The Global Market for Advanced Electronic Packaging

Published by: BCC Research

Published: May. 30, 2007 - 173 Pages

Table of Contents

INTRODUCTION

STUDY GOALS AND OBJECTIVES

REASONS FOR DOING THE STUDY

SCOPE AND FORMAT

ABOUT THE AUTHOR

INFORMATION SOURCES

RELATED BCC REPORTS

BCC ONLINE SERVICES

DISCLAIMER

EXECUTIVE SUMMARY

Summary Table:

GLOBAL MARKET FOR IN-HOUSE AND OUTSOURCED PACKAGING AND TESTING, THROUGH 2011 ($ BILLIONS)

Summary Figure:

GLOBAL MARKET FOR IN-HOUSE AND OUTSOURCED PACKAGING AND TESTING SALES, 2006 AND 2011 ($ BILLIONS)

TECHNOLOGY LANDSCAPE

TECHNOLOGY LANDSCAPE

TECHNOLOGY LANDSCAPE (Continued)

Figure 1 POSITION OF PACKAGING AND TESTING IN SEMICONDUCTOR MANUFACTURING CYCLE

TYPES OF ADVANCED PACKAGING TECHNIQUES

TYPES OF ADVANCED PACKAGING …(CONTINUED)

PACKAGE FOOTPRINT REDUCTION: CHIP SCALE PACKAGE (CSP)/WAFER LEVEL PACKAGING (WLP)

Introduction

Table 1 GLOBAL MARKET FORECAST FOR OSPT CSP/WLP SALES, THROUGH 2011 ($ BILLIONS)

Background

Applications and Case Studies

Table 2 GLOBAL MARKET FORECAST FOR OSPT CSP, BY SECTOR, THROUGH 2011 ($ BILLIONS)

Figure 2 GLOBAL MARKET FORECAST FOR OSPT CSP, BY SECTOR, 2004-2011 ($ BILLIONS)

Case Study-CSP for High-Brightness LED

Features and Benefits

Size and Weight Efficiency

Ease of Implementation

Compatibility

Mismatch and Revision Elimination

Time to Market Reduction

Implementation Methodologies and Process Enhancements

CSP

WLP

Process Enhancement-Reduction in Particle Defects

Process Enhancement-Maxim Integrated Products

Figure 3 WLP CROSS SECTION

Process Enhancement-Tessera

Figure 4 WLP-COMPLIANT LAYER

Process Enhancement-Amkor

Limitations of CSP/WLP

Infrastructure Constraints

Cost Concerns

Operation Concerns

Challenges Associated with Wafer Level Test and Burn-in (WLTBI)

Global Distribution of OSPT Services Sales by Region

Table 3 GLOBAL MARKET FORECAST FOR OSPT CSP: DISTRIBUTION BY REGION, THROUGH 2011 ($ BILLIONS)

PACKAGE-TO-PCB BONDING-PGA

Introduction

Features and Benefits

Lower Thermal Resistance and High Thermal Heat Dissipation

Better Signal Quality

High Reliability

Applications and Case Studies

Implementation Methodologies and Process Enhancements

Implementation Methodology-CPGA

Implementation Methodology-PPGA

PACKAGE-TO-PCB ATTACHMENT/ BONDING: BGA

Introduction

Table 4 GLOBAL MARKET FORECAST FOR OSPT BGA SALES, THROUGH 2011 ($ BILLIONS)

Applications and Case Studies

Table 5 GLOBAL MARKET FORECAST FOR BGA: DISTRIBUTION BY SECTOR, THROUGH 2011 ($ BILLIONS)

Figure 5 GLOBAL MARKET FORECAST FOR BGA, DISTRIBUTION BY SECTOR, 2004-2011 ($ BILLIONS)

Features and Benefits

High Density

Heat Conduction Efficiency

Low Inductance Leads

Implementation Methodologies and Process Enhancements

Implementation Methodologies …(Continued)

Implementation Methodology-PBGA

Implementation Methodology-FCBGA

Implementation Methodology-CBGA

Implementation Methodology-TBGA

Implementation Methodology-EBGA

Process Enhancement-Ball Placement Equipment

Process Enhancement-SolVision

Limitations and Challenges

Unreliability of Solder Balls

Complicated, Expensive, and Incomprehensive Inspection Techniques

Difficulty in Rectification of Individual Solders

Inability to Withstand High Temperature

Sensitivity to Moisture

Global Distribution of OSPT Sales by Region

Table 6 GLOBAL MARKET FORECAST FOR OSPT BGA, DISTRIBUTION BY REGION, THROUGH 2011 ($ BILLIONS)

DIE-TO-PACKAGE SUBSTRATE ATTACHMENT/BONDING: FC

Introduction

Table 7 GLOBAL MARKET FORECAST FOR OSPT FC, THROUGH 2011 ($ BILLIONS)

Applications and Case Studies

Case Study-Kyocera

Case Study-Migration from Wire Bond to FC Packaging

Case Study-Amkor

Case Study-ASAT

Table 8 GLOBAL MARKET FORECAST FOR OSPT FC, DISTRIBUTION BY SECTOR, THROUGH 2011 ($ BILLIONS)

Figure 6 GLOBAL MARKET FORECAST FOR OSPT FC, DISTRIBUTION, BY SECTOR, 2004-2011 ($ BILLIONS)

Features and Benefits

Size Efficiency

Speedy Interconnect

I/O Efficiency

Cost Benefits

Assembly Process Efficiency

Implementation Methodologies and Process Enhancements

Figure 7 OERLIKON MICRON5003 FC BONDER

Implementation Methodologies …(Continued)

Implementation Methodologies …(Continued)

Implementation Methodology-Electroless Nickel-Gold FC

Process Enhancement-Texas Instruments

Process Enhancement-Valtronics

Process Enhancement-Henkel

Process Enhancement-Stud Bumping

Process Enhancement-Precise Flux Deposition Mechanism

Limitations and Challenges

Spacing Constraints

Solder Processing Temperature and Material Restrictions

Costly Bumping Processes

Substrate Concerns

Underfill Process Trade-Offs

Global Distribution of OSPT Services by Region

Table 9 GLOBAL MARKET FORECAST FOR OSPT FC, DISTRIBUTION BY REGION, THROUGH 2011 ($ BILLIONS)

MULTI-FUNCTIONAL INTEGRATION ON THE PACKAGE: MCM

Introduction

Table 10 GLOBAL MARKET FORECAST FOR OSPT MCM, THROUGH 2011 ($ BILLIONS)

Applications and Case Studies

Case Study-IBM

Case Study-MCM in Optical Telecom Applications

Case Study-Orsys

Table 11 GLOBAL MARKET FORECAST FOR OSPT MCM, DISTRIBUTION BY SECTOR, THROUGH 2011 ($ BILLIONS)

Figure 8 GLOBAL MARKET FORECAST FOR OSPT MCM, DISTRIBUTION BY SECTOR, 2004-2011 ($ BILLIONS)

Features and Benefits

Better Performance

Improved Signal Quality

Size Reduction

Economic Advantages

Implementation Methodologies and Process Enhancements

Implementation Methodology-Laminated MCM (MCM-L)

Implementation Methodology-Ceramic MCM (MCM-C)

Thick Film

High Temperature Co-fired Ceramic (HTCC)

Low Temperature Co-fired Ceramic (LTCC)

Implementation Methodology-Deposited MCM (MCM-D)

Classic Thin-Film

Silicon Thin-Film

Polymer Thin-Film

Limitations and Challenges

Performance Inefficiencies

Architectural Constraints

Electrical and Thermal Constraints

Cost Constraints

Test Constraints

Global Distribution of OSPT Sales by Region

Table 12 GLOBAL MARKET FORECAST FOR OSPT MCM, DISTRIBUTION BY REGION, THROUGH 2011 ($ BILLIONS)

MULTI-FUNCTIONAL INTEGRATION ON THE PACKAGE: SIP

Introduction

Table 13 GLOBAL MARKET FORECAST FOR OSPT SIP, THROUGH 2011 ($ BILLIONS)

Applications and Case Studies

Case Study-Wi2Wi

Case Study-NEC

Case Study-ChipMOS

Case Study-Toshiba

Figure 9 SIP IN ULTRA-THIN HARD DRIVE

Figure 10 SIP IN MOBILE PHONE

Table 14 GLOBAL MARKET FORECAST FOR OSPT SIP, DISTRIBUTION, BY SECTOR, THROUGH 2011 ($ BILLIONS)

Figure 11 GLOBAL MARKET FORECAST FOR OSPT SIP, DISTRIBUTION BY SECTOR, 2004-2011 ($ BILLIONS)

Features and Benefits

Size Efficiency

Performance Enhancement

Design and Review Flexibility

Cost Advantage

Reduced Time-to-Market

Implementation Methodologies and Process Enhancements

Figure 12 CROSS SECTIONS OF FC AND WIRE-BONDED SIPS

Limitations and Challenges

Limited Availability of Skills and Resources

Re-alignment of EDA Processes

Lack of KGD

Larger Package Size as Compared to SoC

Pressures on Wafering Process

Table 15 GLOBAL MARKET FORECAST FOR OSPT SIP, DISTRIBUTION BY REGION, THROUGH 2011 ($ BILLIONS)

MULTI-FUNCTIONAL INTEGRATION ON THE PACKAGE: POP

Introduction

Table 16 GLOBAL MARKET FORECAST FOR OSPT POP, THROUGH 2011 ($ BILLIONS)

Applications and Case Studies

Case Study-STATS ChipPAC

Case Study-STMicroelectronics

Case Study-Toshiba America Electronic Components

Table 17 GLOBAL MARKET FORECAST FOR OSPT POP, DISTRIBUTION BY SECTOR, THROUGH 2011 ($ BILLIONS)

Figure 13 GLOBAL MARKET FORECAST FOR OSPT POP, DISTRIBUTION BY SECTOR, 2004-2011 ($ BILLIONS)

Features and Benefits

Saving in Board Surface Area

Ease in System Design

Reduction in PCB Complexity

Enhanced Performance

Reduced Time-to-Market

Implementation Methodologies and Process Enhancements

Figure 14 CROSS SECTION AND TOP VIEW OF PSVFBGA

Process Enhancement-Intel

Limitations and Challenges

Conflict of Interests

Over Dependence on Solder Ball Material Characteristics

Pressure on PoP(d) Design

Global Distribution of OSPT Sales by Region

Table 18 GLOBAL MARKET FORECAST FOR OSPT POP, DISTRIBUTION BY REGION, THROUGH 2011 ($ BILLIONS)

INDUSTRY ANALYSIS

Table 19 GLOBAL MARKET FORECAST FOR SEMICONDUCTOR CHIPS TO ALL INDUSTRY SECTOR END PRODUCTS, THROUGH 2011 ($ BILLIONS)

Table 20 SHARE OF TOTAL AND OUTSOURCED SEMICONDUCTOR PACKAGING AND SERVICES, THROUGH 2011 (%)

Figure 15 SHARE OF TOTAL AND OUTSOURCED SEMICONDUCTOR PACKAGING AND SERVICES, 2004-2011 (%)

COMPETITION

CYCLICALITY

FUNDAMENTALS

DEMAND FLUCTUATIONS IN THE END PRODUCTS

CAPACITY UTILIZATION FLUCTUATIONS

PRICING PRESSURES

CHANGE IN MIX OF SEMICONDUCTOR PACKAGES

SHORT TERM CUSTOMER COMMITMENT DURATIONS

RAW MATERIAL AVAILABILITY AND PRICING FLUCTUATIONS

IP DISPUTES

NATURAL CALAMITIES

RISKS ASSOCIATED WITH OPERATIONS IN MULTIPLE NATIONS

BUYER/ SUPPLIER INTERPLAY

PACKAGING SERVICES

TESTING SERVICES

OSPT SERVICE PROVIDER-IDM INTERPLAY

RAW MATERIALS and value added components FOR ADVANCED PACKAGING

DIELECTRICS AND SUBSTRATES

Market Overview and Update

SOLDERS

Market Overview and Update

SOCKETS AND INTERCONNECTS

Market Overview and Update

UNDERFILLS

THERMAL MANAGEMENT SOLUTIONS

Market Overview and Update

WHY OUTSOURCE?

Table 21 SHARES OF OSPT SERVICES AND IN-HOUSE SEMICONDUCTOR PACKAGING AND TESTING SERVICES MARKETS, THROUGH 2011 (%)

Figure 16 SHARES OF OSPT SERVICES SALES AND IN-HOUSE SEMICONDUCTOR PACKAGING AND TESTING SERVICES MARKETS, 2004-2011 (%)

QUICKER TURNAROUND TIMES

FAVORABLE ECONOMIES OF SCALE

EMERGENCE OF ATTRACTIVE OUTSOURCING DESTINATIONS

FAVORABLE SUPPLY CHAIN

MARKETS FOR OSPT SERVICES

END USER DEVICE APPLICATION MARKET BY SECTOR

Table 22 GLOBAL SHARE FORECAST OF OSPT SALES, BY SECTOR, THROUGH 2011 (%)

Figure 17 GLOBAL SHARE FORECAST OF OSPT SALES, BY SECTOR, 2004-2011 (%)

Application Market Analysis-Telecommunications

Application Market Analysis-Consumer Electronics

Application Market Analysis-PC

Regional Markets

Table 23 GLOBAL MARKET SHARE FORECAST FOR OSPT SALES, BY REGION, THROUGH 2011 (%)

Figure 18 GLOBAL MARKET SHARE FOR OSPT SALES, BY REGION, 2004-2011 (%)

Regional Market Analysis-APAC

South East Asian Region

China

India

Regional Market Analysis-Americas

Regional Market Analysis-EMEA

DRIVERS

PORTABILITY AND MINIATURIZATION OF DEVICES

Table 24 CAGR COMPARISON-OSPT SALES VERSUS OSPT TELECOMMUNICATIONS SALES, THROUGH

Figure 19 CAGR COMPARISON-OSPT SALES VERSUS OSPT TELECOMMUNICATIONS SALES, 2006-2011 (CAGR%)

SHRINKING TURNAROUND TIMES

EMERGENCE OF THE APAC REGION

Table 25 CAGR COMPARISON-OSPT SALES VERSUS OSPT APAC SALES THROUGH 2011 (CAGR%)

Table 25 (CONTINUED)

Figure 20 CAGR COMPARISON-OSPT SALES VERSUS OSPT APAC SALES, 2006-2011 (CAGR%)

COST-EFFECTIVENESS OF ADVANCED PACKAGING SOLUTIONS

ASIC

SoC

Advantages of SiP and MCM

Table 26 COMPARISON OF SALES OF ASIC, SOC, MCM AND SIP, THROUGH 2011 ($ BILLIONS)

Figure 21 COMPARISON OF CAGRS OF ASIC, SOC, MCM AND SIP (CAGR%)

STANDARDS BODIES AND ROLE OF INDUSTRY CONSORTIA

HIGH DENSITY PACKAGING USER GROUP (HDPUG)

INTERNATIONAL ELECTRONICS MANUFACTURING INITIATIVE (INEMI)

JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (FORMERLY JOINT ELECTRON DEVICE ENGINEERING COUNCIL)

Jedec Solid State …(Continued)

Microelectronics Packaging and Test Engineering Council (MEPTEC)

REGULATORY CONDITIONS

U.S. REGULATIONS

ASIAN REGULATIONS

WASTE FROM ELECTRICAL AND ELECTRONIC EQUIPMENT (WEEE) DIRECTIVE

RESTRICTION ON HAZARDOUS SUBSTANCES (ROHS)

CHALLENGES

IP RELATED DISPUTES

IP Related Disputes (Continued)

CHALLENGES POSED BY REGULATIONS

Revamp of the Supply Chain

Figure 22 TEMPERATURE PROFILE OF EUTECTIC AND PB-FREE SOLDERS

Semiconductor Company Strategies

Backward Compatibility

Wafer Bumping Challenges

Figure 23 "LEAD FREE" SEAL

Tin Whiskers

CASE STUDY-NATIONAL SEMICONDUCTOR

Case Study-National Semiconductor (Continued)

Case Study-National Semiconductor (Continued)

STAKEHOLDER DETAILS

CRITERIA FOR STAKEHOLDER CLASSIFICATION

CRITICAL REASONS FOR INDIVIDUAL STAKEHOLDER SELECTION

CRITICAL REASONS FOR INDIVIDUAL…(CONTINUED)

CRITICAL REASONS FOR INDIVIDUAL…(CONTINUED)

CRITICAL REASONS FOR INDIVIDUAL…(CONTINUED)

CRITICAL REASONS FOR INDIVIDUAL…(CONTINUED)

STAKEHOLDER CLASSIFICATION SUMMARY

Table 27 SUMMARY OF SUPPLIERS AND THEIR PRINCIPAL ACTIVITIES

Table 27 (CONTINUED)

STAKEHOLDER Profiles

ADVANCED INTERCONNECTIONS

Introduction

Packaging and Testing Function Value Additions

ADVANCED SEMICONDUCTOR ENGINEERING (ASE)

Introduction

Packaging and Testing Function Value Additions

Customers

Financial Performance

AMKOR TECHNOLOGIES, INC.

Introduction

Packaging and Testing Function Value Additions

Packaging and … (Continued)

Customers

Locations of Operations

Financial Performance

ANSOFT CORP.

Introduction

Packaging and Testing Function Value Additions

Packaging and Testing … (Continued)

Customers

Financial Performance

ASAT HOLDINGS

Introduction

Packaging and Testing Function Value Additions

Customers

Locations of Operations

Financial Performance

BRIDGE SEMICONDUCTOR

Introduction

Packaging and Testing Function Value Additions

CADENCE DESIGN SYSTEMS

Introduction

Packaging and Testing Function Value Additions

Locations of Operations

Financial Performance

CHARTERED SEMICONDUCTOR MANUFACTURING

Introduction

Packaging and Testing Function Value Additions

Customers

Locations of Operations

Financial Performance

CHIPMOS TECHNOLOGIES

Introduction

Packaging and Testing Function Value Additions

Customers

Locations of Operations

Financial Performance

FLIPCHIP INTERNATIONAL (FCI)

Introduction

Packaging and Testing Function Value Additions

Packaging and Testing … (Continued)

Customers

Locations of Operations

Financial Performance

FUJITSU, LTD.

Introduction

Packaging and Testing Function Value Additions

Locations of Operations

Financial Performance

IBM

Introduction

Packaging and Testing Function Value Additions

Financial Performance

INTEL

Packaging and Testing Function Value Additions

Financial Performance

MICRON TECHNOLOGY, INC.

Introduction

Packaging and Testing Function Value Additions

Financial Performance

M-SYSTEMS (ACQUIRED BY SANDISK)

Introduction

Packaging and Testing Function Value Additions

Financial Performance

NATIONAL SEMICONDUCTOR CORP.

Introduction

Packaging and Testing Function Value Additions

Locations of Operations

Financial Performance

NEOCONIX, INC.

Introduction

Packaging and Testing Function Value Additions

Locations of Operations

PSI Technologies Holdings

Introduction

Packaging and Testing Function Value Additions

Customers

Locations of Operations

Financial Performance

SAMSUNG SEMICONDUCTOR, INC.

Introduction

Packaging and Testing Function Value Additions

Locations of Operations

Financial Performance

SILICONWARE PRECISION INDUSTRIES (SPIL)

Introduction

Packaging and Testing Function Value Additions

Packaging And Testing … (Continued)

Locations of Operations

Financial Performance

STMICROELECTRONICS (ST)

Introduction

Packaging and Testing Function Value Additions

Customers

Locations of Operations

Financial Performance

STAKTEK

Introduction

Packaging and Testing Function Value Additions

Customers

Locations of Operations

Financial Performance

STATS CHIPPAC

Introduction

Packaging and Testing Function Value Additions

Packaging and Testing … (Continued)

Packaging and …(Continued)

Financial Performance

SYNOPSYS

Introduction

Packaging and Testing Function Value Additions

Customers

Financial Performance

TESSERA TECHNOLOGIES

Introduction

Packaging and Testing Function Value Additions

Packaging and …(Continued)

Figure 24 WLP FOR IMAGE SENSORS

Customers

Financial Performance

TOSHIBA AMERICA ELECTRIC COMPONENTS AND SEMICONDUCTORS (TAEC)

Introduction

Packaging and Testing Function Value Additions

Financial Performance

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (TSMC)

Introduction

Packaging and Testing Function Value Additions

Locations of Operations

Financial Performance

UNITED MICROELECTRONICS CORP.

Introduction

Packaging and Testing Function Value Additions

Financial Performance

XRADIA

Introduction

Packaging and Testing Function Value Additions

Financial Performance

U.S. PATENT ANALYSIS

INTRODUCTION

GENERAL TRENDS

Table 28 ADVANCED ELECTRONIC PACKAGING TECHNIQUES: U.S. PATENT TRENDS, 1976-2006

TRENDS BY COUNTRY

Figure 25 SHARES OF U.S. PATENTS RELATED TO ADVANCED ELECTRONIC PACKAGING TECHNIQUES, BY COUNTRY, 1976-2006

Figure 25 (CONTINUED)

TRENDS BY ASSIGNEE

Table 29 ASSIGNEES OF 10 OR MORE U.S. PATENTS RELATED TO ADVANCED ELECTRONIC PACKAGING, 1976-2006

TRENDS BY CATEGORY

Table 30 CLASSIFICATION OF U.S. PATENTS RELATED TO ADVANCED ELECTRONIC PACKAGING BY CATEGORY, 1976-2006

Abstract

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