Printed and Thin Film Transistors and Memory 2008-2028 : Market Research Report

Printed and Thin Film Transistors and Memory 2008-2028

Published by: IDTechEx Ltd

Published: Jun. 1, 2008 - 339 Pages

1. INTRODUCTION: 1.1. Importance of printed and potentially printed electronics; 1.2. Importance of printed and thin film transistors and memory; 1.3. Transistor basics and value chain; 1.4. Transistor geometry and parameters; 1.5. Choice of materials for these transistors; 1.6. Choice of semiconductor; 1.7. Substrates; 1.8. Printing processes
2. ORGANIC TRANSISTORS AND MEMORY - DEVELOPMENTS: 2.1. History and prospective benefits; 2.2. PolyApply program of the European Commission; 2.3. RFID labels from Poly IC; 2.4. Lowest performance, lowest cost - ACREO; 2.5. Organic dielectrics and ferroelectrics
3. INORGANIC COMPOUND TRANSISTORS - DEVELOPMENTS: 3.1. History and summary of potential benefits; 3.2. Semiconductors; 3.3. Inorganic dielectrics in devices; 3.4. Chromium based technology
4. TECHNOLOGY AND SUPPLIERS - LARGE MEMORY: 4.1. Types of memory; 4.2. Big difference in making small vs large memory; 4.3. Strategy of various developers of thin film and printed memory
5. TECHNOLOGY AND SUPPLIERS -CONDUCTORS: 5.1. Organic vs inorganic conductors; 5.2. Organic conductors; 5.3. Inorganic conductors; 5.4. Carbon nanotubes
6. MARKETS 2007-2027: 6.1. Forecasts 2007-2027; 6.2. Assumptions for our forecasts; 6.3. Split between backplane, RFID and other applications to 2017; 6.4. Size of relevant markets that are impacted; 6.5. Potential for non-RFID electronic labels; 6.6. Potential for RFID labels 2007-2017; 6.7. Market for RFID; 6.8. Impact on silicon; 6.9. Forecasts for materials; 6.10. Impediments to the commercialisation of printed transistors and memory
7. COMPARISON OF ORGANISATIONS INVOLVED IN TFTCS AND THEIR MATERIALS: 7.1. Semiconductor, process, geometry, targets, challenges and objectives for 80 organisations in printed and thin film transistors and/ or memory; 7.2. Profiles of 100 organisations in printed and thin film transistors and/ or memory
APPENDIX 1: IDTECHEX PUBLICATIONS AND CONSULTANCY
APPENDIX 2: GLOSSARY
TABLES: 1.1. Envisaged benefits of TFTCs in RFID and other low-cost applications when compared with envisaged silicon chips; 1.2. Typical carrier mobility in different potential TFTC semiconductors (actual and envisaged); 1.3. Properties of the Polyera/ BASF n type printing ink for organic field effect transistors consisting of N,N Dioctyl-dicyanoperylene-3,4:9,10-bis(dicarboxyamide), PD18-CN2; 2.1. Printable polymer transistor dielectric PE-DI-1900 from BASF and Polyera; 3.1. A summary of the promised benefits of polymer ink used in pilot production of organic transistors vs two thin film inorganic semiconductors for transistors vs nanosilicon ink; 3.2. Some properties of new thin film dielectrics; 4.1. Some of the small group of contestants for large capacity printed memory.; 5.1. Benefits and challenges of organic vs inorganic conductors for printed and thin film transistors, memory and their interconnects.; 5.2. Conductance in ohms per square for the different printable conductive materials compared with bulk metal; 5.3. Examples of ink suppliers progressing printed RFID antennas etc; 5.4. Some companies progressing ink jettable conductors; 5.5. Comparison of metal etch (e.g. copper and aluminium) conductor choices; 5.6. Electroless metal plate - Additive print process with weakly conductive ink (e.g. plastics or carbon) followed by wet metal plating; 5.7. Electro metal plate - Additive print process with weakly conductive ink (e.g. plastics or carbon) followed by dry metal plating; 5.8. Printable metallic conductors cure at LT e.g. silver based ink; 5.9. A typical process cost comparison for RFID antennas; 5.10. Possibilities for various new printed conductors.; 5.11. Charge carrier mobility of carbon nanotubes compared with alternatives; 6.1. Global market for printed electronics logic and memory 2007-2027 in billions of dollars, with % printed and % flexible; 6.2. Primary assumptions of organic electronics in full production 2007 to 2025; 6.3. Global electronics industry by application; 6.4. End user markets relevant to printed electronics; 6.5. Global semiconductor shipments monthly and three month average 1983 to 2005; 6.6. Statistics for electronic labels and their potential locations; 6.7. Number (in millions) of tags by application 2007-2017; 6.8. Total value of tags by application 2007-2017 (US Dollar Millions); 6.9. Choices of digital chipless RFID technologies; 6.10. Chipless versus Chip RFID, in numbers of units (billions); 6.11. Market size of a variety of chipless solutions, $ millions; 6.12. Scope for printed TFTCs to create new markets or replace silicon chips; 7.1. Objectives and challenges of 80 organisations developing printed and potentially printed transistor and/ or memory circuits and/or their materials; 7.2. Objectives and challenges of 23 organizations developing inks and their materials for printed and potentially printed transistors and memory; 7.3. 42 organisations that developing TFTCs and their materials and their priorities for products to be sold; 7.4. Typical quantum dot materials from Evident and their likely application.; 7.5. Other players in the value chain
FIGURES: 1.1. Growth in sales of silicon chips by value compared with growth in sales of printed and thin film electronic components.; 1.2. Examples of the radically new capabilities of printed electronics.; 1.3. Types of early win and longer term project involving printed electronics 1995-2025; 1.4. Logic circuits printed by PolyIC in Germany using a reel to reel process; 1.5. Plastic film scanner; 1.6. The value chain for manufacturing of printed electronics; 1.7. Value chain for TFTCs and examples of migration of activity for players; 1.8. Traditional geometry for a field effect transistor; 1.9. Vertical organic field effect transistor VOFET showing a short channel length and a large cross section for current flow. The substrate is shown at the bottom.; 1.10. ORFID view of the problems of the traditional horizontal transistor; 1.11. Examples of vertical transistors; 1.12. ORFID VOFET approach; 1.13. The Plastic E print process; 1.14. Structure of SSD diode and device operation; 1.15. Principle of self aligned printing by Plastic Logic; 1.16. Prevalence of organic vs inorganic materials in printed and thin film electronics today; 1.17. PEDOT:PSS; 1.18. Motorola summary of thin film FET issues concerning the dielectric layer .; 1.19. Motorola view of available gate materials; 1.20. The simple capacitor like structure for many printed devices including memory; 1.21. Choices of substrate for printed electronics; 1.22. Change in stiffness of PET vs PEN substrate material with temperature.; 1.23. Biaxially oriented crystalline film; 1.24. Factors influencing film choice- property set; 1.25. Some candidate materials for flexible substrates; 1.26. Requirements in printing thin film transistors; 1.27. The big picture for printing transistors and memory in ever increasing numbers; 1.28. Reel to reel printing of transistors and complete RFID labels by Poly IC; 1.29. Options for high speed, low-cost printing of TFTCs; 1.30. Choice of printing technology for silver RFID antennas today, where Omron and Avery Dennison use gravure despite volumes being no more than hundreds of millions.; 1.31. Performance improvement in thermal ink jet over the years.; 1.32. Benefits of ink jet printing of electronics; 1.33. Thermal ink jet printed transistor evolution; 1.34. Hybrid process improves performance; 1.35. Transfer printed GaAs FETs on PET; 1.36. Semprius opportunity space; 2.1. Reel to reel printing of TFTCs; 2.2. ACREO technology platform; 2.3. Components of the ACREO low functionality approach to transistors; 2.4. ACREO electrochemical transistors; 2.5. Electrochemical components electrical effects; 2.6. ACREO electrochemical transistors; 2.7. ACREO objectives for electrochemical transistor circuits; 2.8. ACREO electrochemical timer transistor; 2.9. ACREO matrix addressed display.; 2.10. Interactive games printed on paper; 2.11. Concept demonstrator integrating printed electrochemical components and its patented "Dry Phase Patterning" of metal conductors.; 2.12. ACREO applicational ideas; 3.1. Early Hewlett Packard work on ink jet printing of inorganic compound semiconductors; 3.2. Printed flexible inorganic semiconductor; 3.3. Transparent transistor; 3.4. Material choices for transparent transistors; 3.5. Amorphous thin film inorganic dielectric; 3.6. Example of ZnO based transistor circuit that is transparent.; 3.7. Using a nanolaminate as an e-platform; 3.8. TEM images of solution processed nanolaminates; 3.9. Cross-sectional schematic view of an amorphous oxide TFT; 3.10. Transparent and flexible active matrix backplanes fabricated on PEN films; 3.11. Semprius transfer printing; 3.12. Motorola high permittivity printable OFET dielectric using a barium titanate organic nanocomposite.; 3.13. Hybrid organic-inorganic transistor and right dual dielectric transistor; 3.14. Motorola high permittivity printable OFET dielectric using a barium titanate organic nanocomposite.; 3.15. Motorola results - the nanotechnology used; 3.16. Lower operating voltage; 3.17. NHK transistor on polycarbonate film with tantalum oxide gate.; 4.1. An all-organic permanent memory transistor; 4.2. TFE memory compared with the much more complex DRAM in silicon; 4.3. Structure of TFE memory; 4.4. TFE priorities for commercialisation of mega memory; 5.1. InkTec soluble silver inks. Left: Transparent Electronic Ink. Right: Transparent Inkjet Inks; 5.2. Patterning using InkTec ink; 5.3. Properties and morphology of single walled carbon nanotubes; 6.1. Global market for printed electronics logic and memory 2007-2027 in billions of dollars, with the percentage that will be printed and the percentage that will be flexible; 6.1. Organic semiconductor projection by IBM; 6.2. Sales of printed and potentially printed transistors and memory by application in 2010; 6.3. Sales of printed and potentially printed transistors and memory by application in 2013.; 6.4. Sales of printed and potentially printed transistors and memory by application in 2013; 6.5. Potential, in billions yearly, for global sales of RFID labels and circuits printed directly onto products or packaging. Item level is shown in red. These are examples.; 7.1. Fujitsu "electronic paper" display; 7.2. Researchers and users play major roles with active logistic support from JST; 7.3. High Mobility OTFT; 7.4. Summary and Conclusion; 7.5. LG Chemical spun-off into LG Chem Investment (LGCI), LG Chem and LG Household & Healthcare.; 7.6. NanoMas technology; 7.7. PARC have developed innovative displays; 7.8. Materials and devices. Fully printed RFID tag in development.; 7.9. Fully printed EAS (anti theft) tag shown on website.; 7.10. Left is diode logic OR gate and the right is a bridge rectifier; 7.11. Micrograph of an SSD array and the 110 GHz microwave measurement setup; 7.12. Prototype HF tag and reader; 7.13. 10 nm holes and 40 nm pitch in PMMA fabricated by nanoimprint lithography; 7.14. The first room-temperature silicon single electron memory.; 7.15. Samsung OLED display; 7.16. A circuit by Associate Professor Zhenan Bao.

Abstract

Printed electronics will be a $300 billion market within 20 years. The largest segment will be printed transistors and memory. They will drive lighting, displays, signage, electronic products, medical disposables, smart packaging, smart labels and much more besides. The chemical, plastics, printing, electronics and other industries are cooperating to make it happen. Already, over 150 organisations are developing printed transistors and memory, with first products being sold in 2008.

This 339 page report is intended for those wishing to see the big picture and those new to the subject. There are no equations or academic references and the text will be readily understandable for those from all the industries now seeking a place in this value chain. There is a profusion of illustrations to bring the subject alive and detailed comparison charts explain and compare everything at a glance - from choice of substrates and inks to the smart products resulting and the progress of over 150 organisations in making it all happen.

Those with basic training in physics, chemistry and electronics will find much to inform them. Those with no scientific training will also be able to see the big picture, the issues and the winners and losers because appendices and a glossary help them with the background and the terminology. Above all, this report is very up to date, having been fully researched globally in 2007 and 2008. Do not follow the herd into the well aired aspects of this subject. Gain advantage by understanding all the important aspects and opportunities.

Whether you intend to be a user, seller or researcher, consider the new InGaZnO semiconductors, the single layer geometry, the multi-function transistors, the printed silicon transistors and many other advances. Understand the enormous amount of work going on in Korea, Japan, Taiwan, the USA, Germany and the UK. See why no printing technology is ideal and what comes next. Although the press talks of transistors only working at the lower frequencies and modest memory capability in printed form, some of these devices work at terahertz frequency and some promise a gigabyte on a postage stamp for only a few cents and the one cent RFID tag before very long.

There is much more to printed electronics than commonly appears in press reports and research papers. This is a huge revolution impacting most aspects of human endeavour. Billion dollar suppliers will be created and even the smallest organisations involved are already signing deals with some of the largest - there is room for everyone.

Those thinking that this is all about organic electronics are boxing themselves into a corner. Those that think that printed transistors and memory are being developed by the few companies often mentioned in the press are missing the work at over 150 organisations, most of it very exciting indeed. The companies are distributed as follows.

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Printed and Thin Film Transistors and Memory 2008-2028

Table of Contents

Abstract