Advanced Electronic Packaging

Published by: Global Industry Analysts

Published: Oct. 1, 2008 - 310 Pages

Table of Contents

I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

Study Reliability and Reporting Limitations

Disclaimers

Data Interpretation & Reporting Level

Quantitative Techniques & Analytics

Product Definitions and Scope Of Study

Ball Grid Arrays

Chip Scale Packaging (CSP)

Multi Chip Modules (MCM)

II. EXECUTIVE SUMMARY

1. Current and Future Analysis

Industry Faces Challenging Times

2. Industry Overview

A Brief Insight

Table 1: Semiconductor Capital Equipment Market Worldwide (2005) - Percentage Breakdown of Dollar Revenues by Region: Japan, North America, Korea, Taiwan, Europe, and Rest of World (include corresponding Graphs/Chart)

Table 2: Semiconductor Plastic Packaging Materials Market Worldwide (2005) - Percentage Breakdown of Dollar Revenues by Geographic Region- Southeast Asia, Japan, Taiwan, Korea, China, and Rest of World (include corresponding Graphs/Chart)

Advanced Electronic Packaging Technology Trends (2000-2015)

Table 3: Laminate Substrate Market Worldwide (2005) - Percentage Breakdown by Technology- Flip Chip, Wire Bond, and Chip Scale Packaging (include corresponding Graphs/Chart)

Table 4: Leading Fabless Packaging Techniques Worldwide (2004 & 2005) - Percentage Share Breakdown for QFP, BGA, SOIC, Leadless, CSP, FBGA, Discrete and Other (include corresponding Graphs/Chart)

Table 5: Leading Foundry Manufacturing Regions Worldwide (2004 & 2005) - Percentage Share Breakdown for Taiwan, Singapore/Malaysia, Korea, China, Philippines, and Other (include corresponding Graphs/Chart)

Market Share Scenario

Table 6: Leading IC Socket Manufacturers Worldwide (2004 & 2005) - Percentage Share Breakdown for Yamaichi, AMP, Molex, Thomas & Betts, FCI/Berg, and Others (include corresponding Graphs/Chart)

Table 7: Leading CSP Substrate Suppliers Worldwide (2004 &2005) - Percentage Share Breakdown for Unimicron, Ibiden, Shinko, JCI, Samsung, LG, and Others (include corresponding Graphs/Chart)

Table 8: Leading Chip Packaging Manufacturers Worldwide (2004 & 2005) - Percentage Share Breakdown for Amkor, ASE, ChipPac, Siliconware, Orient, STATS, ASAT, and Others (include corresponding Graphs/Chart)

3. Issues and Trends

Suppliers Outsource Packaging To Curtail Costs

BGAs on a Tremendous Growth Path

Glue Logic Makers Move to Advanced Packaging

Contractors Move Towards High Pin-Count Packages

Wafer Scale Packaging Anticipated to Cut Costs

Disparity in Scale Sizes - A Reason for Concern

Miniaturization Impels Adoption of Wafer-Level Chip Scale Packaging

Challenges Facing Assembly and Packaging

Technology Trends

4. Growth Drivers

Portable Equipment Drives Growth in Flip Chips

Drivers for Electronic Packaging Technologies

Shrinking Die Sizes to Drive New Packaging Technologies

Factors Driving Growth in the Chip Scale Packaging Market

Market Technology Drivers by Major End-Use Sectors

5. Product Overview

Definition

Packaging Hierarchy

Semiconductor Manufacturing Process

IC Supply Chain

Applications of Electronic Packaging Research

Industrial Applications of Advanced Packaging and Interconnection

Requirements for Electronic Packaging

Technologies that Facilitate Electronic Packaging

Origin and Evolution

Electronic Packaging Advances

Semiconductor Packaging - Significance

Product Segments

Ball Grid Arrays

Types of BGA

Flip Chip Technology (FCT)

Advantages of Flip-Chip Technology

Flip Chip Materials & Modeling Infrastructure

Table 9: Trends in Flip Chip Production Worldwide (2000 Vs 2005): Percentage Breakdown by End Product - Lower Lead Count Products, Non Solder Bumped Die with TCB, Integrated Passives, Displays/Micro displays, Non Solder Bumped Die with Conductive Adhesive, High Performance Processors, High Performance Memory, High Performance ASICS Mid I/O Die, and High Frequency Products (include corresponding Graphs/Chart)

Multi Chip Modules (MCM)

Advantages of MCM

Disadvantages of MCM

Module Assembly Techniques

Module Encapsulation Techniques

Chip Scale Packaging (CSP)

Lead Counts by Packaging Technology - A Comparison

Wafer-Level Packages

Wire Bonding

Stacked Die Packages

Die Products

Chip-On-Board (COB)

Flip-Chip and Wafer-Level Packaging

Adhesive Flip Chip on Flex

Solder Flip-Chip

6. Product Introductions/Innovations

Telit Introduces M2M BGA Module

RJR Polymers Introduces LCP Compatible Epoxies

Five Star Technologies Launches Advanced Dispersion Products

STATS Complements 3D Technology Portfolio

Toshiba Develops TSSOP Advance Package

Semtech Expands MicroClamp™ Family

7. Recent Industry Activity

TSI Group Acquires Three Los Angeles Based Brazing and Machining Businesses

Ferro Creates New Electronic Packaging Materials Unit

A Group of US Based Investors Establish Chip-Packaging Plant in Vietnam

Blackstone Acquires Klockner

Micronic Gets Another Asian Customer for FPS5100 Laser Pattern Generator

ASE and Flip Chip in a Licensing Agreement

Quantum Acquires CiP technology from Silicon Bandwidth

Sumitomo Acquires Stake in Quantum

8. Focus on Select Players

Advanced Semiconductor Engineering Group (Taiwan)

ASAT Holdings Limited (Hong Kong)

Amkor Technology Inc. (US)

ASM International NV (The Netherlands)

ASM Pacific Technology Ltd (Hong Kong)

CARSEM (Malaysia)

Chipbond Technology Corp (Taiwan)

ChipMos Technologies (Taiwan)

FlipChip International (US)

Fujitsu Ltd (Japan)

NEC Electronics Corporation (Japan)

Orient Semiconductor Electronics (Taiwan)

Sliconware Precision Industries Co., Ltd. (Taiwan)

STATS ChipPAC Ltd. (Singapore)

Tessera, Inc. (US)

Toshiba America Electronic Components Inc. (US)

Major Strategies of Integrated Solution Providers

9. Global Market Perspective

Table 10: World Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart)

Table 11: World Long-Term Projections for Advanced Electronic Packaging by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

Table 12: World 10-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Dollar Revenues for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2003, 2008 & 2012 (includes corresponding Graph/Chart)

Table 13: World Recent Past, Current & Future Analysis for Ball Grid Arrays by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart)

Table 14: World Long-Term Projections for Ball Grid Arrays by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

Table 15: World 10-Year Perspective for Ball Grid Arrays by Geographic Region - Percentage Breakdown of Dollar Revenues for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2003, 2008 & 2012 (includes corresponding Graph/Chart)

Table 16: World Recent Past, Current & Future Analysis for Chip Scale Packages by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart)

Table 17: World Long-Term Projections for Chip Scale Packages by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

Table 18: World 10-Year Perspective for Chip Scale Packages by Geographic Region - Percentage Breakdown of Dollar Revenues for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2003, 2008 & 2012 (includes corresponding Graph/Chart)

Table 19: World Recent Past, Current & Future Analysis for Multi Chip Modules by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2000 through 2010

Table 20: World Long-Term Projections for Multi Chip Modules by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

Table 21: World 10-Year Perspective for Multi Chip Modules by Geographic Region - Percentage Breakdown of Dollar Revenues for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2003, 2008 & 2012 (includes corresponding Graph/Chart)

III. MARKET

1. The United States

A. Market Analysis

Outlook

Chip Manufacturers - Looking for Greener Pastures

Key US Players

Product Launches

Strategic Developments

B. Market Analytics

Table 22: US Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart)

Table 23: US Long-Term Projections for Advanced Electronic Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

Table 24: US 10-Year Perspective for Advanced Electronic Packaging by Product Segment - Percentage Breakdown of Dollar Revenues for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets for years 2003, 2008 & 2012 (includes corresponding Graph/Chart)

2. Canada

A. Market Analysis

Outlook

B. Market Analytics

Table 25: Canadian Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart)

Table 26: Canadian Long-Term Projections for Advanced Electronic Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

Table 27: Canadian 10-Year Perspective for Advanced Electronic Packaging by Product Segment - Percentage Breakdown of Dollar Revenues for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets for years 2003, 2008 & 2012 (includes corresponding Graph/Chart)

3. Japan

A. Market Analysis

Outlook

Weakness in the Industry Structure

Japanese Companies on Comeback Trial

Select Players

B. Market Analytics

Table 28: Japanese Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart)

Table 29: Japanese Long-Term Projections for Advanced Electronic Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

Table 30: Japanese 10-Year Perspective for Advanced Electronic Packaging by Product Segment - Percentage Breakdown of Dollar Revenues for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets for years 2003, 2008 & 2012 (includes corresponding Graph/Chart)

4. Europe

A. Market Analysis

European Advanced Packaging Technologies

B. Market Analytics

Table 31: European Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - France, Germany, Italy, UK, and Rest of Europe Markets Analyzed with Annual Revenues in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart)

Table 32: European Long-Term Projections for Advanced Electronic Packaging by Geographic Region - France, Germany, Italy, UK, and Rest of Europe Markets Analyzed with Annual Revenues in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

Table 33: European 10-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Dollar Revenues for France, Germany, Italy, UK, and Rest of Europe Markets for Years 2003, 2008 & 2012 (includes corresponding Graph/Chart)

Table 34: European Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart)

Table 35: European Long-Term Projections for Advanced Electronic Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

Table 36: European 10-Year Perspective for Advanced Electronic Packaging by Product Segment - Percentage Breakdown of Dollar Revenues for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets for years 2003, 2008 & 2012 (includes corresponding Graph/Chart)

4a. France

Market Analysis

Table 37: French Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart)

Table 38: French Long-Term Projections for Advanced Electronic Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

Table 39: French 10-Year Perspective for Advanced Electronic Packaging by Product Segment - Percentage Breakdown of Dollar Revenues for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets for years 2003, 2008 & 2012 (includes corresponding Graph/Chart)

4b. Germany

A. Market Analysis

Outlook

B. Market Analytics

Table 40: German Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart)

Table 41: German Long-Term Projections for Advanced Electronic Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

Table 42: German 10-Year Perspective for Advanced Electronic Packaging by Product Segment - Percentage Breakdown of Dollar Revenues for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets for years 2003, 2008 & 2012 (includes corresponding Graph/Chart)

4c. Italy

Market Analysis

Table 43: Italian Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart)

Table 44: Italian Long-Term Projections for Advanced Electronic Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

Table 45: Italian 10-Year Perspective for Advanced Electronic Packaging by Product Segment - Percentage Breakdown of Dollar Revenues for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets for years 2003, 2008 & 2012 (includes corresponding Graph/Chart)

4d. The United Kingdom

Market Analysis

Table 46: UK Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart)

Table 47: UK Long-Term Projections for Advanced Electronic Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

Table 48: UK 10-Year Perspective for Advanced Electronic Packaging by Product Segment - Percentage Breakdown of Dollar Revenues for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets for years 2003, 2008 & 2012 (includes corresponding Graph/Chart)

4e. Rest of Europe

A. Market Analysis

Outlook

Strategic Development

Key Player

ASM International NV (The Netherlands)

B. Market Analytics

Table 49: Rest of Europe Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart)

Table 50: Rest of Europe Long-Term Projections for Advanced Electronic Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

Table 51: Rest of Europe 10-Year Perspective for Advanced Electronic Packaging by Product Segment - Percentage Breakdown of Dollar Revenues for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets for years 2003, 2008 & 2012 (includes corresponding Graph/Chart)

5. Asia-Pacific

A. Market Analysis

Outlook

A Brief Review

China - A Promising Market

Taiwan - Looking Ahead

Product Launch

Strategic Developments

Key Players

Advanced Semiconductor Engineering Group (Taiwan)

ASAT Holdings Limited (Hong Kong)

STATS ChipPAC Ltd (Singapore)

ASM Pacific Technology Ltd. (Hong Kong)

CARSEM (Malaysia)

Chipbond Technology Corp (Taiwan)

ChipMos Technologies (Taiwan)

Orient Semiconductor Electronics (Taiwan)

Siliconware Precision Industries Co., Ltd. (Taiwan)

STATS ChipPAC Ltd (Singapore)

B. Market Analytics

Table 52: Asia-Pacific Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart)

Table 53: Asia-Pacific Long-Term Projections for Advanced Electronic Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

Table 54: Asia-Pacific 10-Year Perspective for Advanced Electronic Packaging by Product Segment - Percentage Breakdown of Dollar Revenues for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets for years 2003, 2008 & 2012 (includes corresponding Graph/Chart)

6. Rest of World

Market Analysis

Table 55: Rest of World Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Revenuesin US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart)

Table 56: Rest of World Long-Term Projections for Advanced Electronic Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Revenues in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

Table 57: Rest of World 10-Year Perspective for Advanced Electronic Packaging by Product Segment - Percentage Breakdown of Dollar Revenues for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets for years 2003, 2008 & 2012 (includes corresponding Graph/Chart)

IV. COMPETITIVE LANDSCAPE

Total Companies Profiled: 77 (including Divisions/Subsidiaries - 90)

Region/Country Players

The United States56

Japan 9

Europe8

France 1

Germany1

Italy 1

Rest of Europe 5

Asia-Pacific (Excluding Japan) 16

Middle East 1

Abstract

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