EDC sails out of LRM harbor : Market Research Report

EDC sails out of LRM harbor

Published by: Ovum Plc

Published: Apr. 10, 2008 - 10 Pages

Application drivers changing: LRM now available but still slow to ramp; SFP+ changes the game; EDC for SFP+ must appeal to system designers; System vendors are also customers for backplane applications; What more is needed?; SFP+ still looking for improvement; Technology choices and business strategy; Multiple tech choices make for complex competitive positioning; Digital vs. analog schism is really shades of gray; SerDes vs. CDR schism; Secondary markets emerging; Copper twin-ax and backplane KR included; Business climate; Vendor landscape; Predictions; EDC increasingly part of standard toolkit from backplane to long-haul as speeds move past 10Gbps
Table of figures: Figure 1 XAUI-based SFP+ board design concept; Figure 2 XFP and X2 module applications using CDR with EDC; Table 1 Product comparison of LRM EDC chips

Abstract

Vendors showcased improved versions of EDC (electronic dispersion compensation) chips at the OFC/NFOEC conference in February. Though all aimed at the LRM modules market initially, EDC chips are now vying for design sockets on system boards that support SFP+ form factors. As uncertainty continues to cloud the LRM market, EDC is tackling additional applications including copper.

Get Full Details About This Report >>

US: 800.298.5699

Int'l: +1.240.747.3093

About MarketResearch.com
MarketResearch.com is an online aggregator selling over 160,000 market research reports, company profiles and country profiles from over 600 research firms. Our reports will provide you with the critical business and competitive intelligence you need for strategic planning and marketing research. Coverage includes the US, UK, Europe, Asia and global markets.

EDC sails out of LRM harbor

Table of Contents

Abstract