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IC Europe European Database of Integrated Circuit, Packaging, MEMS, R&D & Power Devices Players and Market Study

Published by: Yole Developpement

Published: Mar. 1, 2007 - 285 Pages


Table of Contents


Europe accounts for more than 280 production and research fabs active in one or more of the investigated technology fields. In this report details are given about the specific facilities:
  • ICs

  • MEMS

  • Packaging

  • Power Devices

  • R&D institutes

  • Compound Semiconductors

The database includes detail on the manufacturing
sites*:
  • Name of the company, including Website

  • Size (number of employees, sales figures for 2005)

  • General activities (applications, devices and markets)

  • Addresses of the different manufacturing sites in Europe

  • Per manufacturing site:

  • Technology(s) implemented

  • Capacity (wafer starts per week)

  • Capacity forecast

  • Size and type of the clean room

  • Complete contact details (name, title, email and/or telephone, location)

Abstract

Product objectives

The objectives of “IC Europe” are:
  • To understand, based on facts, the complex and diverse collection of semiconductor equipment and material suppliers’ customers.
  • To create a tool for the equipment and material suppliers and others to assess business opportunities in the European market
  • To enable suppliers of semiconductor industry to detect new opportunities in the European Semiconductor market.
Product overview

This comprehensive report details fab locations, contacts, products, technologies, manufacturing facilities, and financial information. The covered geographical area includes 48 countries such as the European Union, Eastern European countries, Turkey, Morocco, Israel, and Russia.

Key Product Features

The database includes:
  • ICs (Memory, Logic, Analog and mixed signal, ASICs, Other IC devices)
  • MEMS (Ink jet head; Sensors: pressure, inertial, IR Image, specific chemicals & gasses; optical MEMS; RF MEMS; other MEMS devices)
  • Compound Semiconductors (GaAs, SiC, GaN, InP based devices)
  • Power devices
  • Packaging (Discrete packaging, Zero and first-level packaging, Wafer Level Packaging, other packaging techniques such as 3D)
  • Major R&D labs
The report includes:
  • Executive summary
  • Statistical analysis of the breakdown of corporate and manufacturing sites by size, geography, technology, and products
  • Trends analysis for products and manufacturing
  • Summary of key points that includes key concerns and initiatives related to the development, purchase and use of equipment and materials.
Delivered as an Excel file.

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