LED Manufacturing Technologies 2008 - The paths to improved profitability : Market Research Report

LED Manufacturing Technologies 2008 - The paths to improved profitability

Published: Nov. 19, 2007 - 186 Pages

Glossary
Executive summary
LED market main metrics and players: Market segmentation; LED market volume as a function of LED type; LED market revenues as a function of LED type; LED 2006 applications breakdown; 2001-2012 GaN LED market; Average retail price of conventional packaged LED; Estimated worldwide blue LED dies capacity by region in million units; Major worldwide players and related position on the value-chain: Europe, Japan, Korea, Taiwan, China, North America
General Illumination market: Worldwide estimation of generated lumens (lm.hr/year); Evolution of white LEDs needs for general lighting; Market estimation for White-LEDs for general illumination; Wafers needs for general illumination (2” equivalent wafers, million units)
Projection systems & light-engines market: Introduction: Definition of a light engine / Products which require a light engine; Light engines market forecast 2006-2011; Market introduction roadmap for light-engine-based products; Light engine roadmap for displays; Digital Cinema Projectors market; Conclusions: What light sources for projection displays: LED or LD?
Current status of the LED performance and related technologies: Number of lm requested for various applications and related time-to-market for mass-production; Main manufacturing steps and related options for GaN-based LED; Examples of current LED companies process flow-chart; LED: lateral or vertical structure; GaN-LED: Emitting colour as a function of In concentration; Global LED efficiency is the ratio of the final luminous output power over the wall-plug input power; Internal QE has now reached ~73% for low power LED (I=20mA)…; … but this value significantly drops as the current (so the power) increases !; How is the input power dissipated? Average LED optical output power vs.heat generation at different current levels; Extraction efficiency (?extr.) is strongly linked to the die size….; Different options to optimize LED performance; Expected efficiency gains for the future white power LED generation; Influence of selected improvements on the four key efficiency parameters; The perfect white LED would include…
New LED manufacturing techno. to enhance luminous efficiency: Various techniques to improve white LED efficiency
New growth substrates for nitride LEDs: Sensitivity to dislocations density in the active layer for optical nitride devices; Estimated volume of substrates for GaN-based LED production (SiC &Sapphire) 2005-2012; 2006 sapphire substrates market for LED: price, units and diameter analysis; 2005-2012 Sapphire substrates market volume for LEDs by diameter &related market value; 2005-2012 Sapphire substrates market value for LEDs, segmented bydiameter; 2005-2012 SiC wafer diameter evolution for GaN/SiC LED production; 2005-2012 SiC substrates market volume for LEDs by diameter & relatedmarket size; Sapphire substrates main manufacturers / Different substrates for GaN epitaxy; GaN substrates / applications matrix; Conclusion: Tentative time-to-market of various substrates
Photonic crystals and textured surface: Goal of the LED surface modification: enhance light extraction and directional emission; Photonic crystal vs. Surface texturing / Photonic crystals: the principle; Example of photonic crystals based LED Luminus PhlatLight®; Nano-imprint lithography, a key technology for photonic crystals LED; Photonic crystals LEDs: New developments; Photonic crystals LEDs by Laser Holography / Conclusion
Laser Lift-Off (LLO) & Flip-Chip: LLO Technique: definition; OSRAM LED chip technology (ThinGaN® technology); LLO equipments / LLO technique & Flip chip mounting; The flip-chip mounting: transparent substrates only!; Flip-chip can be coupled with back-face contact reflector technique; Schematic fabrication process for wafer-bonded transparent substrate AlGaInP/GaP LEDs
Transparent top contacts with ZnO
Temporary Bonding: Temporary bonding: introduction; Thin wafer handling: different solutions; Temporary bonding: principle; Main temporary bonding methods comparison; Temporary bonding using wax; Temporary bonding using adhesive tapes; Example of EVG and TEL temporary bonding tools
Dicing and Scribing: Definition; Techniques, Throughputs and costs / Number of dies / wafer; Laser Scribing & Dicing / Diamond Scribing & Dicing; Example of JPSA, NWR, Synova and Oxford Laser tools
Binning: Binning: Definition / What is Binning?; Binning: the criteria; Binning must prioritize on only one parameter to achieve a proper yield; Binning: conclusions
Patents and licenses status in the LED business: The phosphor battlefield: Patent is part of global IP; “The NICHIA story”: 1995 - 1999; Some Examples of the GaN LED patent situation; Main agreements and cross-licenses in LED business; US and Asia remain the most active regions in LED patents; EU patents status; Ranking of the most active companies in LED technology patents; Main phosphor-related patents from various manufacturers; Main phosphor technologies in use / Main phosphor suppliers; Conclusions
UV-LED and bulk-AlN: The future of white LEDs?: Introduction; What are UV wavelengths ?; UV emission wavelength depends on the Al content in the AlGaN alloy; Why bulk AlN to make UV LEDs? / Current UV-LED state-of-the-art; Main initiatives in AlN bulk single crystal developments; Tentative roadmap for 2” AlN single crystal market price & useable area; Example of current available offers in AlN substrates / Conclusion
The ’’Green Gap’’: Introduction: green is missing… / Why green wavelengths so hard to get?; Conclusions
LED lifetime: new business models are needed…: Long lifetime can be a market driver for adoption but not a money maker for light source vendors
General conclusions
Annexes: Company profiles

Abstract

Breaking the Profit-barrier with Ultra-High Brightness LEDs (UHB-LEDs) LED component volumes have been driven mainly by mobile phone sales recently, showing an incredible annual compound growth rate of more than +45% per year. Due to the strong pressure on component prices, revenue growth has been moderate: only +8% over the last 2 years.

“It is now clear that LED market needs to expand into new and profitable sectors with higher margins. We believe that this growth will come from 3 additional application areas: automotive lighting, architectural lighting and general illumination, in addition to the LCD backlighting market.” says Dr Philippe Roussel senior analyst at Yole Développement, in charge of Compound Semiconductors activity. To capture the profits in these application sectors, significant improvements are needed in LED performance, especially in $/lumen and in lumens/Watt at full power. New approaches manufacturing technologies are required at all levels: materials, design, front-end, back-end and packaging, in order to profit from the potential of Ultra-High Brightness LED.

This report describes 10 key manufacturing technologies, in use or under investigation that considerably improved the LED optical output power:

New material substrates
Laser Lift-Off
Temporary Bonding
Flip-Chip
Reflecting contacts
Transparent top contacts
Photonic Crystal
Surface Texturing
Dicing / Scribing
UV LED + RGB phosphors

Using that portfolio of technologies, high power LED with 150lm/W and generating more than 50% of light over heat can be envisaged.

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LED Manufacturing Technologies 2008 - The paths to improved profitability

Table of Contents

Abstract