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Printed Electronics--Technologies and ApplicationsPublished by: Frost & Sullivan Published: Jun. 25, 2007 - 95 Pages Table of Contents
AbstractThis Frost & Sullivan research service titled Printed Electronics -Technologies & Applications provides a macroscopic overview of the market dynamics in the printed electronics industry for a ten-year period starting from 2004, with a complete analysis of the key accelerating factors, competitive challenges, and market/technology trends that are impacting technology adoption in this industry. In this research service, Frost & Sullivan's expert analysts thoroughly examine the following applications: organic light emitting diodes (OLEDS), electroluminescent (EL) displays, printed batteries, photovoltaics, printed memories, printed e-textiles, smart labels, and packaging.Frost & Sullivan Growth Partnership Service Based on extensive and in-depth research, real-world consulting work, and new theories tested in hundreds of companies across many industries, Frost & Sullivan has evolved its Growth Partnership Services (GPS) program that provides established and emerging firms with powerful growth visions. Moving beyond token mission statements, GPS provides an actionable vision to growth consulting partners by illustrating how key intelligence and strategic research based on defined goals can guide day-to-day behavior and overall company direction. The foundation of Frost & Sullivan's GPS includes: Market Sectors By Application: The following technologies are covered in this research: Bright Future for Printed Electronics in the Electronics Industry Printed electronics is a dynamic and emerging industry that is witnessing several exciting R&D initiatives, particularly in applications for which traditional silicon technology is not considered feasible. One of the biggest discoveries is the use of organic semiconducting materials other than silicon for electronic components in batteries, sensors, displays, and functional transistors. Printed electronics can significantly reduce the cycle times and cost structures of the semiconductor industry due to the use of high-volume commercial manufacturing such as inkjet printing. Currently, printing of both organic and inorganic semiconductors is taking place using techniques such as inkjet, lithography, and gravure, while flexographic and screen printing are likely to feature in the future mix of low-cost manufacturing techniques. "Eventually, the expensive R&D cycles in complementary metal oxide semiconductor (CMOS) wafer-based systems will give way to simplified materials processing and large area electronics manufacturing," remarks the analyst of this research service. "This is due to the elimination of lithographic masks and economic custom design for small orders and low-volume production." However, despite the huge strides made in technology development, printed electronics components have a long way to go before they can be manufactured using conventional presses. Products are likely to be in liquid or semi-liquid form, covering the substrate in patterned layers. Reduction in the cost and weight of the products can be achieved only if electronics circuitries are printed on thin substrates, allowing them to have ubiquitous application in displays, sensors, lighting, and communication devices. Large Area Low-cost Manufacturing using Printing to Have a Major Impact on Inorganic Silicon-based Electronics While there has been tremendous progress in the development of organic conductive/semiconductive/di-electric chemistries, products, and processes, the focus needs to shift to developing printable logic and complementary circuits similar to those of CMOS wafer-based systems, which were originally meant to be replaced. With the discovery of conductive polymers, the electrical functionalities of conductive and semiconductive polymers and monomers are being utilized for the direct printing of electronic features, especially for low-resolution circuits and low-cost microelectronics products. Low-cost manufacturing, especially printing, seems to be the appropriate technology in cases where conventional components cannot be incorporated in the silicon chip due to their size and it would not be feasible to increase chip sizes. When the technology matures, the cost of these printed circuits may only be 1 percent of the cost of silicon chips on flexible substrates, leading to high throughputs for the printing of large area electronics. "Large area low-cost manufacturing using printing is expected to revolutionize the market for inorganic silicon-based electronics because unlike silicon and other III-V compound-based electronics, printing techniques do not rely on high-volume production to drive down the costs of electronics manufacturing," says the analyst. However, there is definitely a trade-off between the high volumes that can be achieved using standard printing presses and the limited resolution of these techniques with regard to silicon microelectronic fabrication. Therefore, silicon technology is likely to continue to dominate applications that require fast switching and complex processing, whereas the lower cost/area ratio of printed electronics is expected to be more suitable for less sophisticated applications. Get Full Details About This Report >> |
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