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Printed Circuit Boards: World Outlook

Published by: Visant Strategies, Inc.

Published: Aug. 1, 2007 - 97 Pages


Table of Contents


1.0 Introduction

1.1 Executive summary

1.2 What is a PCB?

1.3 Why PCBs are Used

1.4 PCB History

2.0 PCB technology

2.1 PCB Design Considerations

2.2 Steps in PCB Design and Manufacture

2.2.1 Component Mounting Techniques

2.2.1.1 Through-Hole PCBs

2.2.1.2 Surface-Mount PCBs

2.3 PCB Market by Layers

2.3.1 Single layer PCB

2.3.2 Double layer PCB

2.3.3 Multilayer PCB

2.3.3.1 Case Study - Plotech

2.3.4 Analysis

2.4 PCB Market by rigidity

2.4.1 Rigid PCBs

2.4.1.1 Advantages

2.4.1.2 Limitations

2.4.1.3 Popular End Applications

2.4.2 Flexible PCBs

2.4.2.1 Flex PCB Advantages

2.4.2.2 Flex PCB Limitations

2.4.2.3 Popular End Products for Flex PCBs

2.4.3 Rigid-Flex PCBs

2.4.3.1 Advantages of Rigid-Flex PCBs

2.4.3.2 Limitations of Rigid-Flex PCBs

2.4.3.3 Rigid-Flex PCB Popular End Applications

2.4.4 Analysis

2.5 PCB Market by Materials

2.5.1 Alumina Substrate

2.5.1.1 Advantages of Alumina as a Substrate

2.5.1.2 Limitations of Alumina as a Substrate

2.5.1.3 End Applications for PCBs with an Alumina Substrate

2.5.1.4 Alumina Substrate Application - Thin-Film Applications

2.5.1.5 Alumina Substrate Application - Facsimile Machines

2.5.2 FR4 Substrate

2.5.2.1 FR-4 Advantages

2.5.2.2 FR-4 Limitations

2.5.2.3 FR-4 Popular End Applications

2.5.3 Beryllium Oxide Substrate

2.5.3.1 Beryllium Oxide Advantages

2.5.3.2 Beryllium Oxide Limitations

2.5.3.3 Beryllium Oxide Popular End Uses

2.5.3.4 Beryllium Oxide Applications - Electro Hydraulics

2.5.4 BT - Epoxy Substrate

2.5.4.1 BT - Epoxy Advantages

2.5.4.2 BT - Epoxy Limitations

2.5.4.3 BT - Epoxy Popular End Applications

2.5.5 Polyimide

2.5.5.1 Polyimide Advantages

2.5.5.2 Polyimide Limitations

2.5.5.3 Polyimide Popular End Applications

2.5.6 PTFE/ Woven Fiberglass Substrate (Teflon)

2.5.6.1 PTFE Advantages

2.5.6.2 PTFE Limitations

2.5.6.3 PTFE Popular End Applications

2.5.6.4 PTFE Application - Precisionfab

2.5.6.5 PTFE Application - Arlon

2.5.7 Hybrid PCB Substrates

2.5.7.1 PTFE/Fiberglass/BT-Epoxy Hybrid Substrate

2.5.7.2 Montmorillonite (MMT)-filled brominated Epoxy

Hybrid Substrate
2.5.8 Analysis

2.6 Today’s PCB Market Demands and Implications

2.6.1 Approaches for PCB Space Optimization

2.6.1.1 FPGA Space Optimization - Actel

2.6.1.2 LED Space Optimization - Maxim.

2.6.1.3 FPGA Space Optimization - Procon

3.0 The PCB Business Environment

3.1 Application Specific PCBs

3.1.1 Telecommunications

3.1.1.1 Mobile Phone

3.1.1.1.1 Omnidirectional Type PCB Antenna

3.1.1.2 Backplane

3.1.2 Computing Hardware

3.1.2.1 PC

3.1.2.1.1 Motherboard of a PC

3.1.2.1.2 Computer Keyboard

3.1.2.1.3 Storage and Other Computing Applications

3.1.3 CE and Automotive Applications

3.1.3.2 DVD, VCD

3.1.3.3 Camera (Infrared day and night camera)

3.1.3.4 Reed Switches

3.1.3.5 Position sensing application

3.1.3.6 Brake lever sensing application

3.1.3.7 Fuel level sensing application

3.1.3.8 Electronically-locked door sensors application

3.1.4 Other Applications

3.1.4.1 Photoelectric fire/smoke detector/alarm

3.1.4.2 Water boilers and Control units

3.1.4.2 Medical Ultrasound System

3.1.4.3 Pressure Sensors

3.1.5 Analysis

3.2 Business Drivers

3.2.1 High Speed and High Frequency Signals

3.2.1.1 High Speed and High Frequency Signal Challenges

3.2.1.2 Approaches to Counter Challenges

3.2.1.2.1 Microstrips

3.2.1.2.2 Striplines

3.2.2 Semiconductor Packing technology innovations

3.2.2.1 CSP/WLP

3.2.2.2 PGA/BGA

3.2.2.3 FC

3.2.2.4 MCM

3.2.2.5 SiP

3.2.2.6 PoP

3.2.3 Packing integration technology/System on the Package

3.2.4 Advances in EDA

3.2.4.1 Initial EDA/CAD Tools

3.2.4.2 Conventional Procedure to Use CAD Tools

3.2.4.3 Contemporary PCB Design Tools

3.2.5 Miniaturization

3.2.5.1 Laser and Photonic Methods for Micro Vias

3.3 PCB Industry Issues and Challenges

3.3.1 Application Issues: Analog, Digital and Mixed Signal PCBs

3.3.1.1 Analog PCBs

3.3.1.1.1 Analog Design Challenges and Limitations

3.3.1.1.2 Technology Advances and Workarounds

3.3.1.1.3 Case Study - Blacet Research

3.3.1.2 Digital PCBs

3.3.1.2.1 Digital Design Challenges and Limitations

3.3.1.2.2 Technology Advances and Workarounds

3.3.1.3 Mixed Signal PCBs

3.3.1.3.1 Importance of Grounding in Mixed Signal PCBs

3.3.1.3.2 Other Design Considerations

3.3.1.3.3 Mixed Signal PCB Applications

3.3.1.3.4 Case Study - Maxim

3.3.2 Environmental Issues

3.4 Market Push and Pull

3.4.1 Impact of Raw Material Price Fluctuations

3.4.2 Outsourced Manufacturing Trends

3.5 The Geographical Distribution of PCB Manufacturers and

Market Realities Going Forward
3.5.1 Geographical Region Metrics

3.5.1.1 North American PCB Production Revenues and

Market Demand Expenditures
3.5.1.2 European PCB Production Revenues and

Market Demand Expenditures
3.5.1.3 APAC Region PCB Production Revenues and Market

Demand Expenditures
3.5.1.4 ROW PCB Production Revenues and Market Demand

Expenditures
3.5.1.5 Analysis

Appendix



TABLES AND FIGURES

Table 1-1 World PCB Revenues

Table 2-1 Global Single Layer PCB Revenues

Table 2-2 Global Two Layer PCB Revenues

Table 2-3 Global Multi-Layer PCB Production

Table 2-4 Share of Layered PCBs of the Global PCB Production

Table 2-5 Global Rigid PCB Revenues

Table 2-6 Global Flex and Rigid Flex PCB Revenues

Table 2-7 Share of Rigid and Flex PCBs in Global PCB Production

Table 2-8 Substrate Material Properties

Table 2-9 Global Market for PCB Substrate Contents PCBs

Table 2-10 Ratio of PCB Substrate Material Market to Global PCB Market

Table 3-1 Global PCB Revenues for Telecommunications Applications

Table 3-2 Global PCB Revenues for Computing Hardware Applications

Table 3-3 49 Global PCB Revenues for CE and Automotive Applications

Table 3-4 52 Global PCB Revenues for Industrial, Medical and Military Applications

Table 3-5 53 Overall shares of global PCB Revenues by Application

Table 3-6 65 Global Revenues for PCB/MCM EDA Tools

Table 3-7 68 Global Revenues for HDI Microvia PCBs

Table 3-8 68 HDI/Microvias- Drivers of Multi-layer PCB Growth

Table 3-9 79 North American PCB Production Revenues and Market Demand Expenditures

Table 3-10 80 Europe PCB Production Revenues and Market Demand Expenditures

Table 3-11 81 The APAC PCB Production Revenues and Market Demand Expenditures

Table 3-12 81 The ROW PCB Production Revenues and Market Demand Expenditures

Table 3-13 82 Regional Production Revenue Share

Table 3-14 82 Regional Market Demand Expenditure Share


Abstract

Printed Circuit Board Industry to Show Robust Growth Amid New Challenges, Visant Strategies Study Finds

New York -The printed circuit board (PCB) industry worldwide will reap the rewards of the growing electronics sectors it serves, but still faces many challenges in keeping pace with rapid evolution within these same industries, a new Visant Strategies report finds.

"The PCB industry is closely tied to the electronics and semiconductor equipment markets and is easily influenced by competition as well as fluctuations in market demand," said report author Kaustubha Parkhi. "Now it also has to meet additional technical challenges created by innovation within the industries it serves."

"Challenges are inherent to designing and manufacturing even more miniature and complex boards and meeting the escalating demands from the increasing number of pins in a chip, the growth in high speed serial data streaming technologies, and the use of bussed interfaces and clock rates higher than 400 MHZ, among other particulars. However, PCB manufacturers will keep pace and see global revenues for PCBs grow from over $50 billion in 2007 to over $76 billion in 2012."

In the just-published report, "Printed Circuit Board: World Outlook," how the industry is making these changes is presented along with case studies of success stories in attaining different PCB attributes and how these changes affect the industries being served.

Global revenues for PCBs are given for a multitude of categories such as those through 2012 for HDI/Microvia PCBs, for single, double and multi-layer PCBs, rigid, flex or rigid-flex PCBs, PCBs by end-product sector and for PCBs using substrates such as Alumina, FR4, and Beryllium Oxide, among others.

The study details how regional shifts in PCB production and usage will continue through the study period. According to the report, the Asia-Pacific region will continue to expand in PCB production as PCB revenues for the region will increase by over 60% from 2007 to 2012.

"Printed Circuit Board: World Outlook," also gives PCB revenues and expenditures for North America, Europe, the Asia Pacific Region, and the rest of the world through 2012.

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