Flex And Flex-rigid Printed Circuits 2008-2013

Published by: BPA Consulting Ltd.

Published: Sep. 5, 2008 - 174 Pages

Table of Contents

1. EXECUTIVE SUMMARY

2. INTRODUCTION

Definitions of a Flexible Circuit

Classifications of Regions

3. REVIEW OF THE NEED FOR FPC AND FLEX-RIGID SUBSTRATES

Introduction

Automotive

Computer and Business

Consumer

Communications: Datacom and Telecom Infrastructure

Mobile Phone Handsets, Smartphones and PDAs

Industrial, Instrumentation and Control

Medical Sector

Military, Avionics and Space Sector

4. FLEXIBLE SUBSTRATE MATERIALS

Introduction

Polyimide

Adhesiveless Polyimide

Thermoplastic Polyimide

LCP

PTFE

PEEK

Cyclo-Olefin Copolymers

Future Requirements for Flexible Substrate Materials

5. FLEXIBLE COVERLAY MATERIALS

Introduction

Drivers for Use of Photoimageable Coverlay

Coverlay Suppliers and Products

6. SUBSTRATE TECHNOLOGIES

Introduction

Fineline and Advanced Structuring Technologies

Multilayer Flex

YFLEX

Flex-Rigid

Embedded Active and Passive Components

Assembly on Flex

Assembly on Polyimide Flex

OCCAM

Connector Technology

IC Packaging Technologies

TBGA and High-Speed Packages

7. MARKET FORECAST

Introduction

Worldwide Production of Polyimide FPC and Flex-Rigid

China

Asia (Excluding China and Japan)

Japan

North America

Europe

Market Demand for Polyimide Laminate

Worldwide Demand for Adhesiveless Laminate

Worldwide Demand for Flexible Circuit Coverlay

IC Packaging

8. FPC FABRICATORS AND ASSEMBLERS

Introduction

Asia (excluding Japan)

Japan

North America

Western Europe

Regional Shift of FPC Production

Market Structure of FPC and Flex-Rigid Assembly

The Impact of EMS and ODMs on the Supply Base

Future Market Structure

9. OPPORTUNITIES

Summary

Emerging Opportunities

APPENDIX 1

LIST OF TABLES

1.1 Summary of Demand for Flex and Flex-Rigid Printed Circuits

3.1 Applications Requiring Flex and Flex-Rigid Circuits

3.2 Automotive Flex-Rigid

3.3 Notebook Computer Technology Roadmap

3.4 Hard Disk Drive Technology Roadmap

3.5 Optical Pick-Up Module Technology Roadmap

3.6 Flexible Interconnects and Layer Counts for Mobile Phones

3.7 Technology Roadmap for Mobile Phone Substrate and Key Flex Interconnects

3.8 Top 25 Medical OEMs

3.9 MRI Players and FPC Use

3.10 CT Flexible Circuit Requirement

3.11 Medical Imaging FPC Technology Roadmap

3.12 Ultrasound Market

3.13 Technology Roadmap for ITE Hearing Aid

3.14 Implantable Device - Technology Roadmap

3.15 World Military Expenditure 2007

3.16 Top Aerospace and Defence Companies

3.17 Military and Aerospace Applications Using Flex-Rigid

3.18 Electronics Assembly Roadmap for Smart Ammunition (Heavy Ordinance)

4.1 Comparison of Polyimide Brands with PEN and LCP

4.2 Producers of 3CCL and Adhesiveless Polyimide

4.3 Hyrelex Properties

4.3 Optical Waveguide Material Comparison

5.1 Technology Cost Comparison - Low Volumes

5.2 Technology Cost Comparison - High Volumes

5.3 Key Suppliers and Flex Coverlay Products

6.1 LPKF’s Laser Patterning Process Parameters

6.2 Comparison of Assembly Technologies 6-4

7.1 Worldwide Demand for IC packages (Billion Units)

8.1 Top 12 Flex Circuit Fabricators Worldwide

8.2 Top Ten Asian FPC Fabricators 2007

8.3 Top Twelve Japanese FPC Fabricators 2007

8.4 Top Ten North American FPC Fabricators 2007

8.5 Top Ten W European FPC Fabricators 2007

8.6 Top Tier EMS and ODM Companies

8.7 Regional Variations in FPC Prices, 2007

9.1` Polyimide Film Requirements by Application

LIST OF FIGURES

3.1 Sensor Application Uses

3.2 ZF Active Suspension Assembly

3.3 Quanta Display for Acer 4601 Travelmate

3.4 Toshiba 0.85” Hard Disk Drive

3.5 Hitachi 60GB TravelstarTM 2.5” HDD Actuator Flex

3.6 FPC in Optical Drive from Acer Travelmate 4601

3.7 TSST Optical Drive Flexfoil

3.8 Lite-On Pick-Up Flexfoil

3.9 Philips Triple Laser Optical Disk Drive

3.10 15” LCD Display (2004)

3.11 1.5MPX Fujifilm Digital Camera

3.12 Sony 2005 vs 2008

3.13 Digital Camera Market Share 2008

3.14 Router System Architecture

3.15 10Gbps Avalanche Photodiode Receiver Optical Sub-Assembly(APD ROSA)

3.16 Worldwide Mobile Phone Shipments 2007

3.17 Mobile Phone Handset Shipments 2007-2013

3.18 Mobile Phone Handset Shipments 2007-2013, Split by Form Factor

3.19 Motofone Teardown

3.20 Motorola V980 Teardown

3.21 Nokia 6500 Slider Phone

3.22 Apple’s iPhone - FPC Components

3.23 Worldwide Demand for Camera Phones

3.24 Image Sensor Resolution Trend

3.25 Agilent 0.1 Megapixel Sensor Module

3.26 Samsung Ultraslim Camera Sensor Module 2 Megapixel

3.27 Tessera OptimlTM WLP Image Sensor Compared with Conventional Module

3.28 Semiconductor Test Circuit Component

3.29 Parvus - Miniature Robot

3.30 Worldwide Imaging Market 2007 % Split by Application

3.31 X-Ray Sensor Panel Construction

3.32 Philips 40-Slice CT Scanner

3.33 GE Medical’s V-RES Detector

3.34 Intravascular Ultrasound Probes

3.35 Micrograph of Ultrasound Flex Component

3.36 BHTE and ITE Hearing Aids

3.37 Size Reduction of Implantable Pacemakers and Defibrillators

3.38 NDI Medical’s MicropulseTM

3.39 Medtronic Programmable Infusion Pump

3.40 Given Imaging Pillcam

3.41 RF Wireless Communication for Implanted Device and External Controller

3.42 US Aerospace Industry 2007

3.43 Missile Market Share 2006-2010

3.44 Multilayer Flex-Rigid for Radar Application

3.45 Cross-Sectional Construction

3.46 Cross Section of AMRAAM Missile

3.47 Flex-Rigid for Missile

4.1 14GHz (1 x 2) Antenna Array on a 425µm LCP Substrate

4.2 Moisture Absorption Comparison

4.3 Comparison of PEEK and Polyimide

5.1 Process Paths

6.1 Fine Line Structuring 16µm Lines, 50µm Pitch

6.2 Semi-Additive Processing

6.3 Compass Technology Fine Line

6.4 Compass technology 9µm Blind Via

6.5 LPKF’s Laser Patterning Process Steps

6.6 Microsection of Plasma-Ablated Via and Blind Via

6.7 Dyconex 8-Layer Flex

6.8 Y-Flex 2-Layer Board Using Toshiba’s B2IT Process

6.9 Y-Flex 4-Layer Board Using Toshiba’s B2IT Process

6.10 NOK FlexboardTM

6.11 Young Poong Flex-Rigid Build-Up Board

6.12 Coesen Flex-Rigid Cross-Section

6.13 HVRFlexTM

6.14 Yellow Flex

6.15 Aspocomp Snap-Off Flex-Rigid

6.16 Hicoflex Process Stages

6.17 Hicoflex Hearing Aid Substrate with Die

6.18 Impact of Tensile Strain on Copper Conductors

6.19 Gold on Elastomer Showing Sub-Micron Y-Cracks

6.20 Flow Path for Assembly on Flex

6.21 TCP and COF Package Structures

6.22 OCCAM Process Applied to Flexible Circuits

6.23 DKN/ADK Film Base Connector

6.24 Cross-Section of Tessera 3-Die Folded Flex Package

6.25 Construction of Substrate for Tessera 3-Die Folded Flex Package

6.26 Stakpak® CSP DRAM Stacking BGA

7.1 Total World Polyimide and Polyester FPC Production (US$ Million)

7.2 Worldwide Production of Polyimide FPC 2007-2013 (US$ Million)

7.3 Worldwide Production of Polyimide FPC 2007-2013 (000s sq m)

7.4 Chinese Polyimide FPC Production 2007-2013 (US$ Million)

7.5 Chinese Polyimide FPC Production 2007-2013 (000s sq m)

7.6 Chinese Markets for FPC 2007-2013 (US$ Million)

7.7 Chinese Markets for Flex-Rigid 2007-2013 (US$ Million)

7.8 Chinese Markets for Multilayer Flex 2007-2013 (US$ Million)

7.9 Asian Polyimide FPC Production 2007-2013 (US$ Million)

7.10 Asian Polyimide FPC Production 2007-2013 (000s sq m)

7.11 Asian Demand for Polyimide FPC 2007-2013 (US$ Million)

7.12 Asian Markets for Flex-Rigid 2007-2013 (US$ Million)

7.13 Asian Markets for Multilayer Flex 2007-2013 (US$ Million)

7.14 Japanese Polyimide FPC Production 2007-2013 (US$ Million)

7.15 Japanese Markets for Flex-Rigid 2007-2013 (US$ Million)

7.16 Japanese Market Demand for FPC 2007-2013 (US$ Million)

7.17 Japanese Market Demand for Flex-Rigid 2007-2013 (US$ Million)

7.18 Japanese Markets for Multilayer Flex 2007-2013 (US$ Million)

7.19 North American Polyimide FPC Production 2007-2013 (US$ Million)

7.20 North American Polyimide FPC Production 2007-2013 (000s sq m)

7.21 North American Demand for Polyimide FPC 2007-2013 (US$ Million)

7.22 North American Markets for Flex-Rigid 2007-2013 (US$ Million)

7.23 North American Markets for Multilayer Flex 2007-2013 (US$ Million)

7.24 W European Polyimide FPC Production 2007-2013 (US$ Million)

7.25 W European Polyimide FPC Production 2007-2013 (000s sq m)

7.26 W European Demand for FPC and Flex-Rigid by Sector 2007-2013 (US$ Million)

7.27 W European Market for Flex-Rigid by Sector 2007-2013 (US$ Million)

7.28 North American Markets for Multilayer Flex 2007-2013 (US$ Million)

7.29 Demand for Polyimide Laminate 2007-2013 (000s sq m)

7.30 Worldwide demand for Adhesiveless Polyimide (000s sq m)

7.31 Market Demand for LCP

7.32 Worldwide Demand for Coverlay 2005-2011 (Thousands sq m)

7.33 Worldwide Demand for CSP by Substrate Technology

7.34 Worldwide Demand for Flexible Laminate for IC Package Substrates (000s sq m)

8.1 Regional FPC Production

8.2 FPC Production in Asia

8.3 Flex Assembly Market Structure

Abstract

• Flexible and flex-rigid substrates are key technologies in future generation electronic system design and development.
• The market for flex and flex-rigid printed circuit boards for all sectors has increased from $4bn in 2001 to more than $8bn in 2007 and is forecast to be >$11bn by 2013. The higher-value segment i.e. medical, military and aerospace accounts for one-fifth of this. Mobile phone and display interconnects dominate Asian production and markets.
• Flex and flex-rigid production in China will increase from $1.8 billion in 2007 to nearly $3 billion by 2013 accounting for 25% of worldwide production. Asia in total will account for nearly 90% of worldwide flex production by 2013.

• Identifies opportunities for small, medium and large players
• Identifies and examines the technologies, materials and processes that you will need to participate in these markets
• Identifies winning strategies for successful players
• Provides a totally integrated assessment of the global flexible and flex-rigid substrate supply chain.

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