70. ITRI (Industrial Technology Research Institute)

8.71. Jager Direkt GmbH & Co

8.72. Japan Aerospace Exploration Agency

8.73. Kanazawa University

8.74. KCF Technologies Inc

8.75. KIB Projekt GmbH

8.76. Kinetron BV

8.77. Kobe University

8.78. Konarka

8.79. Kookmin University,

8.80. Korea Electronics Company

8.81. Korea Institute of Science and Technology

8.82. Korea University

8.83. KVL Comp Ltd.

8.84. Lawrence Livermore National Laboratory

8.85. Lebônê Solutions

8.86. LessWire, LLC

8.87. Leviton

8.88. LonMark International

8.89. Masco

8.90. Massachusetts Institute of Technology

8.91. MEMSCAP SA

8.92. Michigan Technological University

8.93. Microdul AG

8.94. Micropelt GmbH

8.95. MicroStrain Inc.,

8.96. Midé Technology Corporation

8.97. MINIWIZ Sustainable Energy Dev. Ltd

8.98. Mitsubishi Corporation

8.99. MK Electric (a Honeywell Business)

8.100. Moritani and Co Ltd

8.101. Nanosonic Inc

8.102. NASA

8.103. National Physical Laboratory

8.104. National Semiconductor

8.105. National Taiwan University,

8.106. National Tsing Hua University

8.107. Network Rail Infrastructure Ltd

8.108. Newcastle University

8.109. Nextreme

8.110. Nokia Cambridge UK Research Centre

8.111. North Carolina State University

8.112. Northrop Grumman

8.113. Northeastern University

8.114. Northwestern University

8.115. Nova Mems

8.116. NTT DOCOMO

8.117. Oak Ridge National Laboratory

8.118. Ohio State University

8.119. Omnio

8.120. Omron Corporation

8.121. Orkit Building Intelligence

8.122. Osram

8.123. Osram Silvania

8.124. Pacific Northwest National Laboratory

8.125. PEHA

8.126. Pennsylvania State University

8.127. Perpetuum Ltd

8.128. PowerFilm, Inc.

8.129. PROBARE Thomas Rieder e.K.

8.130. PulseSwitch Systems

8.131. Purdue University

8.132. PYRECAP/HYCOSYS

8.133. Regulvar

8.134. Rockwell Automation

8.135. Rutherford Appleton Laboratory,

8.136. Sagentia

8.137. Sandia National Laboratory,

8.138. Satellite Services Ltd

8.139. SAT System- und Anlagentechnik Herbert GmbH

8.140. Sauter

8.141. Schulte Elektrotechnik GmbH & Co. KG

8.142. Scuola Superiore Sant'Anna

8.143. Seiko

8.144. SELEX Galileo

8.145. SensorDynamics AG

8.146. Sentilla Corporation

8.147. Servodan A/S

8.148. Shanghai Jiao Tong University

8.149. Siemens Building Technologies GmbH & Co

8.150. Simon Fraser University

8.151. Smart Material Corp.

8.152. SMH

8.153. Solid State Research inc

8.154. Sony

8.155. Southampton University Hospital

8.156. Spectrolab Inc

8.157. State University of New Jersey

8.158. Steinbeis Transferzentrum für Embedded Design und Networking

8.159. steute Schaltgeräte GmbH & Co. KG

8.160. Swiss Federal Institute of Technology

8.161. Syngenta Sensors UIC

8.162. Tambient

8.163. Technical University of Ilmenau,

8.164. Technograph Microcircuits Ltd

8.165. Texas Instruments

8.166. ThermoKon Sensortechnik

8.167. Thermolife Energy Corporation

8.168. The Technology Partnership

8.169. TIMA Laboratory

8.170. Tokyo Institute of Technology

8.171. TRW Conekt

8.172. Tyndall National Institute

8.173. Unitronic AG Zentrale

8.174. University of Berlin

8.175. University of Bristol

8.176. University of California Berkeley

Abstract

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