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Published by: Bishop & Associates
Published: Aug. 1, 2006 - 250 Pages
Table of Contents
- Chapter 1 - Report Scope and Methodology
- Report objectives
- Study methodology
- Data collection forms
- Connector manufacturer survey
- Connector user survey
- Chapter 2 - Introduction and Definitions
- Preface
- Introduction
- Connector definitions / technologies
- Chapter 3 - High Speed Connector Basics
- Common backplane architectures
- High-speed transmission line issues
- Defining features of high speed connectors
- The second sourcing imperative
- Performance measurement systems
- Chapter 4 - The Need for Speed
- Market drivers to higher speed interfaces
- Speed vs. density
- The influence of industry standards
- Market trends
- Chapter 5 - High Speed Interconnect System Elements
- Driver and receiver technology
- Printed circuit board materials
- Printed circuit board design and fabrication
- Chapter 6 - Overview of current high-speed backplane/midplane connectors
- Amphenol TCS - VHDM, VHDM-HSD, GbX,
- Ventura, Aptera, Crossbow
- ERNI Components - ERmet ZD, ERmet zeroXT
- FCI - Metral 4000, AirMax VS
- Hirose - Hx2
- 3M- HSHM
- Molex - VHDM, VHDM-HSD
- Tyco Electronics -HS3, HM Zd, MultiGig RT
- Micro TCA Connectors
- Chapter 7 - High-Speed Mezzanine Connectors
- Mezzanine connector architecture
- Advantages of mezzanine packaging
- Interface types/ configurations
- Mezzanine connector applications
- The role of standards
- Chapter 8 - Overview of current High-Speed Mezzanine Connectors
- Amphenol TCS - VHDM Stacker, NeXLev
- ERNI - MicroSpeed, Stacking ERmet Zd
- FCI - Meg / Gig Array, Stacking AirMax VS
- Fujitsu - MicroGiGaCN
- HARTING - AMC Connector
- Hirose - IT1, IT-2, IT-4 Series
- Interconnect Systems - HILo
- Molex - Plateau HS Mezz, AMC connector
- Samtec - Rise-Up, Q Pairs, Sam Array
- Tyco Electronics - Mictor, STEP-Z, AMC
- Yamaichi Electronics - AMC
- Chapter 9 - High-Speed Backplane Cable Assemblies
- Bringing Cable to the backplane
- Cable assembly characteristics
- Typical applications
- Chapter 10 - Overview Of Selected High-Speed Backplane Cable Assembly Suppliers
- WL Gore & Associates
- Meritec
- Molex
- Samtec
- Sanmina SCI
- Tensolite
- Tyco Electronics
- Other suppliers
- Chapter 11 - Connector Design Features
- Introduction
- Backplane Connectors
- Amphenol TCS - Aptera L Series
- Amphenol TCS -CrossBow 2mm+
- Amphenol TCS - GbX1
- Amphenol TCS - GbX- L Series
- Amphenol TCS - GbX -E Series
- Amphenol TCS - Ventura
- Amphenol TCS - VHDM - H Series
- ERNI - ERmet Zero XT
- FCI - Metral 40001
- FCI - AirMax VS1
- Hirose - HX-2
- Tyco - Z-Pack HS-3
- Tyco - Z-Pack HM-Zd
- Tyco - Z-Pack Max
- Tyco - MultiGig RT
- 3M - Met Pak HSHM
- Orthogonal Midplane Connectors
- Amphenol TCS - CrossBow Matrix
- Tyco - Z-Pack Max Orthogonal
- Mezzanine Connectors
- Amphenol TCS - VHDM Stacker
- Amphenol TCS - NexLev
- ERNI - MicroSpeed
- FCI - Meg-Array
- FCI - Gig-Array
- Fujitsu - MicroGigaCN
- Hirose - IT-2 Series
- Hirose - IT-4 Series
- Molex - Plateau HS Mezz
- Samtec - Q Series
- Samtec - Sam Array
- Samtec - DP Array
- Samtec - SeaRay
- Tyco - Mictor
- Tyco - 05 FH Shielded Giga
- High Speed Cable Assemblies
- Comparison of physical attributes
- Comparison of electrical performance
- Chapter 12 - Market Analysis / Forecasts
- Measurement criteria
- High-Speed backplane / midplane connectors
- World market 2004 -2010 by bandwidth segment
- World market 2004 - 2010 by geographic region
- World market 2004 - 2010 by end user
- High Speed Mezzanine Connectors
- World market 2004 -2010 by bandwidth segment
- World market 2004 -2010 by geographic region
- World market 2004 -2010 by end user
- High Speed Copper Cable Assemblies
- World market 2004 -2010 by bandwidth segment
- World market 2004 -2010 by geographic region
- World market2004 -2010 by end user
- Chapter 13 - The Fiber Optic Option
- Fiber optic backplane development status
- Chapter 14 - High-Speed connector innovation
- Efficere Technologies
- Particle interconnects
- SiliconPipe contact design
- Foxconn FX-VMP Orthogonal connector
- Chapter 15 - Major Findings And Conclusions
- Appendix - List Of Contributors
AbstractThis 15 chapter report is comprehensive in scope and covers backplane, midplane, mezzanine and cable assemblies from 2 to Gb/s. This report providing a complete analysis of Evolving High-Speed Connectors. This new report details backplane, midplane, and mezzanine connectors as well as high-speed backplane cable assemblies. Connector values are provided for each category for the years 2004, 2005, 2006, and 2010, as well as each region of the world.
The market for high-speed connectors has experienced extensive changes over the past two years from both the technology, as well as business perspectives. This report includes background information on the evolution of high-speed circuits and connectors, and includes data on key electrical and mechanical characteristics for each of the leading interfaces on the market today. The influences of printed circuit board designs, materials, and advanced silicon chips on multigigabit circuit performance are reviewed. Advances in circuit modeling and simulation along with performance testing methods are also covered. Common applications as well as the future direction of the market is discussed along with statistical data on market size and forecasts by bandwidth, end user, and region of the world.
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