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System on a Chip

Published by: Global Industry Analysts

Published: May. 1, 2008 - 1212 Pages


Table of Contents


I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

Study Reliability and Reporting Limitations

Disclaimers

Data Interpretation & Reporting Level

Quantitative Techniques & Analytics

Product Definitions and Scope of Study

II. EXECUTIVE SUMMARY

1. Market Highlights

Market Highlights

2. System-On-A-Chip: A Major Breakthrough in Semiconductor Industry

Global System-on-a-Chip Market

SoCs Grow at the Expense of Standalone Chips

North America Dominates, Asia-Pacific Witnesses Fastest Growth

Table 1: Global SoCs Market by Geographic Region/ Country: Percentage Share Breakdown for US, Canada, Japan, Europe, Asia-Pacific (Excluding Japan) and Rest of World for 2007 & 2010(includes corresponding Graph/Chart)

Table 2: Global SoCs Market: Geographic Region/Country Ranked by Growth for US, Canada, Japan, Europe, Asia-Pacific (Excluding Japan), and Rest of World (includes corresponding Graph/Chart)

SoCs Based on Embedded IP Steals the Limelight

SoCs Based on Standard Cells Grows with Moderate Rate

Table 3: Global SoCs Market by Product Type: Percentage Share Breakdown for SoCs Based on Standard Cell, and SoCs Based on Embedded IPs for 2007 & 2010

Table 4: Global SoCs Market: Product Types Ranked by Growth for SoCs Based on Embedded IP, and SoCs Based on Standard Cell

Computers and Communications Lead End-use Category

Table 5: Global SoCs Market by End-use Application: Percentage Share Breakdown for Computers, Communication Equipment, Consumer Electronics Devices, Automotive Applications and Others for 2007 & 2010 (includes corresponding Graph/Chart)

Table 6: Global SoCs Market: End-Use Applications Ranked by Growth for Consumer Electronics Devices, Automotive Applications, Computers, Communication Equipment and Others (includes corresponding Graph/Chart)

Consumer Electronics Products on a High Growth Track

Increasing Usage of SoC Solutions in Medical Field

3. Progression of the SoC Market

Progression of the SoC Market

4. Factors Driving S-o-C Market

Increasing Need for Compactness and High Speed

New End-Use Devices Spark Up SoCs Market

Innovations Drive Growth

Growing Demand for 90-nm Technology

Customization to Meet Client’s Requirements

Advent of Three-Dimensional Chips

SoC IP Designs Witness Rising Demand

5. Competitive Overview

Leading Players in the SoC Market

Players in Hard Disk Drive SoCs Market - A Recent Past Perspective

Table 7: Global Hard Disk Drives (HDD) SoCs Market: (2005): Percentage Share Breakdown by Company for Agere, Marvell and STMicroelectronics (includes corresponding Graph/Chart)

6. Industry Challenges

High Costs, a Major Deterrent

Time-to-Market Pressures

Verification Challenges

Testers - A Solution to the Challenge

IP Compatibility Issue

Issues Related to Marketing of ICs

Customer & Software Support and Staffing Challenges

7. Market Trends & Issues

Embedded Software to Power System-on-a-Chip (SoC) Solutions

Advanced ESL Design-For-Verification Solution to Reduce Verification Time for Complex

SoCs

Dual-Core Processors Gain Ground

ASIC Designs for Supersystems Make a Foray

Development of IP Market

Emergence of System-above-Chip (SaC) Market

Advent of Lab-on-a-Chip (LoC) Technology

Standardization to Drive the Market

SoCs Surpasses Standalone Chip in Terms of Price

Development of Reusable IPs

Innovations Address Power Leakage and Multiple Tasks Handling

Consolidation Fuels Growth

Growth in the Semiconductor Manufacturing Equipment Sector

Multi-Tasking Microprocessors Gain Significance

EDA and Silicon Intellectual-Property (IP), Two Burgeoning Sectors

PLD Market Demand - A Recent Past Perspective

Table 8: Global Programmable Logic Device (PLD) Market: (2005): Percentage Share Breakdown by Company for Xilinx, Altera and Others (includes corresponding Graph/Chart)

Customizable Analog IPs Add New Dimension to Complex SoCs

FPGA Makes Inroads in the Semiconductor Chips Market

Development of Premanufactured ASICs, and Flash- and SRAM- Series of FPGAs

Innovative Design Configuration of FPGAs

Emergence of Three-Tier Design Approach of FPGA-Based Chips

Evolution of System-On-A-Programmable Chip (SOPC)

Wide Application of SoCs in Mobile Phones and Broadband Networks

Standard Logic and Interface Equipment Prevails

Compact Size of Logic Devices Favors Growth

8. Product Overview

SoC - Emerging Technology in the Global Semiconductor Industry

Components of SoC

System-on-a-Chip (SoC) Block Diagram

SoC Design Benefits

"Second-Generation" SoCs

ASIC SSOC - A New Dimension

SoC Device Types

Standard Cells

Embedded IP

Micro Logic IP

Memory IP

ASIC/PLD IP

Analog IP & Other Components

Standards for SoCs

SoC Processor Types

Soft Instruction Processors

Configurable Processors

Total Design Strategies for SoCs

Architecture Strategy

Design-for-Test Strategy

Validation Strategy

Synthesis and Back-End Strategy

Integration Strategy

9. SoC End-Use Applications

Computers

Communications Equipment

Consumer Electronics Devices

Automotive Applications

Others

Industrial Automation & Military

Medical & Office Devices

CRM and Hearing Aid Products Dominate the Category

New Mixed-Signal Radio-Frequency (RF) Technology Design

SoC-Equipped Nanorobots

10. SoC Intellectual Property (IP)

Interconnect - A Growing Sector of Semiconductor IP Market

11. System-in-Package (SIP): A Potential Threat to System-on-a-Chip

SiP Market

12. Semiconductor Industry Overview

Global Semiconductor Industry - Witnessing Rapid Growth

The Moore’s Law Gives Rise to Sophisticated, Faster and Cheaper Chips

Technology Advancements Provide Necessary Impetus

Semiconductor Industry by Geographic Markets

Asia and the US - Two Major Semiconductors Market

Leading Semiconductor Players - A Recent Past Perspective

Table 9: Global Semiconductors Market by Leading Players (2005): Market Share Breakdown by Company for Intel, Samsung, Renesas, Texas Instruments, Toshiba, STMicroelectronics and Others (includes corresponding Graph/Chart)

Semiconductors Market by End-Use Sectors - A Recent Past Perspective

Table 10: Global Semiconductors Market (2005): Percentage Share Breakdown by End-Use Sector for EDP, Telecom, Industrial, Automotive, Consumer and Military & Others (includes corresponding Graph/Chart)

Integrated Circuits and Fabless Market - A Recent Past Perspective

IC Market

Table 11: Global Market for IC Design Houses Using Foundry Services (2005): Percentage Share Breakdown by Region for South Korea, Japan, China, Taiwan and Rest of World (includes corresponding Graph/Chart)

Fabless Market

Table 12: Global Fabless Market (2005): Percentage Share Breakdown by Region for North America, Asia Pacific, Europe and Rest of World (includes corresponding Graph/Chart)




Table 13: Global Fabless Market (2005): Percentage Share Breakdown by Company for Qualcomm, Broadcom, NVidia, ATI, SanDisk, Agilent Xilinx, Marvell, MediaTek, Altera and Others (includes corresponding Graph/Chart)

MEMS Market

Table 14: Global Micro-Electromechanical Systems (MEMS) Market (2005): Percentage Share Breakdown by Product Type for Actuators and Sensors

13. SoC Technological Developments by Select Market Players

System-on-a-Chip (SoC) for Printers

W-OFDM-SoCs

Xilinx® Virtex™ FPGAs and Embedded Solutions

EPON-Based System-on-a-Chip (SoC)

RapidChip® SoC Prototyping Platform

Analog Devices Othello-E Transceiver

True System-on-a-Chip (SoC)

14. Product Developments & Launches

Broadcom Unveils Advanced Encoder/Transcoder SoC Solution

Broadcom Showcases High Definition Set-Top Box System-on-a-Chip

Broadcom Unveils a Single Chip DBS Set-Top-Box Solution

GCT Semiconductor Unveils SoC Solution Supporting WiMAX and WiFi

Functionality

Infineon Releases CAT-iq™ Wireless Engine

Broadcom Showcases a Whole New Range of SoC Solutions for Mobile Devices

NVIDIA Introduces an Innovative Applications Processor

Samsung Introduces Single-Chip Decoder

Toshiba Introduces SoC Solution for ATSC LCD HDTVs

Broadcom Uncovers Reference Design Platform for HD Optical Disc Players

Broadcom Introduces Digital-to-Analog Adapter

STMicroelectronics Introduces ‘ST21NFCA’ - SoC Solution for the NFC Market

Broadcom Unveils SoC Solutions for the Mobile TV Market

New Series of IC Tuners from Infineon

TI Integrates Bluetooth®, FM and GPS Technologies on to a Single Chip

STMicroelectronics Releases Bluetooth® and FM-Radio SoC Solution

Upgraded Version of 90-Namnometer Reference Flow from SMIC and Synopsys

Syntax-Brillian Opts Digital TV SoC Solution from Broadcom

Broadcom Showcases BCM7400B SoC

Marvell Introduces Bluetooth Single-Chip Solution

D2 Technologies Unveils Embedded VoIP Software

Broadcom Rolls Out the New BCM4325 Single-Chip

Westinghouse Digital Selects BCM3560 SoC Solution

Broadcom Releases the BCM7118 Single Chip

Infineon Launches 3G ADSL2+ SoC

ARC International Launches New VRaptor™ Media Architecture

MOSAID Rolls Out Memorize™ and Fractional-N PLL

Starport Systems Unleashes SoC Solution for Gen2 UHF RFID Readers

Alvand Technologies Unveils SoC Humming-B™ Family of Tuners

MagnaChip Releases MC531EA SoC Imaging Solution

Genesis Microchip Unveils the Chaplin DTV family of ICs

PMC-Sierra Unveils the PAS65311 GPON ONT Reference Design Solution

STMicroelectronics Unleashes the SPEAr Head600 and SPEAr Plus600 ICs

CAST, Inc. Rolls Out the SOC Kernels

ARM and Northwest Logic’s PCI-SIG-compliant solution

Cypress Releases The PSoC Express 2.1

Texas Instruments Unveils Single-Chip NaviLink™ 5.0 Solution

Sonics Launches New Version of SonicsMX® SMART Interconnect™ Solution

SanDisk to Roll Out 8-Gb & 16Gb MLC NAND Flash Memory Chip

Broadcom Launches BCM7440 Blu-ray/HD DVD SoC Solution

Freescale Launches PowerQUICC™ III Processor Line

Freescale Introduces Multicore MPC8572 Family

Freescale Unveils the MPC8323E Processor

GCT Semiconductor Releases Monlothic Single Chip

National Semiconductor and ARM Launch PWI 2.0 Specification

NEC Electronics Rolls Out UX7LSeD Technology

NEC Electronics Launches MP201 Single-Chip Application Processor

NEC Electronics Introduces 55nm Standard CMOS Process Technology

National Semiconductor LM5071 Single Chip Solution

Synopsys Unveils DesignWare® Mobile Storage

Denali’s Databahn™ Product Released for NAND Flash Memory Devices

Pixelplus Unleashes PM1001 and PO4030 SoC Solutions

Adventiq’s Launches KVM System-On-A-Chip Product

Semtech Corporation Rolls Out SX8801R SoC for Data Acquisition

Key ASIC Unleashes the KeySoC™ Platform

Summit Unleashes the Panorama™ in Three Configurations

Micronas Unveils a New Audio SoC Solution for TV - Manufacturers

LTRIM Technologies Launches Latest Genre of DC-DC Converter IP Blocks

Silistix’s New Chip Area Interconnection (CHAIN) Scheme

SigmaTel Unleashes the STDC3000 SoC Controller Solution

Chipcon Releases the ‘CC1110’ SoC Solution for Wireless Payment Systems

Atmel® Corporation Launches its All-Format DVD SoC

Pixelplus Releases the 1.3 Megapixel Image Sensor PO5130 SoC

Broadcom Introduces SoC Power Management Unit

FMA Launches the Mobile WiMAX System-on- Chip (SoC) Solution

DSP Group Unveils A New System-on-a-Chip Solution

IP Cores Introduces Two Advanced Encryption Standard (AES) Based Security IP

Cores

PMC-Sierra Unveils Multi-Service MIPS-based Processor SoC Solution

Conexant Releases ADSL2plus Central Office SoC Solution

TI Releases VoIP System-on-a-Chip Solution

Zoran Unveils System-on-Chip Approach 5 family of Processors

DAFCA Releases ClearBlue™ version 2006.1 Product Suite

TEK Microsystems and QinetiQ RTES Jointly Develop the JazzStore SoC™

LG to Design SoCs by Employing Apache’s RedHawk-EV Solution

Faraday Unveiled the FIE7010- an MP3 Player SoC Platform

Pixelplus Releases Second Generation of SoC Image Sensors

PMC-Sierra Launches the PM5336 ARROW 2488

Provigent Introduces Development Kit for Wireless PTP Systems

Renesas Unveils Transistor Technology Using Hybrid CMIS Transistors

Renesas Unleashes the “SH7774” SoC Solution for Car Navigation Devices

Renesas Introduces Chip-on-Chip Technology

S2C Releases Two Models of Rapid FPGA Prototyping Solution Series

Samsung Electronics Unveils System-on-Chip Solution for Hybrid Drive

STMicroelectronics Introduces the T90 System-on- Chip (SoC) Solution

Synopsys Develops PCI Express to AMBA 2.0 AHB DesignWare® Bridge

Toshiba Introduces Second Generation of TC904XX Family of SoCs

Toshiba Unveils 2.0 Megapixel and 3.2 Megapixel CMOS SoC Image Sensors

Hua Hong NEC and Synopsys Unveil their Reference Design Flow 2.0

Sonics Inc., Unveils SonicsMX SMART Interconnects Solution

Sonics White Paper Defining SoC Interconnect Options for Developers

Sonics Introduces the SonicsLX SMART Interconnect Solution

Actel Introduces Design Infrastructure for ARM7-Enabled Fusion Programmable System

Chips

Actel Unveils the CoreMP7 Development Kit for ARM7-Enabled CoreMP7 Soft Processor

Core

Cypress Semiconductor Launches New Evaluation Kit for Wireless Radio System-on-a-Chip

(SoC)

Pentax Introduces Optio A10 Image Stabilization System Using Cypress’ PsoC

Hynix and M-Systems Introduces DOC Embedded Flash Drive (EFD)

Sonics Unveils a New S3220 SMART Interconnects Solution

Atmel Unveils New SoC Solution

Agere Systems Develops USB 2.0 SoC

Sunplus Unveils SPG290, a High-Performance System-on-a-Chip (SoC)

Renesas Introduces Two Single-Chip ICs

Renesas Unveils SH7397 32-Bit Microprocessor as a Single Chip Solution

STMicroelectronics Releases 90nm HDD SoC devices

Zoran Launches APPROACH 5, SoC for Mobile Handsets

SigmaTel Unveils New SoC Solution for Multi-Function Printers

CEVA Introduces a New DSP Architecture, the CEVA-X1621™

Conexant Systems Unveils Integrated Xenon SoC Solution

K-Micro Releases Topaz Computing Subsystem for SoCs

Samsung Electronics Introduces 90-nm SoCs for Mobile Applications

Magma and ARM Unveils an Advanced Implementation Solution for SoC Designs

Parama Networks Unveils Transport SoC Technology

Renesas Develops Advanced TTRAM for High-Speed and Low Power Consuming

Applications

Renesas Introduces Automated Device Sizing System for Use in SoCs

S2C Releases New Interconnect Technology for SoC Designs

PortalPlayer Introduces Two New Audio SoCs

LSI Logic Corporation Innovates RapidChip SoC Prototyping Platform

PRO/Wireless 5116 SoC from Intel

New SoC Solution from Micronas

Chipcon Innovates CC2431 ZigBee™ SoC Solution

Ziptronix Develops Three-Dimensional System-on-a-Chip Device

1st Silicon and ZFOUNDRY Develops A18 Technology

Chipcon Unveils CC2430 ZigBee SoC Solution

Cypress Unveils 1.3-Megapixel SoC and Image Sensor Solutions

Marvell Unveils VoWLAN SoC Solutions

Micron Technology Unveils New SoC Sensor

Mindspeed Technologies Introduces SoC Solution

BroadLight Unveils BL2000 SoC

STMicroelectronics Innovates SoC IC Devices

RF Micro Devices Releases SiW4000 Bluetooth SoC Solution

Vitesse Unveils Ethernet Switch System-on-a-Chip Solutions

Cypress Develops Programmable System-on-a-Chip, CY8C24794-24LFXI

Cypress Launches Programmable SoC, CY8C21x23

FS2 System Navigator from First Silicon Solutions

AMI Semiconductor Enhances its SmartPower SoC Mixed-Signal IC Technology

AMI Semiconductor Develops Miniature Single-Chip Stepper Motor Driver-Controller

ICs

Atheros Develops Integrated Single-Chip 802.11g Access Point Solution

Matsushita (Panasonic) Develops HD-PLC Technology for Home Networking

Applications

AXIOM Introduces MPSim™ System Verilog Verification

Provigent Launches PVG310 Single-Chip Modem

QUALCOMM and TSMC Jointly Develops 90-nm MSM™ Solutions

Renesas Offers Embedded DRAM Core for SoCs

RF Micro Unveils SiW4000™ SoC Bluetooth® Solution

Samsung Develops ViP Design Methodology for Significantly Reducing SoC Design

Time

QuickLogic Corporation Introduces New Programmable SoC Devices

New Solution for ESL Designs

Vitesse Develops Gigabit Ethernet Switches

Passave Develops SoC for EPON

Enpirion Unveils Power SoC Solution

CEVA Unveils Xpert-Palm

Agilent Offers SoC Solution for PDAs

Advantest Develops New T2000 MS Mainframe for Mid-Range SoC Devices

Advantest Introduces T6577 SoC Test System

15. Recent Industry Activity

ON Semiconductor Acquires AMI Semiconductor

Broadcom Takes Over Sunext Design

Broadcom Collaborates with Microsoft

Broadcom Along with Coship Provides HD Set-Top Box Solution in China

Zilog Signs Distribution Agreement with Nu Horizons

BroadLight partners with ITRI

ARC Extends Collaboration Agreement with Toshiba

Samsung Uses Integrated FM Radio and Bluetooth® SoC from Broadcom

NEC Opts Wipro to Provide Semiconductor Design Solutions

Axiom Invests US$3 Million for New R&D Center in India

Matsushita Implements IC Compiler of Synopsys

EtherWaves Acquires Sonarics

Silicon Image Acquires sci-worx

Cortina Systems Acquires ImmenStar

Wipro Acquires OTCS

Synopsys Acquires MOSAID IP Assets

BroadLight Collaborates with OpenCon Systems

Mindspeed Partners with Terawave

IC Nexus Partners with HDL Design House

Global Unichip Allies with Vivante Graphics

Jazz and Fujitsu Join Forces

Coronis Systems Partners with Essensium N.V

Global Unichip Opts Testing Solution from Synopsys

Core Logic to Establish Solution Center in China

Newark Signs Franchise Agreement with Cypress

Silicon Image Signs an Accord with Sunplus

ARC Signs Multiple Agreements

Global IP Sound Changes to Global IP Solutions

Faraday Forms an Alliance with Palmchip Corporation

CAST Enters into a Distribution Agreement with S2C

Renesas - ZMD Alliance to Introduce 900-MHz Band ZigBee® Chipset by 2008

Renesas Enters into an Agreement with Key Stream Corporation

Renesas and Matsushita into their Fifth Stage of Collaboration

Renesas Employs Synopsys’ VCS Verification Solution and VMM Methodology

Renesas Adopts Synopsys’ IC Compiler Solution

S2C Inc. is Tensilica® Inc.’s New Prototyping Partner in China

Sonics Inc.® Enters into an Agreement with Ricoh Company

MoSys Adopts SMIC’s CMOS Process Technology

e2v Opts Tower Semiconductor to Manufacture CMOS Image Sensors

Haier Group Adopts Broadcom’s Digital TV System-on-Chip Solution

AMI Semiconductor Acquires Assets of NanoAmp

AMD Acquires ATI Technologies

LSI Buys Metta Technology

NVIDIA Acquires PortalPlayer

PMC-Sierra Acquires Passave

Broadcom Purchases Sandburst

Texas Instruments Purchases Chipcon AS

Essensium Acquires Mind

inSilicon and Sonics Form an Alliance for Developing Plug-and-Play SoC

Platforms

Sonics and CoWare® Enter into a Distribution Agreement

BroadLight Enters into a Contract with Askey Computer

Actions Semiconductor and GMI Sign an Agreement

Mistletoe and eSilicon Develop an Integrated VPN-firewall SoC

Matsushita Collaborates with Renesas to Test 45-nm SoC Technology

Imagination Starts Operations in the US

Air Broadband Selects FMA’s WiMAX SoC Solution

ARM Licenses Advantage and Metro Products for 45 nm Technology

QUALCOMM Starts Production of 90nm Chips

eASIC Adds Two European Firms to Support Nextreme Line

Newport Grabs More Funds to Develop SoC Solutions

Sonics Inks an Agreement with CoWare

SMIC and ARC Sign A Joint Agreement

Toshiba Signs an Agreement with ARM

ARCA Licenses ARM926EJ-STM Processor

CMP Licenses ARM® RealView® ESL Tools

Freescale to License The V2 ColdFire Core

GCT Gets License for ARM926EJ-S™ Processor

MIPS and msystems Unite to Develop a Safe-SOC™ Security platform

Mobileye Obtains License for MIPS32® 34Kf™ Core

Extreme DA Collaborates with UMC

Scaleo chip Signs an Agreement with Wipro-NewLogic

Key ASIC Partners with Silterra Malaysia Sdn. Bhd

STMicroelectronics Partners with iBiquity Digital Corporation

SOCLE Employs UMC’s 90nm Process Technology

Wipro Technologies Partners with Tensilica’s Processor Core Design Center

Global Locate Partners with Toshiba to Roll Out Marlin™ A-GPS Chip

Renesas Design Vietnam Opts Synopsys as EDA Provider

CoWare Enters into a Strategic Agreement with Sonics

CoFluent Collaborates with Sonics Inc

Summit Sells SystemC-based Sonics SMART Interconnects Solutions

Bay Microsystems Acquires Parama Networks

Broadcom Acquires Athena Semiconductors

Cadence Acquires Verisity

MOSAID Takes Over Virtual Silicon

NVIDIA and ARM Enters into a Licensing Agreement

SkyPilot Enters into a Contract Agreement with Fujitsu Microelectronics for WiMAX

SoCs

Virage Logic Enters into an Agreement with UMC

ZAiQ Technologies Teams Up with S2C Inc

Synopsys Joins Forces with UMC

Marvell Enters into a Deal with UTStarcom

Tensilica Signs an Agreement with EVE

Global UniChip Signs an Agreement with Synopsys

Tower Semiconductor and Cadence Joins Forces

Silterra Teams Up with Essensium

White Electronic Designs Secures Contract for Supply of SoC Microprocessor

Modules

BroadLight Enters into a Licensing Agreement with MIPS Technologies for MIPS®

Processor

ARM Acquires Artisan Components

Flextronics Partners with inSilica for the Development of SoC Solutions

ARM, Artisan Components, NSC, Synopsys and UMC Collaborate for Advanced SoC

Technology

Ansoft Corporation Joins forces with Synopsys, Inc

Nordic Semiconductor Obtains New Components Contract in Europe

16. Related Product/Corporate Developments

Imagination Technologies Unveils New HD Video Decoder Core

Mobileye Selects SMART Interconnect Solution of Sonics

Cypress Semiconductor Introduces CY3630 Evaluation Kit for its Wireless Radio

SoCs

Renesas Technology Unveils Twin-Transistor RAM

New Products from Texas Instruments

K-Micro Develops Topaz Computing Subsystem

New Innovations from AMI Semiconductor

MemMax Memory Scheduler from Sonics, Inc

Sonics Inc. Unveils New Version of SonicsMX SMART Interconnect

SkyPilot Networks Selects SoC Solutions of Fujitsu Microelectronics

Agere Systems Deploys IC Compiler of Synopsys

Aperto Employs SoC Solutions of Fujitsu

Jazz Semiconductor Unveils Innovative Process Platform for Advanced RF and Analog

SoCs

Telairity Launches Unique Processor Architecture for High Definition Video

CoWare and Cadence Develop ESL Design Verification Flow

Advantest Unveils Mid-Range SoC Test Solution

Mentor Graphics Introduces Platform Express Product for SPIRIT 1.0 Norms

17. Focus on Select Players

Actel Corporation (US)

Altera Corporation (US)

ARC International (US)

ARM Holdings (UK)

Broadcom Corporation (US)

Core Logic (South Korea)

Freescale Semiconductor (US)

GCT Semiconductor Inc. (US)

Infineon Technologies (Germany)

Intel Corporation (US)

LSI Corporation (US)

Marvell Technology Group Ltd. (US)

Matsushita Electric Industrial Co., Ltd (Panasonic) (Japan)

Mentor Graphics Corporation (US)

NEC Electronics Corporation (Japan)

NVIDIA Corporation (US)

ON Semiconductors Corporation (US)

Palmchip Corporation (US)

Provigent Inc. (US)

Renesas Technology Corp. (Japan)

Samsung Electronics Co., Ltd. (South Korea)

STMicroelectronics N.V. (Switzerland)

Synopsys Inc. (US)

Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)

Texas Instruments (US)

Toshiba America Electronics Components (US)

Xilinx Inc. (US)

Zilog Inc. (US)

Ziptronix, Inc. (US)

18. Global Market Perspective

Table 15: World Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) by Geographic Region/Country - US, Canada, Japan, Europe, Asia-Pacific (Excluding Japan) and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart)




Table 16: World Long-term Projections for System-on-a-Chip (SoC) by Geographic Region/Country - US, Canada, Japan, Europe, Asia-Pacific (Excluding Japan) and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)




Table 17: World 10-Year Perspective for System-on-a-Chip (SoC) by Geographic Region/Country - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (Excluding Japan) and Rest of World Markets for 2004, 2008 and 2013 (includes corresponding Graph/Chart)




Table 18: World Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) by Product Type - SoCs Based on Standard Cell and SoCs Based on Embedded IP Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart)




Table 19: World Long-term Projections for System-on-a-Chip (SoC) by Product Type - SoCs Based on Standard Cell and SoCs Based on Embedded IP Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015(includes corresponding Graph/Chart)

Table 20: World 10-Year Perspective for System-on-a-Chip (SoC) by Product Type - Percentage Breakdown of Dollar Sales for SoCs Based on Standard Cell and SoCs Based on Embedded IP Markets for 2004, 2008 and 2013

Table 21: World Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) by End-Use Application - Computers, Communications Equipment, Consumer Electronics Devices, Automotive Applications and Other Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart)




Table 22: World Long-term Projections for System-on-a-Chip (SoC) by End-Use Application - Computers, Communications Equipment, Consumer Electronics Devices, Automotive Applications and Other Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)




Table 23: World 10-Year Perspective for System-on-a-Chip (SoC) by End-Use Application - Percentage Breakdown of Dollar Sales for Computers, Communications Equipment, Consumer Electronics Devices, Automotive Applications and Other Markets for 2004, 2008 and 2013 (includes corresponding Graph/Chart)

III. MARKET

1. North America

Semiconductors Market Perspective

An Overview of the SoC Market

1a. The United States

A. Market Analysis

Rise in SoC End-Use Sectors Drives the Growth

Technological Innovations Adds to Growth

The U.S. Companies Follows Outsourcing Strategy to Reduce Costs

Product Developments & Launches

Strategic Corporate Developments

Related Product/Corporate Developments

Focus on Select Players

Actel Corporation

Altera Corporation

ARC International

ARM-US

Atmel Corporation

AXIOM Design Automation

Broadcom Corporation

Sandburst Corporation

BroadLight, Inc

Cadence

Conexant Systems, Inc

CPU Technology, Inc

Cypress Semiconductor Corp

Enpirion

Eureka Technology

Freescale Semiconductor

Fujitsu Microelectronics

GCT Semiconductor Inc

IBM Microelectronics

Intel

LSI Corporation

Marvell Technology Group Ltd

Magma Design Automation

Mentor Graphics Corporation

Mindspeed Technologies

MIPS Technologies

Motorola

National Semiconductor

NEC Electronics America

NeoMagic Corporation

NVIDIA Corporation

ON Semiconductors Corporation

Palmchip Corporation

Palmchip Semiconductor

Bay Microsystems

PMC-Sierra

Provigent Inc

QuickLogic Corporation

RF Micro Devices

S2C Inc

SanDisk Corp

Sonics, Inc

Synopsys Inc.

Texas Instruments Incorporated

Toshiba America Electronics Components

Wipro Technologies

Xilinx Inc

Zilog Inc

Ziptronix, Inc

B. Market Analytics

Table 24: The US Recent Past, Current & Future Analysis for System- on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart)




Table 25: US Long-term Projections for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

1b. Canada

A. Market Analysis

Mosaid Technologies, Inc. - A Major Player

B. Market Analytics

Table 26: The Canadian Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart)




Table 27: Canadian Long-term Projections for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015(includes corresponding Graph/Chart)

2. Japan

A. Market Analysis

An Overview of Japanese Semiconductor Market

Consumer Profile

Foreign Players Ties-Up with Local Fabricators and Vendors

Local Companies Expands Customer Base

SoC Market Overview

Growth in IC Sector

Product Developments & Launches

Strategic Corporate Developments

Related Product/Corporate Developments

Focus on Select Players

Hitachi, Ltd

Matsushita Electric Industrial Co., Ltd (Panasonic)

NEC Electronics Corporation

Renesas Technology Corp

B. Market Analytics

Table 28: Japanese Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart)

Table 29: Japanese Long-term Projections for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

3. Europe

A. Market Analysis

Semiconductors Market Overview

SoC Market Overview

Semiconductors Market by European Regions - A Recent Past Perspective

Table 30: Semiconductors Market in Europe (2005 & 2006): Percentage Share Breakdown by Region/ Country for Germany, UK, France, Nordic Countries, Italy, Benelux Region and Rest of Europe (includes corresponding Graph/Chart)

Semiconductors Market by End-Use Sectors - A Recent Past Perspective

Table 31: Semiconductors Market in Europe (2005): Percentage Share Breakdown by End-Use Sector for EDP, Telecom, Automotive, Consumer, Industrial and Military & Others (includes corresponding Graph/Chart)

Consolidation Drives the Market

Market Trends

SoC Deployment Rises for the Automotive and the Communications Sector

Demand for Pre-Configured Functional IP Blocks Rising

Subcontracting Increases for Final SoC Products Assembly to Low- Cost European

Countries

Product Developments & Launches

Strategic Corporate Developments

Related Product/Corporate Development

Focus on Select Players

ARM Holdings (UK)

Essensium (Belgium)

Infineon Technologies (Germany)

NEC Electronics (Europe) (Germany)

Nordic Semiconductor (Norway)

OKI Electric Europe (Germany)

Samsung Electronics (UK)

STMicroelectronics N.V. (Switzerland)

B. Market Analytics

Table 32: European Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart)




Table 33: European Long-term Projections for System-on- a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

4. Asia-Pacific

A. Market Analysis

SoC Market Overview

Asia Emerges as a Major Market for SoC Deployment in Wireless Devices

China

India

From Just Design to Complete Solutions

Challenges Faced

South Korea

Integrated Circuits (ICs) Market - A Recent Past Perspective

Table 34: Integrated Circuits (ICs) Market in Korea (2005): Percentage Share Breakdown by End-Use Services for Corporate Management, Design & Development, Engineering Management, Test Engineering and Others (includes corresponding Graph/Chart)

Korean SoC Market on a Rise

Product Developments & Launches

Strategic Corporate Developments

Focus on Select Players

X-FAB Sarawak Sdn. Bhd. (Malaysia)

5V Technologies (Taiwan)

Core Logic (South Korea)

Dongbu HiTek Company Ltd. (South Korea)

EE Solutions (Taiwan)

Faraday Technology Corp. (Taiwan)

Global Unichip Corp. (Taiwan)

Hynix Semiconductor (South Korea)

ICNexus (Taiwan)

Insilica Semiconductors (India)

Integrated Circuit Solution (Taiwan)

Samsung Electronics Co., Ltd. (South Korea)

Silicon Motion Technology (Taiwan)

Silterra Malaysia Sdn. Bhd. (Malaysia)

Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)

United Microelectronics Corp. (Taiwan)

B. Market Analytics

Table 35: Asia-Pacific Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart)




Table 36: Asia-Pacific Long-term Projections for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

5. Rest of World

Market Analysis

Table 37: Rest of World Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart)


Table 38: Rest of World Long-term Projections for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

IV. COMPETITIVE LANDSCAPE

Total Companies Profiled: 189 (including Division/Subsidiaries - 211)

Region/Country Players

The United States 7

Canada 4

Japan 16

Europe 27

France 1

Germany 2

The United Kingdom 3

Rest of Europe 21

Asia-Pacific (Excluding Japan) 154

Middle East 3


Abstract

This report analyzes the worldwide markets for System-On-A-Chip (SOC) in US$ Million.The specific end-use segments analyzed are Computers, Communication Equipment, Consumer Electronic Devices, Automotive Applications, and Others (Including Industrial Automation, Military, Medical and Other Applications). The major types of SOCs also analyzed are SoCs Based on Standard Cell, and SoCs Based on Embedded IP.The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual forecasts are provided for each region for the period of 2004 through 2015. The report profiles 189 companies including many key and niche players worldwide such as Actel Corporation, Altera Corporation, ARC International, ARM Holdings, Broadcom Corporation, Core Logic, Freescale Semiconductor, GCT Semiconductor Inc., Infineon Technologies, Intel Corporation, LSI Corporation, Marvell Technology Group Ltd., Matsushita Electric Industrial Co., Ltd, Mentor Graphics Corporation, NEC Electronics Corporation, NVIDIA Corporation, ON Semiconductors Corporation, Palmchip Corporation, Provigent, Inc., Renesas Technology Corp., Samsung Electronics Co., Ltd., STMicroelectronics N.V, Synopsys Inc., Taiwan Semiconductor Manufacturing Co. Ltd., Texas Instruments, Toshiba America Electronics Components, Xilinx, Inc., Zilog Inc., and Ziptronix, Inc. Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.

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