Electronic Thermal Management

Published by: Global Industry Analysts

Published: Mar. 1, 2008 - 584 Pages

Table of Contents

I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

Study Reliability and Reporting Limitations

Disclaimers

Data Interpretation & Reporting Level

Quantitative Techniques & Analytics

Product Definitions and Scope of Study

End-Use Segments

Computers

Telecom

Medical/Office Equipment

Industrial/Military

Consumer Electronics

Automotive

Product Segments

Hardware

Software

Interfaces and Substrates

II. EXECUTIVE SUMMARY

1. Industry Overview

Sophisticated Technology Needs Effective Thermal Management

Current and Future Analysis

Regional Perspective

End-Use Perspective

Product Segment Perspective

2. Market Trends

Rising Complexities Present Lucrative Opportunities for Electronic Thermal

Management

PC Market Stimulates Growth

Thermal Management Subsystems Set for Robust Growth

New Technologies Under Development

Liquid Cooling Gaining Foothold

Semiconductor Manufacturers Look for Thermal Management Technology

Heat Pipe Gains Popularity among PC Manufacturers

Imminent Growth for ICs

3. Product Overview

Thermal Management - A Critical

Function

Electronic Thermal Management Products

Hardware

Heat Sinks

Heat Pipes

Micro Channels

Spray Cooling

Electronic Cooling Fans

Metal Backplanes

BGAs

Software

Computational Methods of Heat Transfer (CHT) and Fluid Dynamics (CFD)

Electronic Design Automation (EDA) Software, Electronic Computer Aided Design (ECAD)

Software, and Technology Computer Aided Design (TCAD) Software

Interfaces and Substrates

Thermal Compounds and Thermal Interface Materials

Thermal Management Applications

Computers

Notebooks/Laptops

Servers

Embedded PCs

Telecom

Medical

Industrial Electronics

Aerospace/Military

Consumer Electronics

Automotive

4. Competitive Environment

Thermal Management - A Fragmented Market

Table 1: Leading Vendors in the Worldwide Thermal Management Market (2006 & 2007) - Percentage Breakdown by Value Sales for Amkor, Aavid Thermalloy, Fluent, Chomerics, Kyocera, and Others (includes corresponding Graph/Chart)

Thermal Management Hardware Market

Table 2: Leading Players in the Worldwide Thermal Management Hardware Market (2006 & 2007) - Percentage Breakdown by Value Sales for Aavid Thermalloy, Thermacore, Lytron, and Others (includes corresponding Graph/Chart)

Fluent - The Undisputed Thermal Management S/W Market Leader

Table 3: Leading Players in the Worldwide Thermal Management Software Market (2006 & 2007) - Percentage Breakdown by Value Sales for Fluent, Ansys, Flomerics, Daat, and Others (includes corresponding Graph/Chart)

Chomerics and Bergquist Lead Thermal Management Interface Market

Table 4: Leading Players in the Worldwide Thermal Management Interface Market (2006 & 2007) - Percentage Breakdown by Value Sales for Chomerics, Bergquist, Aavid Thermalloy, Lytron, and Others (includes corresponding Graph/Chart)

Amkor Dominates Thermal Management Substrate Market

Table 5: Leading Players in the Worldwide Thermal Management Substrate Market (2006 & 2007) - Percentage Breakdown by Value Sales for Amkor, Kyocera, ST ChipPAC, OSE, ASAT, and Others (includes corresponding Graph/Chart)

5. Technological Development

Heat Alleviation Technologies for Electronics

6. Product Developments/Introductions

SMART Releases Liquid-Cooled VLP DDR2 Registered DIMMs

LORD Develops Materials for Thermal Management

Dow Corning Introduces New Thermally Conductive Compound

Astrosyn Unveils a Range of Slide-fit Heatsink Enclosures

Dell Develops a Liquid-Cooled Heat Sink

Fujipoly America Develops an Innovative Thermal Interface Material

Flomerics to Offer T3Ster Thermal Testing System

Andigilog® Develops ThermalEdge™ Cooling Technology

Andigilog® Introduces Thermal Management Solutons

Celsia Releases MicroSpreader™

Sunon Develops Liquid Circulation Cooling System

EBM-PAPST Develops Advanced Liquid Cooling System

EBM-PAPST Introduces New Fan-Cooling Technology

Hybricon Introduces Liquid-Cooled ATR Chassis

Ansoft Launches Latest Version of ePhysics as ePhysics v2

CTS Launches New Line of Low-Profile Forged Heat Sinks

Honeywell Introduces Screen Printable Phase Change Material in Chip

Manufacture

Laird Launches Thermally Conductive, Electrically Insulating T-preg™ HTD for

PCBs

Laird Introduces Deep Drawing Capability for Shielding Applications

Laird Introduces Low-Cost T-Gard™ for SMPS Devices

Laird Introduces T-Gard™ 500 High Performance Insulator for Automotive

Industry

Jaro Develops 450 CFM AC Cooling Fan for Industrial Use

Jaro Develops IC Cooling Fan With High Flow and Cooling Value

Mathis Develops Mathis TCi™ For Improved Thermal Conductivity Testing

Melcor Introduces Extrusion Heat Sinks With Improved Performance

Fluent Launches New Environmental Thermal Audit Solution for Data Centers

Kooltronic Introduces Advanced Enclosure Accessories

Pfannerberg Develops Filterfan®

Vette Introduces BGA Thermal Solutions

Sp3 Launches New DiaThermm™ Diamond Heat Spreaders

Andigilog Releases SC7511 as First in the Series of Intelligent Thermal Management

Products

Degree Controls’ Develops Cooling Products

Dow Corning Launches Innovative Thermal Management Solutions

CPS’ Metal Matrix Combination Delivers Sophisticated Thermal Management

7. Recent Industry Activity

Moog Takes Over Thermal Control Products

Rensselaer Teams Up with Varsities to Develop Cooling Techniques

Laird Partners with Sager Electronics

Honeywell to Expand R&D Facility

Modine to Divest Thermacore

Vette Adds ERM

Laird Takes Over Supercool

Arlington Capital Acquires Woven Electronics Through Thermal Solutions

Parker Hannifin Purchases Acofab and Adecem

Ametek Adds Land Instruments

Lytron Adds Lockhart Industries

Seki Technotron Purchases 10% Interest in sp3 Inc

OnScreen Purchases Patent of WayCool Thermal Cooling Technology

Flomerics Acquires NIKA

Aavid Merges with Ansys and Spins-Off Thermal Management Business

Celsia and Yeh-Chiang Sign Agreement

Nextreme Inks License Deal with Caltech

Celsia Signs Sales & Development Pact with Lighting Science

Celsia Contracts with Kubo to Expand in Japan

Hybricon and Parker Hannifin Sign Pact for Cooling Solutions

Rogers and Thermal Transfer Composites Partner

sp3 Partners with CPS

Celsia Teams Up with AET

Mathis Forms Distribution Partnership with Setaram Instrumentation

Pentair Takes Over APW’s Thermal Management Operations

Helix Acquires IGC Polycold

iCurie Signs Marketing and Sales Agreement with Advanced Energy Technology

ISR Enters into Agreement with US Air Force to Develop Advanced Thermal Management

System for Military Aircrafts

Symmetry Electronics to Market Andigilog’s Thermal Management System

ISR Starts Commercial Division for Advanced Electronics

Vette Takes Over Shun Fu Metal Products

Laird Acquires Thermagon

AMETEK Acquires Hughes-Treitler

8. Focus on Select Global Players

II-VI, Incorporated (USA)

Marlow Industries (USA)

Aavid Thermalloy, LLC (USA)

Advanced Thermal Solutions, Inc. (USA)

Alcoa, Inc. (USA)

Alpha Metals (USA)

Alpha Technologies Group, Inc. (USA)

Ametek, Inc. (USA)

Amkor Technology, Inc. (USA)

Ansoft Corporation (USA)

Ansys, Inc. (USA)

Fluent, Inc. (USA)

ASAT Holdings Ltd. (Hong Kong)

Brush Engineered Materials, Inc. (USA)

CTS Corporation (USA)

Comair Rotron, Inc. (USA)

Ceramics Process Systems Corporation (USA)

Chomerics (USA)

Cool Innovations, Inc. (USA)

Cooler Master Co., Ltd. (UK)

Daat Research Corp. (USA)

Degree Controls, Inc. (USA)

Dow Corning Corporation (USA)

Dynatron Corporation (USA)

Enertron, Inc. (USA)

Flomerics (UK)

Fujikura Ltd. (Japan)

Henkel Loctite Corporation (USA)

Honeywell Electronic Materials (USA)

Isonics Corporation (USA)

Intricast Company Inc (USA)

ITW Vortec (USA)

JARO Components, Inc. (USA)

Kooltronic, Inc. (USA)

Kyocera Corporation (Japan)

Laird Technologies (USA)

Liebert Corporation (USA)

Lord Corporation (USA)

Lytron Incorporated (USA)

Mathis Instruments Ltd (Canada)

Melcor Corporation (USA)

Metal Matrix Cast Composites, LLC (USA)

Micronel U.S. (USA)

Netzsch Instruments, Inc. (USA)

Netzsch Thermal Analysis (Germany)

NMB Technologies Corporation (USA)

Noren Products, Inc. (USA)

Orient Semiconductor Electronics Ltd. (Taiwan)

PC Power & Cooling, Inc. (USA)

Pfannenberg, Inc. (USA)

PLANSEE Thermal Management Solutions (USA)

R-Theta Thermal Solutions, Inc. (Canada)

Sumitomo Electric Industries, Ltd. (Japan)

Tech Spray, L. P. (UK)

Tellurex Corp. (USA)

The Bergquist Company (USA)

The Filter Factory, Inc. (USA)

Thermacore (USA)

Transene Company, Inc. (USA)

Tennmax United (USA)

U.S. Toyo Fan Corporation (USA)

United Thermal Engineering Corporation (USA)

Vette Corp. (USA)

Wakefield Thermal Solutions, Inc. (USA)

9. Global Market Perspective

Table 6: World Recent Past, Current & Future Market Analysis for Electronic Thermal Management by Product Segment- Hardware, Software, and Interfaces & Substrates Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)

Table 7: World Recent Past, Current & Future Market Analysis for Electronic Thermal Management by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)

Table 8: World 10-Year Perspective for Electronic Thermal Management by Product Segment - Percentage Breakdown of Dollar Sales for Hardware, Software, and Interfaces & Substrates Markets for Years 2003, 2007 & 2012 (includes corresponding Graph/Chart)

Table 9: World 10-Year Perspective for Electronic Thermal Management by Geographic Region - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2003, 2007 & 2012 (includes corresponding Graph/Chart)

Table 10: World Recent Past, Current & Future Market Analysis for Electronic Thermal Management in Computers by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)

Table 11: World 10-Year Perspective for Electronic Thermal Management in Computers by Geographic Region - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2003, 2007 & 2012 (includes corresponding Graph/Chart)

Table 12: World Recent Past, Current & Future Market Analysis for Electronic Thermal Management in Telecom by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)

Table 13: World 10-Year Perspective for Electronic Thermal Management in Telecom by Geographic Region - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2003, 2007 & 2012 (includes corresponding Graph/Chart)

Table 14: World Recent Past, Current & Future Market Analysis for Electronic Thermal Management in Medical/Office Equipment by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)

Table 15: World 10-Year Perspective for Electronic Thermal Management in Medical/Office Equipment by Geographic Region - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2003, 2007 & 2012 (includes corresponding Graph/Chart)

Table 16: World Recent Past, Current & Future Market Analysis for Electronic Thermal Management in Industrial/Military by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)

Table 17: World 10-Year Perspective for Electronic Thermal Management in Industrial/Military by Geographic Region - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2003, 2007 & 2012 (includes corresponding Graph/Chart)

Table 18: World Recent Past, Current & Future Market Analysis for Electronic Thermal Management in Consumer Electronics by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)

Table 19: World 10-Year Perspective for Electronic Thermal Management in Consumer Electronics by Geographic Region - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2003, 2007 & 2012 (includes corresponding Graph/Chart)

Table 20: World Recent Past, Current & Future Market Analysis for Electronic Thermal Management in Automotive by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)

Table 21: World 10-Year Perspective for Electronic Thermal Management in Automotive by Geographic Region - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest of World Markets for Years 2003, 2007 & 2012 (includes corresponding Graph/Chart)

III. MARKET

1. United States

A. Market Analysis

Current and Future Analysis

By End-Use Segment

By Product Segment

Rising Complexities Present Lucrative Opportunities for Electronic Thermal

Management

Price Pressures and Shifting of Manufacturing to Asia to Restrain Growth

Product Developments/Introductions

Strategic Corporate Developments

Key Players

B. Market Analytics

Table 22: US Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment - Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)

Table 23: US Recent Past, Current & Future Analysis for Electronic Thermal Management by Product Segment - Hardware, Software, and Interfaces & Substrates Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)

Table 24: US 10-Year Perspective for Electronic Thermal Management by End-Use Segment - Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for 2003, 2007 & 2012 (includes corresponding Graph/Chart)

Table 25: US 10-Year Perspective for Electronic Thermal Management by Product Segment - Percentage Breakdown of Dollar Sales for Hardware, Software, and Interfaces & Substrates Markets for 2003, 2007 & 2012 (includes corresponding Graph/Chart)

2. Canada

A. Market Analysis

Current and Future Analysis

Product Development

Strategic Corporate Development

Key Players

B. Market Analytics

Table 26: Canadian Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment - Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)

Table 27: Canadian 10-Year Perspective for Electronic Thermal Management by End-Use Segment - Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for 2003, 2007 & 2012 (includes corresponding Graph/Chart)

3. Japan

A. Market Analysis

Current and Future Analysis

Strategic Corporate Development

Key Players

B. Market Analytics

Table 28: Japanese Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment - Computers, Telecom, Medical/ Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)

Table 29: Japanese 10-Year Perspective for Electronic Thermal Management by End-Use Segment - Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for 2003, 2007 & 2012 (includes corresponding Graph/Chart)

4. Europe

A. Market Analysis

Current and Future Analysis

Strategic Corporate Developments

Key Players

B. Market Analytics

Table 30: European Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment - Computers, Telecom, Medical/ Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)

Table 31: European 10-Year Perspective for Electronic Thermal Management by End-Use Segment - Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for 2003, 2007 & 2012 (includes corresponding Graph/Chart)

5. Asia Pacific

A. Market Analysis

Current and Future Analysis

Taiwan Market Scenario

Strategic Corporate Developments

Key Players

B. Market Analytics

Table 32: Asia-Pacific Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment - Computers, Telecom, Medical/Office Equipment, Industrial/ Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)

Table 33: Asia-Pacific 10-Year Perspective for Electronic Thermal Management by End-Use Segment - Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for 2003, 2007 & 2012 (includes corresponding Graph/Chart)

6. Rest of World

Market Analysis

Current and Future Analysis

Table 34: Rest of World Recent Past, Current & Future Analysis for Electronic Thermal Management by End-Use Segment - Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2012 (includes corresponding Graph/Chart)

Table 35: Rest of World 10-Year Perspective for Electronic Thermal Management by End-Use Segment - Percentage Breakdown of Dollar Sales for Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive Markets for 2003, 2007 & 2012 (includes corresponding Graph/Chart)

IV. COMPETITIVE LANDSCAPE

Total Companies Profiled: 160 (including Divisions/Subsidiaries - 178)

Region/Country Players

The United States 120

Canada 4

Japan 6

Europe 35

France 3

Germany 4

The United Kingdom 17

Italy 5

Spain 1

Rest of Europe 5

Asia-Pacific (Excluding Japan) 13

Abstract

This report analyzes the worldwide markets for Electronic Thermal Management in Millions of US$. The major end-use segments analyzed are Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive. Also, the report provides market analytics for the Global and US market for the product segments - Electronic Thermal Management Hardware, Electronic Thermal Management Software, and Electronic Thermal Management Interfaces & Substrates. Annual forecasts are provided for each region and product segment for the period of 2003 through 2012. The report profiles 160 companies including many key and niche players worldwide such as II-VI, Incorporated, Marlow Industries, Aavid Thermalloy, LLC, Advanced Thermal Solutions, Inc., Alcoa, Inc., Alpha Metals, Alpha Technologies Group, Inc., Ametek, Inc., Amkor Technology, Inc., Ansoft Corporation, Ansys, Inc., Fluent, Inc., ASAT Holdings Ltd., Brush Engineered Materials, Inc., CTS Corporation, Comair Rotron, Inc., Ceramics Process Systems Corporation, Chomerics, Cool Innovations, Inc., Cooler Master Co., Ltd., Daat Research Corp., Degree Controls, Inc., Dow Corning Corporation, Dynatron Corporation, Enertron, Inc., Flomerics, Fujikura Ltd., Henkel Loctite Corporation, Honeywell Electronic Materials, Isonics Corporation, Intricast Company Inc., ITW Vortec, JARO Components, Inc., Kooltronic, Inc., Kyocera Corporation, Laird Technologies, Liebert Corporation, Lord Corporation, Lytron Incorporated, Mathis Instruments Ltd, Melcor Corporation, Metal Matrix Cast Composites, LLC, Micronel U.S., Netzsch Instruments, Inc., Netzsch Thermal Analysis, NMB Technologies Corporation, Noren Products, Inc., Orient Semiconductor Electronics Ltd., PC Power & Cooling, Inc., Pfannenberg, Inc., PLANSEE Thermal Management Solutions, R-Theta Thermal Solutions, Inc., Sumitomo Electric Industries, Ltd., Tech Spray, L. P., Tellurex Corp., The Bergquist Company, The Filter Factory, Inc., Thermacore, Transene Company, Inc., Tennmax United, U.S. Toyo Fan Corporation, United Thermal Engineering Corporation, Vette Corp., and Wakefield Thermal Solutions, Inc. Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.


Please note: Reports are sold as single-site single-user licenses. The delivery time for hard copies is between 3-5 business days, as each hard copy is custom printed for the organization ordering it. Electronic versions require 24-48 hours as each copy is customized to the client with digital controls and custom watermarks. The Publisher uses digital controls protecting against copying and printing is restricted to one full copy to be used at the same location.

Adobe Acrobat Reader 7.0 is required to view the report. Upon ordering an electronic version, the Publisher will provide a link to download the purchased report.

Titles available via "online download" are not affected by this and are still delivered to your reading room immediately.

Prior to fulfillment of an order, the client will be required to sign a document detailing the purchase terms for a publication from this publisher.

Get Full Details About This Report >>

About MarketResearch.com
MarketResearch.com is an online aggregator selling over 160,000 market research reports, company profiles and country profiles from over 600 research firms. Our reports will provide you with the critical business and competitive intelligence you need for strategic planning and marketing research. Coverage includes the US, UK, Europe, Asia and global markets.