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Published by: BCC Research
Published: Dec. 1, 1999 - 232 Pages
Table of Contents
Introduction
Reason For Study And Its Importance
Objectives Of Study And Its Contribution
Audience For Report
Scope And Content Of Report
Methodology And Information Sources
Analyst Credentials
Related Bcc Reports
Executive Summary
Overview
Introduction
Description Of The Sputtering Process
Basic Physics
Process Variables
Variations
Radio Frequency (Rf) And Direct Current (Dc) Diode Sputtering
Magnetically Enhanced Sputtering
Magnetron Sputtering
Reactive Sputtering
Bias Sputtering
Cosputtering
Advanced Sputtering Techniques Overview
Sputtered Film Characteristics
Sputtering Targets
Target Types
Sizes And Shapes
Materials
Multipiece Targets
Production Methods Overview
Target Bonding
Microstructural Requirements
Purity
Grain Size And Size Distribution
Porosity
Crystallographic Orientation
Applications Overview
Industry Structure
Introduction
Size And Scope
North America
Major And Minor Target Suppliers
Company Ownership
The World
Products
Vertical Integration
Globalization
Barriers To Entry
Company Profiles
Academy Precision Materials, A Suby. Of Academy Corp.
Aci Alloys
Advanced Cerametrics Inc.
Advanced Ceramics Corp.
Ametek Specialty Metal Products
Angstrom Sciences
Ansun Protective Metals, Inc.
Arconium
Arris International Corp.
Ati Division, Oryx Technology Corp.
Atramet, Inc.
Balzers Materials
Belmont Metals, Inc.
Carborundum Corp.
Cerac, Inc.
Ceradyne, Inc.
Engelhard-Clal L.P.
Goodfellow Corp.
Handy & Harman Products Division
Heraeus Materials Technology Division (Mtd) Of W.C. Heraeus Gmbh
Hitachi Metals, Ltd.
Iht Corp.
Indium Corporation Of America
Johnson Matthey Electronics
Leybold Materials Gmbh
Leybold Materials, Inc.
Materials Research Corp., A Division Of Sony Corp. Of America
Materials Science International, Inc.
Mitsubishi Materials Corp.
Mitsui Mining & Smelting Co., Ltd.
Nimtec/Japan Energy Corp.
Plansee Ag
Praxair Specialty Ceramics, Unit Of Praxair Surface Technologies
Process Materials, Inc.
Pure Tech, Inc., Suby. Of Williams Advanced Materials
Research And Pvd Materials Corp.
Schwarzkopf Technologies Corp., Suby. Of Plansee Ag (Austria)
Soleras, Ltd.
Sputtermet, Inc.
Target Materials Inc., Div. Of Superconductive Components Inc.
Tico Titanium, Inc.
Tosoh Smd, Inc., Suby. Of Tosoh Corp.
Trinitech International, Inc.
Vacuum Engineering & Materials Co., Inc.
Vacuum Metallurgical Co., Ltd.
Vanderstraeten
Wesgo Technical Ceramics, A Division Of Wesgo Inc.
Williams Advanced Materials
Technology
Introduction
Target Fabrication And Processing
Melting And Casting
Induction Melting
Electron Beam Melting
Conventional Powder-Based Production Methods
Vacuum And Inert Gas Hot Pressing
Hot Isostatic Pressing (Hip)
Cold Isostatic Pressing (Cip)
Uniaxial Cold Pressing And Sintering
Alternative Powder-Based Production Routes
Spray Forming
Plasma Spraying
Osprey Process
Pneumatic Isostatic Forging (Pif)
Electroconsolidation
Slip Casting
Comparative Analysis Of Production Methods
New Technological Developments
Non-Casting Method To Produce High Purity Copper Targets
Mechanical Alloying/Hip Approach To The Production Of Chromium Alloy Targets
Barrier Powder Envelope Method To Fabricate Metal Oxide Targets
Spray Form/Extrusion Method To Produce Aluminum Alloy Targets
Hip/Cladding Method To Produce Bonded Cylindrical Targets
The Use Of Nanosize Particles To Obtain A High Density Oxide Target
Multi-Planar Target For Filling High-Aspect Ratio Openings
"Spinforming" Method Of Target Production To Minimize Material Waste
Targets With Curvilinear Back Surfaces To Match End-Of-Life Profiles
Thermomechanical Processing
Target Bonding
Backing Plates
Bonding Methods
Solder Bonding
Adhesive Bonding
Explosive Bonding
Diffusion Bonding
Bond Inspection
Target Reclaim And Recycling
Advanced Sputtering Techniques
Collimated Sputtering
Ionized Magnetron Sputtering
Medium Frequency Ac Sputtering
Pulsed Dc Magnetron Sputtering
Metal-Mode Reactive Sputtering
Technical Issues And Problems
Targets
Poor Target Material Utilization
Particle Generation
Spatial Homogeneity In Larger Targets
Films
Thickness Uniformity
Conformal Coverage On Stepped Surfaces
Competing Technologies
Chemical Vapor Deposition (Cvd)
Evaporation
Electrodeposition
Ion-Assisted Deposition
Advantages Of Sputtering
U.S. Patent Analysis
Introduction
General Trends
Trends By Country
Trends By Assignee
Trends By Material Type
Conclusions Of Analysis
World Markets
Introduction
Microelectronics
Introduction
Usage Overview And Other Background
Thin Film Structure And Materials
Introduction
Metallization Layers Of Integrated Circuits
Interconnects
Barrier Layers
Contact And Adhesion Layers
Other Microelectronic Applications
Thin Film Resistors And Capacitors
Photomask Blanks
Film And Target Requirements
Technology And Market Trends
World Markets
Assumptions
Current Markets And Forecasts
Data Storage
Introduction
Usage Overview
Magnetic Hard Disks And Heads
Optical Recording Media
Thin-Film Structure And Materials
Magnetic Hard Disks
Magnetic Recording Heads
Optical Recording Disks
Cd-Audio, Cd-Rom
Dvd-Audio, -Video And -Rom
Cd-Recordable (Cd-R) And Dvd-Recordable (Dvd-R)
Magneto-Optical Recording Media
Phase-Change Media: Cd-Rewritable (Cd-Rw), Dvd-Rw, And Dvd-Ram
Film And Target Requirements
Technology And Market Trends
World Markets
Magnetic Storage
Assumptions
Current Markets And Forecasts
Optical Storage
Assumptions
Current Markets And Forecasts
Advanced Displays
Introduction
Usage Overview
Thin Film Structure And Materials
Liquid Crystal Displays
Electroluminescent Displays
Plasma Display Panels
Field Emission Displays
Film And Target Requirements
Technology And Market Trends
World Markets
Assumptions
Current Markets And Forecasts
Optical Coating
Introduction
Usage Overview
Thin Film Structure And Materials
Solar Control Coatings
Low-Emissivity Coatings
Specialty Mirrors
Antireflection And Antistatic Coatings
Film And Target Requirements
Technology And Market Trends
World Markets
Assumptions
Current Markets And Forecasts
Markets Summary
Appendix A: Company Contact List
Appendix B: Compilation Of U.S. Patents Related To Sputtering Target Production, 1990-1998
Appendix C: Major Consumers Of Sputtering Targets
Appendix D: Major Manufacturers Of Sputtering Systems
List Of Tables
Summary Table A: Total World Markets For Sputtered Films And Sputtering Targets, 1998-2004
1 Target Materials And Reactive Gases Used To Produce Typical Reactively-Sputtered Films
2 Target Production Methods According To Material Type
3 Impact Of Target Microstructure On Deposition Process And Film Quality
4 Purity Level Terminology (Examples)
5 Maximum Acceptable Impurity Levels For High Purity Cobalt Sputtering Targets
6 Applications For Metal And Alloy Sputtered Films
7 Applications For Oxide Sputtered Films
8 Applications For Carbide, Boride, And Fluoride Sputtered Films
9 Applications For Nitride And Silicide Sputtered Films
10 Applications For Sulfide, Selenide, And Telluride Sputtered Films
11 Leading North American Suppliers Of Sputtering Targets
12 Other North American Suppliers Of Sputtering Targets
13 Foreign-Owned Target Suppliers In North America
14 World's Leading Manufacturers Of Sputtering Targets
15 Vertically-Integrated Companies And Their Capabilities
16 Major Capital Investments Of Industry Leaders Johnson Matthey And Tosoh, 1993-1998
17 Barriers To Entering The Target Industry As A Producer
18 Benefits And Disadvantages Of Spray Forming For Target Fabrication
19 Comparison Of Melting/Casting And Powder-Based Target Production Routes
20 Worldwide Consumption Of Sputtering Targets Segmented By Target Fabrication Method
21 Typical Spray Form Parameters For Aluminum Alloy Targets
22 Typical Minimum Target Grain Sizes From Conventional Metalworking Techniques
23 Benefits And Disadvantages Of Cylindrical Rotatable Targets
24 Key Technical Advantages Of Sputtering
25 Assignees Of Two Or More U.S. Patents Related To Target Production, 1990-1998
26 Assignees Of A Single U.S. Patent Related To Target Production, 1990-1998
27 Major Sputtering Target Materials Used For Microelectronic Applications
28 Integrated Circuit Thin Film Materials According To Deposition Method
29 Typical Thin Film Requirements For Microelectronic Applications
30 Typical Target Requirements For Microelectronic Applications
31 Primary Implications Of The Shift To Copper-Wired Chips On Sputtering Materials
32 Assumptions For Microelectronics Forecasts
33 World Markets For Sputtered Films And Sputtering Targets Used In Microelectronic Applications
34 Target Consumption In The Microelectronics Market By Application And Interconnect Type
35 Target Consumption In The Microelectronics Market By Material Type
36 Sputtering Target Materials Used For Data Storage Applications
37 Dvd Disk Formats
38 Sputtered Vs. Nonsputtered Layers Of A Magnetic Hard Disk
39 Sputtered Vs. Nonsputtered Layers Of Mr And Gmr Recording Heads
40 Sputtered Vs. Nonsputtered Layers Of A Cd-Audio Or Cd-Rom
41 Sputtered Vs. Nonsputtered Layers Of A Cd-R
42 Sputtered Vs. Nonsputtered Layers Of A Magneto-Optical Disk
43 Sputtered Vs. Nonsputtered Layers Of A Phase-Change Optical Disk
44 Typical Thin Film Requirements For Data Storage Applications
45 Typical Target Requirements For Data Storage Applications
46 Materials Implications Of Trends In Magnetic Data Storage
47 Materials Implications Of Trends In Optical Data Storage
48 Assumptions For Magnetic Storage Market Forecasts
49 World Markets For Sputtered Films And Sputtering Targets Used In Magnetic Storage Applications
50 Target Consumption In The Magnetic Storage Market By Product
51 Target Consumption In The Magnetic Storage Market By Material Type
52 Assumptions For Optical Storage Market Forecasts
53 World Markets For Sputtered Films And Sputtering Targets Used In Optical Storage Applications
54 Target Consumption In The Optical Storage Market By Disk Format
55 Target Consumption In The Optical Storage Market By Material Type
56 Sputtering Target Materials Used For Advanced Display Applications
57 Sputtered Vs. Non-Sputtered Layers Of An Active Matrix Liquid Crystal Display
58 Sputtered Vs. Nonsputtered Layers Of An Electroluminescent Display
59 Sputtered Vs. Nonsputtered Layers Of A Plasma Display Panel
60 Sputtered Vs. Non-Sputtered Layers Of A Field Emission Display
61 Typical Thin Film Requirements For Advanced Display Applications
62 Typical Target Requirements For Advanced Display Applications
63 Materials And Process Implications Of Trends In Advanced Displays
64 Assumptions For Advanced Display Forecasts
65 World Markets For Sputtered Films And Sputtering Targets Used In Display Applications
66 Target Consumption In The Advanced Display Market By Display Type
67 Target Consumption In The Advanced Display Market By Material Type
68 Materials Used For Optical Coating Applications
69 Sputtered Vs. Non-Sputtered Layers Of Solar Control Coatings
70 Sputtered Vs. Non-Sputtered Layers Of Low-Emissivity Coatings
71 Sputtered Vs. Non-Sputtered Layers Of Specialty Mirrors
72 Sputtered Vs. Non-Sputtered Layers Of Antireflection Coatings
73 Typical Thin Film Requirements For Glass Coating Applications
74 Typical Target Requirements For Optical Coating Applications
75 Materials Implications Of Trends In Optical Coating
76 Assumptions For Optical Coating Forecasts
77 World Markets For Sputtered Films And Sputtering Targets Used In Optical Coating Applications
78 Target Consumption In The Optical Coatings Market By Application
79 Target Consumption In The Optical Coatings Market By Material Type
80 Total World Markets For Sputtered Films And Sputtering Targets, 1998-2004
81 World Markets For Sputtered Films And Targets By Application, 1998-2004
82 World Markets For Sputtering Targets By Material Type, 1998-2004
83 Compilation Of U.S. Patents Related To Sputtering Target Production, 1990-1998
84 Major Consumers Of Sputtering Targets
85 Major Manufacturers Of Sputtering Systems
List Of Figures
Summary Figure A: Total World Markets For Sputtered Films And Sputtering Targets, 1999 And 2004
1 Schematic Of The Dc Diode Sputtering Process
2 Sputtering Target Production Flow Chart (Conventional Methods)
3 Shares Of The Worldwide Sputtering Target Market By Target Fabrication Method
4 Steps In Jme's Non-Casting Method To Produce High Purity Copper Sputtering Targets
5 Hip/Cladding Method To Produce Bonded Cylindrical Targets
6 Sputtering Target Technology: U.S. Patent Trends, 1990-1998
7 Shares Of U.S. Patents Related To Target Production By Country, 1990 To 1998
8 U.S. Patents Related To Target Production By Country, 1990 To 1998
9 Shares Of U.S. Patents By Material Type, 1990-1998
10 Breakdown Of Metal And Alloy Patents According To Type
11 Cross-Sectional Schematic Of The Thin Film Structure Of A Multilevel Metallization Circuit (Double-Metal Cmos)
12 Impact Of Trends In Integrated Circuit Fabrication On Sputtering Technology And Materials
13 Shares Of The Semiconductor Market For Sputtering Targets By Interconnect Type
14 Shares Of The Microelectronics Market For Sputtering Targets By Material Type
15 Cross-Sectional Schematic Of The Thin-Film Structure Of A Magnetic Hard Disk
16 Cross-Sectional Schematic Of The Thin Film Structures Of Mr And Gmr Recording Head Elements
17 Cross-Sectional Schematic Of The Thin Film Structure Of A Cd-Audio Or Cd-Rom
18 Cross-Sectional Schematic Of The Thin Film Structure Of A Cd-R
19 Cross-Sectional Schematic Of The Thin Film Structure Of A Magneto-Optical Recording Disk
20 Cross-Sectional Schematic Of The Thin Film Structure Of A Phase-Change Optical Disk
21 Shares Of The Magnetic Storage Market For Sputtering Targets By Product
22 Shares Of The Magnetic Storage Market For Sputtering Targets By Material Type
23 Shares Of The Optical Storage Market For Sputtering Targets By Disk Format
24 Shares Of The Optical Storage Market For Sputtering Targets By Material Type
25 Cross-Sectional Schematic Of The Thin Film Structure Of An Active Matrix Liquid Crystal Display
26 Thin Film Structure Of An Electroluminescent Display
27 Cross-Sectional Schematic Of The Thin Film Structure Of A Plasma Display Panel
28 Cross-Sectional Schematic Of The Structure Of A Field Emission Display
29 Shares Of The Advanced Display Market For Sputtering Targets By Display Type
30 Shares Of The Advanced Display Market For Sputtering Targets By Material Type
31 Cross-Sectional Schematic Of The Thin Film Structure Of Low-Emissivity Coatings
32 Cross-Sectional Schematic Of The Thin Film Structure Of Specialty Mirrors
33 Cross-Sectional Schematic Of The Thin Film Structure Of Antireflection Coatings
34 Shares Of The Optical Coatings Market For Sputtering Targets By Application
35 Shares Of The Optical Coatings Market For Sputtering Targets By Material Type
36 Total World Markets For Sputtered Films And Sputtering Targets, 1999-2004
37 Shares Of The Worldwide Market For Sputtering Targets By Application, 1999 And 2004
38 Shares Of The Worldwide Market For Sputtering Targets By Material Type, 1999 And 2004
AbstractSputtering targets serve as the raw materials for the sputter deposition of a variety of thin films and coatings used in the microelectronic, flat panel display, data storage, glass coating, and other industries. This timely technical-market study identifies critical technology and market trends that will impact producers of sputtered films and sputtering targets and suppliers to this industry in the new millennium. The structure of the industry is examined in detail, and profiles of major corporations and emerging companies in the business are presented. This comprehensive report also includes a patent analysis and detailed market forecast according to material type and application through 2004. From BCC.
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