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Worldwide Mobile Phone Semiconductor 2007–2011 Forecast UpdatePublished by: IDC Published: Dec. 6, 2007 - 33 Pages Table of ContentsTable of Contents IDC Opinion In This Study Scope Methodology Situation Overview Connectivity and Multimedia Processing Continue to Drive Growth Connectivity Growth Continues to Add Radios and Functionality to Mobile Phones Multimedia Growth Prompts Continued Demand for Memory and Processing Future Outlook Forecast and Assumptions 3G and 3.5G Growth Continues to Gain on 2.5G Share Figure: Worldwide Mobile Phone Semiconductor Revenue by Air Interface Generation, 2007?2011 Table: Worldwide Mobile Phone Semiconductor Revenue by Air Interface Standard, 2007-2011 ($B) Asia/Pacific and ROW Continue to Drive Mobile Phone Semiconductor Growth Figure: Worldwide Mobile Phone Semiconductor Revenue Share by Region, 2007 and 2011 Table: Worldwide Mobile Phone Semiconductor Revenue by Region, 2007-2011 ($B) Multimedia-Related Semiconductor Content Continues to Drive Growth Figure: Worldwide Mobile Phone Semiconductor Revenue Share by Semiconductor Device, 2007?2011 Table: Worldwide Mobile Phone Semiconductor Revenue by Device, 2007-2011 ($M) Average Mobile Phone Semiconductor BOMs Costs Continue to Decline Figure: Worldwide Weighted Average Semiconductor BOM Cost by Air Interface Generation, 2007?2011 Table: Worldwide Weighted Average Semiconductor BOM Cost by Air Interface Standard, 2007-2011 ($) Memory Content Grows and Mix Continues to Shift Figure: Worldwide Mobile Phone Memory Revenue Share by Memory Type, 2007?2011 Connectivity Chipsets Continue to Drive Revenue Growth Figure: Worldwide Mobile Phone Semiconductor Revenue by Connectivity by Type, 2007?2011 Forecast Assumptions Table: Key Forecast Assumptions for the Worldwide Mobile Phone Semiconductor Market, 2007-2011 Market Context Table: Worldwide Mobile Phone Semiconductor Revenue, 2007-2011: Comparison of April 2007 and October 2007 Forecasts ($B) Figure: Worldwide Mobile Phone Semiconductor Revenue, 2007?2011: Comparison of April 2007 and October 2007 Forecasts Essential Guidance Integration Is Key Learn More Related Research Appendix: Detailed Bill of Materials Costs Table: Average 3.5G Mobile Phone Semiconductor BOM Cost by Detailed Subsystem, 2007-2011 ($) Table: Average 3G Mobile Phone Semiconductor BOM Cost by Detailed Subsystem, 2007-2011 ($) Table: Average 2.5G Mobile Phone Semiconductor BOM Cost by Detailed Subsystem, 2007-2011 ($) Table: Average 2G Mobile Phone Semiconductor BOM Cost by Detailed Subsystem, 2007-2011 ($) Table: Average Mobile Phone Semiconductor BOM Cost by Detailed Subsystem, 2007-2011 ($) Definitions Subsystems Semiconductor Components Systems Cellular Air Interface Standards Table: Worldwide Cellular Air Interface Standards Synopsis AbstractThis IDC study includes market forecast data and analysis on a worldwide basis for the mobile phone semiconductor market for 2007?2011. This document provides segmentation by various air interface standards in 2G, 2.5G, 3G, and 3.5G technologies; by major semiconductor device type; and by geographic region. It also provides comprehensive data on semiconductor BOM costs by air interface standard and component subsystem. Further detail is provided by component for each air interface. Key forecast assumptions are identified, and their potential impact on the mobile phone semiconductor market is discussed. A comparison of the current forecast to the prior forecast is also noted. "Connectivity and multimedia continue to be drivers in the mobile phone semiconductor market as mobile phones increasingly include data processing and entertainment functionality. Mobile phone semiconductor revenue is expected to grow at a 1.9% CAGR through 2011." ? Flint Pulskamp, program manager, Wireless Semiconductors Get Full Details About This Report >> |
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