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Published by: BCC Research
Published: May. 1, 1999 - 150 Pages
Table of Contents
Title
Introduction
Study Objectives
Reason For Doing Study
Scope And Format
Methodology And Information Sources
Acronyms And Related Notes
Summary
Performance Criteria For Electronic Enclosures
Background
Comparison Of Performance Criteria
Material Options For Electronic Enclosures
Metals
Background
Aluminum
Magnesium
Background
Advances
Recent Developments
Steel
Zinc
Plastics Versus Metals
Resin Choices For Electronic Enclosures
Background
Costs
Cost Performance
Resins
Abs
Background
Properties
Flame Retardant Grades
Disadvantages
Response To Disadvantages
Producers
Pc/Abs
Background
Grades
Applications
Properties
Producers
High-Impact Polystyrene (Hips)
Background And Properties
Disadvantages
Enhanced Grades
Producers
Polyvinyl Chloride (Pvc)
Background
Properties
Advantages/Disadvantages
Applications
Producers
Polycarbonates
Background
Advantages And Disadvantages
Producers
Other Resins
Alloys/Blends
Background
Ppo/Hips
Background
Properties And Advantages
Disadvantages
Pc/Pbt
Pc/Pet
Pvc/Abs
Thermoset Resins
Overview
Phenolic Molding Resins
Background
Engineering Grades
Producers
Unsaturated (Thermoset) Polyesters
Background
Reinforced Grades
Sheet Molding Compounds (Smc)
Bulk Molding Compounds (Bmc)
Producers
Conductive Plastics
Background
Advantages/Disadvantages
Compounding
Recently Introduced Grades
Inherently Conductive Polymers (Icps)
Background
Polymer Types
Versicon™
Electronic Enclosure Resin General Technology
Comparison Of Key Properties
Processing
Melt Flow
Mold Shrinkage
Mechanical Aspects
Tensile Strength
Flexural Strength
Flexural Modulus
Impact Strength
Thermal Considerations
Coefficient Of Linear Expansion (Clte)
Heat Deflection Temperature
Physical Parameters
Water Absorption
Dielectric Strength
Property Summary
Process Technology
Background
Injection Molding
Structural Foam Molding
Thermoforming
Differences In Molding Enclosures For Portable Vs. Stationary Devices
Background
Distinctions Between Portable And Stationary
Flame Retardancy Issues
Emi Shielding Issues
Other Factors
Other Factors Affecting Electronic Enclosures
Testing Agencies And Requirements
Underwriters Laboratories (Ul)
Background
Flammability Standards
Definitions
Flammability Tests
Overview
Ul 94 Vertical Burn Tests
Ul Horizontal Burn Test (Ul 94 Hb)
Summary Of Ul 94 Material Ratings
Ul 1950
Ul, Nema And Foreign Standards On Enclosures
Flame Retardancy
Overview
Recent Developments Related To Electronic Enclosures
Vinyls Reduce Blooming And Exhibit High Levels Of Flame Retardance
Brominated Epoxies Used In Hips For Business Equipment Housing Applications
The Bromine Issue
Background
Results Of Testing And Reaction Of Industry
Impact Upon Electronic Enclosure Industry
More Problems
Emi Shielding
Background
Overview
Shielding Effectiveness
Cost And Performance Characteristics Of Shielding Options
Electronic Industry/Emi Shielding Interface
Background
Enclosures
Computers And Emi
Cellular Phones
Tv Receivers
Vcrs
Stereo Components
Regulatory Issues
Background
Part 15
Class A And Class B Equipment
Impact Of Miniaturization On Shielding
New Emi Developments
One-Step Alternative To Painting Or Plating
Nickel-Coated Carbon Fibers
Thinwalling
Introduction
Thinwalling Is Not A Novel Concept
Unique Characteristics Of Thinwalling For Electronic Enclosures
Effects On Performance Requirements And Design
Portable Vs. Stationary Enclosures
Application Requirements
Material And Process Selection
Recent Developments
Pricing
Electronic Devices
Enclosure Resins
Resin Market Estimates And Forecasts
Background And Summary
Abs
Pc/Abs
Hips
Pvc
Polycarbonate
Other Resins
Applications
Definitions
Overview Of Factors Affecting Electronic Enclosures
Computer/Business Equipment
Consumer Electronics
Computers/Business Equipment
Background
Desktops
Background
Manufacturers
Monitors
Background
Manufacturers And Screen Sizes
Keyboards
Background
Ergonomic
Cordless
Laptops
Notebooks
Background
Features Of Newly Introduced Models
Resin Usage
Notebook Application Requirements
Manufacturers
Magnesium Enclosures
Ultraportable Computers (Upcs)/Hand-Helds
Background
Subnotebooks
Background
Manufacturers And Models
Other Ultraportables/Hand-Helds
Background
Cost Vs. Capabilities
Keyboard Scenario
Other Upc/Hand-Held Aspects
Power Considerations
Decision Variables For Users
Manufacturers And Models
Printers
Background
Manufacturers And Models
Market Segments
Scanners
Background
Manufacturers
Facsimile Machines (Fax Machines)
Copiers
Phones
Corded
Cordless
Cellular
Background
Cellular Vs. Mobile
Manufacturers
Pagers
Pointing Devices
Background
Types Of Pointing Devices
Manufacturers
Computer/Business Equipment Resin Enclosure Market Estimates And Forecasts
Determination Average Weights Of Enclosures For Major Types Of Computer/Business Equipment Products - Methodology
Dimensions Of Enclosures From Retail Store Audits
Estimates Of Electronic Enclosures Resin Volumes And Weights
Comparative Electronic Enclosure Resin Weight Ratios
Individual Computer/Business Equipment Markets By Type Of Resin
A Summation Of Factors Affecting Future Resin Growth In Computer/Business Equipment Electronic Enclosures
Consumer Electronics
Background
Trends In Audio/Video Products
Background
Downsizing
Demand
Television Sets
Radios
Players And Recorders
Camcorders
Miscellaneous
Background
Calculators
Video Games
Market Estimates And Forecasts
Producers Of Electronic Equipment Enclosure Resins
Background
Producers And Their Electronic Enclosure Resin Types
Producers And Electronic Enclosure Resin Trade Names Products
Resin Producer Observations
Industry Structure
Sic Codes
Top Electronic Industry Manufacturers
Electronic Manufacturers And Their Enclosure Related-Products
Enclosure Resin Industry
Overview
Mexican Scenario
Ge Plastics Learns To Mold In Small Lots
Ge Plastics And Ibm Combine Efforts On Thinkpad™
Molders And Electronic Enclosure Manufacturing Companies
Electronic Enclosure Injection Molders
Enclosure Manufacturers
Recycling
Background
Issues
Electronic Industry Interface
Recent Developments
Company Profiles
Resin Producers
Basf Plastics - Mount Olive, Nj
Bayer Corporation - Pittsburgh, Pa
Chevron Corporation - Houston, Tx
Condea Vista - Houston, Tx
Dow Plastics - Midland, Mi
Fina Oil & Chemical - Dallas, Tx
Ge Plastics - Pittsfield, Ma
Georgia-Gulf, Inc. - Plaquemine, La
Nova Chemicals - Calgary, Alberta, Canada
Oxyvinyls - Avon Lake, Oh
Molders
Apw Enclosures - Anaheim, Ca
Bk Plastics Industry - Port Richey, Fl
Channel Commercial - Temecula, Ca
Compass Plastics & Technologies, Inc. - Gardena, Ca
Courtesy Corporation - Buffalo Grove, Il
Flambeau Corporation - Baraboo, Wi
Jmr Electronics - Chatsworth, Ca
Jones Plastic And Engineering Corporation - Jeffersontown, Ky
Keytronics Corporation - Spokane, Wa
Mack Molding - Arlington, Vt
Mulay Plastics, Inc. - Coronado, Ca
Nypro, Inc. - Clinton, Ma
Palo Alto Products - Palo Alto, Ca
Plastics-Plate, Inc. - Kentwood, Mi
Puget Plastics Corporation - Tualtin, Or
Summit Plastic - Ronkonkoma, Ny
Thomson Consumer Electronics, Inc. - Indianapolis, In
Triquest Precision Plastics - Vancouver, Bc, Canada
Trend Technologies - San Jose, Ca
Tru-Mension Manufacturing - Titusville, Fl
Universal Plastics - Chicopee, Ma
Vynckier Enclosure Systems, Inc. - Houston, Tx
Waltec Plastics
Electronic Enclosure Companies
Elma Electronic - Fremont, Ca
Hammond Manufacturing - Hammond, In
Mfj Enterprises, Inc. - Starkville, Ms
Pac-Tec, Inc - Concordville, Pa
Zoltec Corporation - Van Nuys, Ca
List Of Tables
Summary Table: Computer/Business Equipment Enclosure Resin Volumes: 1998 And 2003
1 Comparison Of Key Performance Criteria For Electronic Enclosures: Metals Vs. Plastics
2 Comparison Of Resins For Electronic Enclosure Applications Based On Cost Performance
3 The Best And Worst Performing Resins And Resin Blends For Electronic Enclosures
4 Abs Producers And Capacities
5 Major Polystyrene Producers And Capacities
6 Advantages And Disadvantages Of Pvc In Electronic Enclosures
7 Key Advantages And Disadvantages Of Polycarbonates
8 Polycarbonate Producers And Capacities
9 Resin Comparison: Melt Flow Rates
10 Resin Comparison: Mold Shrinkage
11 Resin Comparison: Tensile Strength
12 Resin Comparison: Flexural Strength
13 Resin Comparison: Flexural Modulus
14 Resin Comparison: Notched Izod Impact
15 Resin Comparison: Coefficient Of Linear Expansion
16 Resin Comparison: Heat Deflection Temperatures
17 Resin Comparison: Water Absorption
18 Resin Comparison: Dielectric Strength
19 A Ten-Property Ranking For Resins Used In Electronic Enclosures
20 Criteria For Ul 94 V Classifications
21 Burn Specifications For Ul 94 Material Ratings
22 General Ratings Of Shielding Effectiveness
23 Enclosure Resin Prices At The End Of 1998
24 Resin Consumption In Computer/Business Equipment Electronic Enclosures: 1998-2003
25 Abs Consumption In Computer/Business Equipment Electronic Enclosures, 1998-2003
26 Pc/Abs Consumption In Computer/Business Equipment Electronic Enclosures, 1998-2003
27 Hips Consumption In Computer/Business Equipment Electronic Enclosures, 1998-2003
28 Pvc Consumption In Computer/Business Equipment Electronic Enclosures, 1998-2003
29 Polycarbonate Consumption In Computer/Business Equipment Electronic Enclosures, 1998-2003
30 Other Resin Consumption In Computer/Business Equipment Electronic Enclosures, 1998-2003
31 Major Desktop Computer Manufacturers
32 Monitor Manufacturers And Screen Sizes
33 Typical Notebook Application Requirements
34 Major Computer Notebook Manufacturers And Their Products
35 Subnotebooks Weighing Four To Six Pounds
36 Hand-Helds, Palmtops And Lightweight Subnotebooks
37 Selected Major Inkjet And Laser Printer Manufacturers
38 Types Of Pointing Devices For Portable Computers
39 Estimated Computer/Business Equipment Units Sold, 1998
40 Estimated Computer/Business Equipment Units Sold, 2003
41 Average Resin Enclosure Weights For Major Selected Computer/Business Equipment Products
42 Estimates Of Enclosure Resin Consumption From Units Of Computers/Business Equipment Sold, 1998
43 Estimates Of Enclosure Resin Consumption From Units Of Computers/Business Equipment Sold, 2003
44 Weight Ratios Of Resin Electronic Enclosures For Selected Computer/Business Equipment And Consumer Electronic Products
45 Computer/Business Equipment Aggregate Enclosure Resin Volumes, 1998 And 2003
46 Computer/Business Equipment Aggregate Enclosure Resin Volumes As A Percent Of Total, 1998 And 2003
47 Computer/Business Equipment Individual Electronic Enclosure Resin Volume As A Percent Of Total, 1998
48 Computer/Business Equipment Electronic Enclosure Resin Volume As A Percent Of Total, 2003
49 Desktop Computer Enclosure Resin Volume, 1998 And 2003
50 Monitor Enclosure Resin Volume, 1998 And 2003
51 Keyboard Enclosure Resin Volume, 1998 And 2003
52 Notebook Computer Enclosure Resin Volume, 1998 And 2003
53 Printer Enclosure Resin Volume, 1998 And 2003
54 Scanner Enclosure Resin Volume, 1998 And 2003
55 Fax Machine Enclosure Resin Volume, 1998 And 2003
56 Copier Enclosure Resin Volume, 1998 And 2003
57 All-In-One Machine Enclosure Resin Volume, 1998 And 2003
58 Corded Phone Enclosure Resin Volume, 1998 And 2003
59 Cordless Phone Enclosure Resin Volume, 1998 And 2003
60 Cellular Phone Enclosure Resin Volume, 1998 And 2003
61 Hand-Held1 Enclosure Resin Volume, 1998 And 2003
62 Pager Enclosure Resin Volume, 1998 And 2003
63 Other Hand-Held Enclosure Resin Volume, 1998 And 2003
64 Consumer Electronic Resin Consumption By Major Selected Categories, 1998 And 2003
65 Electronic Enclosure Resin Producers And Resin Types
66 Key Producers Of Resins Used To Mold Electronic Equipment Enclosures And Trade Named Products
67 Top Electronic Industry Manufacturers, 1998
68 Major Electronic Manufacturers And Their Enclosure-Related Products
69 Major Molders Of Electronic Enclosures Resins
70 Major Resin Enclosure Manufacturers
List Of Figures
1 Computer/Business Equipment Resin Enclosure Volume: 1998 And 2003
1 Resin Consumption In Computer/Business Equipment Electronic Enclosures, 1998 And 2003
2 Abs Consumption In Computer/Business Equipment Enclosure Volume, 1998
3 Pc/Abs Consumption In Computer/Business Equipment Electronic Enclosures, 1998
4 Hips Consumption In Computer/Business Equipment Electronic Enclosures, 1998
5 Desktop Enclosure Resin Volume, 1998 And 2003
6 Monitor Enclosure Resin Volume, 1998 And 2003
7 Keyboard Enclosure Resin Volume, 1998 And 2003
8 Notebook Enclosure Resin Volume, 1998 And 2003
9 Printer Enclosure Resin Volume, 1998 And 2003
10 Consumer Electronic Resin Enclosure Consumption By Major Selected Categories, 1998 And 2003
AbstractThinwalling and downsizing are the major drivers in the electronic enclosure market, which comprises computer/business equipment and consumer electronics. High impact polystyrene (HIPS), polycarbonates, ABS, PVC, and alloys/blends led by PC/ABS and PPO/HIPS are the most important resins used in these applications. This BCC report will estimate and forecast usage in these applications taking into consideration the explosive growth of portable electronic products, EMI shielding and challenges confronting the industry in terms of technologies, marketing and shortened product life cycles. From BCC.
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