Advanced Electronic Packaging : Market Research Report

Advanced Electronic Packaging

Published by: Global Industry Analysts

Published: Feb. 1, 2006 - 459 Pages

I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS
II. EXECUTIVE SUMMARY: 1. Current and Future Analysis; 2. Industry Overview; 3. Issues and Trends; 4. Growth Drivers; 5. Product Overview; 6. Technological Developments/Breakthroughs; 7. Product Introductions/Innovations; Hitachi Releases New Line of Multi-Chip Modules; Ohmite Launches BG Series Resistor Arrays; ANADIGICS Announces Multi-Chip Module Assembly Line; Aavid Thermal Products Introduces BGA Cooling Products

8. Recent Industry Activity

ASE and Flip Chip in a Licensing Agreement

Quantum Acquires CiP technology from Silicon Bandwidth

Sumitomo Acquires Stake in Quantum

STATS to Expand Flip Chip Package Production Capacity

Tessera Inks a Licensing Deal with NEC Electronics

ChipPac to Merge with STATS

ASE Forms Strategic Partnership with NEC Electronics

Amkor Bags Packaging Order from Oki Electric

ASAT Holdings Expands Capacity

Global Advanced Packaging Selects First Teradyne Tiger Test System

ASM Bags BGA Packaging Systems Order

Toshiba Inks Licensing Agreement with Tessera

Ace Semiconductor Forms Alliance with Chip Makers

SEMCO to Mass Produce FC-BGA

ASE Adopts Cadence’s IC Packaging Design Flow

Amkor Adds Stacked CSP to its Portfolio

Tessera Expands Licensing Agreement With Hitachi

Advanced Packaging to Open New Packaging Line

Tegal Corp Joins Advanced Packaging and Interconnect Alliance

Advanced Interconnect Adds System-In-Package to its Portfolio

Tessera in Joint Venture with Intel Corp

Parelec Adds Parmod VLT Line of Products

TDA Systems Discover Defects in BGA Packages

ChipPAC Starts New Production Line in China

Tchip Selects ASAT to Provide CSP

Microsemi Signs Agreement with Nitronex

Motorola Labs Receives Major Contract

Fujitsu to Expand Assembly Services Capacity

DuPont Creates Three Separate Strategic Business Units

ASE Starts Volume Production of Wafer-Level Chip Scale Packages

SST Selects Kingpak to Provide Chip-Scale BGA Packaging

Pacific Aerospace & Electronics Secures New Patent

DELSY to License Shellcase

Micronic Bags Repeat Order for Pattern Generator

ASE Provides Test Services for Transmeta

Diodes Enters into Alliance with Microsemi Corp

ASE and Conexant Enter into Cross-Licensing Agreement

Amkor Adds Latest Packaging Equipment

Global Semiconductor Companies Form Consortium

CSP Inks Agreement with Objective Interface

Tessera Signs Licensing Agreement with Mitsui

Tessera Strikes Agreement with Meicer

Semtech Announces Integration of Wafer-Level CSP Technology

White Electronic Bags DSP Multi-Chip SRAM Module Order

Interpoint Signs Agreement with Wave Systems

Nortel Networks Divests Electronic Design and Packaging Units

Amkor Technology Expands Capacity

Globetronics Technology to Start New Production Unit

9. Focus on Select Players

Advanced Semiconductor Engineering Group (Taiwan)

Amkor Technology Inc (USA)

ASAT Holdings Limited (Hong Kong)

ASM International NV (The Netherlands)

ChipScale, Inc. (USA)

Fairchild Semiconductor International (USA)

Motorola Inc (USA)

NEC Electronics Corporation (Japan)

Semtech Corporation (USA)

STATS ChipPAC Ltd (Singapore)

Tessera, Inc (USA)

Texas Instruments Inc (USA)

Toshiba America Electronic Components, Inc. (USA)

Major Strategies of Integrated Solution Providers

10. Global Market Perspective

Table12: World Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region-US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (include corresponding Graphs/Chart)

Table 13: World 10-Year Perspective for Advanced Electronic Packaging by Geographic Region-Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (include corresponding Graphs/Chart)

Table14: World Recent Past, Current & Future Analysis for Ball Grid Arrays by Geographic Region-US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (include corresponding Graphs/Chart)

Table15: World 10-Year Perspective for Ball Grid Arrays by Geographic Region-Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (include corresponding Graphs/Chart)

Table16: World Recent Past, Current & Future Analysis for Chip Scale Packages by Geographic Region-US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (include corresponding Graphs/Chart)

Table17: World 10-Year Perspective for Chip Scale Packages by Geographic Region-Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (include corresponding Graphs/Chart)

Table 18: World Recent Past, Current & Future Analysis for Multi Chip Modules by Geographic Region-US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (include corresponding Graphs/Chart)

Table 19: World 10-Year Perspective for Multi Chip Modules by Geographic Region-Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (include corresponding Graphs/Chart)

III.MARKET

1. The United States

A. Market Analysis

Outlook

A Brief Market Insight

Market Shows Signs of Recovery

Chip Manufacturers-Looking for Greener Pastures

Key US Players

Amkor Technology Inc

ChipScale, Inc.

Fairchild Semiconductor International

Motorola Inc

Semtech Corporation

Tessera, Inc

Texas Instruments Inc

Toshiba America Electronic Components, Inc.

Technological Developments/Breakthroughs

Product Launches

Strategic Developments

B. Market Analytics

Table 20: US Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Product Segment-Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (include corresponding Graphs/Chart)

Table 21 : US 10-Year Perspective for Advanced Electronic Packaging by Product Segment-Percentage Breakdown of Dollar Sales for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets for years 2000, 2005 & 2010 (include corresponding Graphs/Chart)

2. Canada

A. Market Analysis

Outlook

Strategic Development

B. Market Analytics

Table 22: Canadian Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Product Segment-Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (include corresponding Graphs/Chart)

Table 23: Canadian 10-Year Perspective for Advanced Electronic Packaging by Product Segment-Percentage Breakdown of Dollar Sales for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets for years 2000, 2005 & 2010 (include corresponding Graphs/Chart)

3. Japan

A. Market Analysis

Outlook

Weakness in the Industry Structure

Japanese Companies on Comeback Trial

Product Launches

Strategic Developments

Key Japanese Player

NEC Electronics Corporation

B. Market Analytics

Table 24: Japanese Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Product Segment-Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (include corresponding Graphs/Chart)

Table25: Japanese 10-Year Perspective for Advanced Electronic Packaging by Product Segment-Percentage Breakdown of Dollar Sales for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets for years 2000, 2005 & 2010 (include corresponding Graphs/Chart)

4. Europe

A. Market Analysis

Analysis by Geographic Region

Table 26: European Market for Advanced Electronic Packaging: Geographic Regions Ranked by Growth-Rest of Europe, UK, Germany, France, and Italy (include corresponding Graphs/Chart)

Analysis by Product Segment

Table 27: European Market for Advanced Electronic Packaging: Product Segments Ranked by Growth-Chip Scale Packages, Ball Grid Arrays, and Multi Chip Modules (include corresponding Graphs/Chart)

European Advanced Packaging Technologies

B. Market Analytics

Table 28: European Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region-France, Germany, Italy, UK, and Rest of Europe Markets Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (include corresponding Graphs/Chart)

Table 29: European Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Product Segment-Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (include corresponding Graphs/Chart)

Table30: European 10-Year Perspective for Advanced Electronic Packaging by Geographic Region-Percentage Breakdown of Dollar Sales for France, Germany, Italy, UK, and Rest of Europe Markets for Years 2000, 2005 & 2010 (include corresponding Graphs/Chart)

Table31: European 10-Year Perspective for Advanced Electronic Packaging by Product Segment-Percentage Breakdown of Dollar Sales for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets for Years 2000, 2005 & 2010 (include corresponding Graphs/Chart)

4A. France

Market Analysis

Table32: French Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Product Segment-Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (include corresponding Graphs/Chart)

Table33: French 10-Year Perspective for Advanced Electronic Packaging by Product Segment-Percentage Breakdown of Dollar Sales for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets for Years 2000, 2005 & 2010 (include corresponding Graphs/Chart)

4B. Germany

A. Market Analysis

Outlook

Strategic Development

B. Market Analytics

Table34: German Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Product Segment-Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (include corresponding Graphs/Chart)

Table35: German 10-Year Perspective for Advanced Electronic Packaging by Product Segment-Percentage Breakdown of Dollar Sales for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets for Years 2000, 2005 & 2010 (include corresponding Graphs/Chart)

4c. Italy

Market Analysis

Table36: Italian Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Product Segment-Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (include corresponding Graphs/Chart)

Table37: Italian 10-Year Perspective for Advanced Electronic Packaging by Product Segment-Percentage Breakdown of Dollar Sales for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets for Years 2000, 2005 & 2010 (include corresponding Graphs/Chart)

4d. The United Kingdom

Market Analysis

Table38: UK Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Product Segment-Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (include corresponding Graphs/Chart)

Table39: UK 10-Year Perspective for Advanced Electronic Packaging by Product Segment-Percentage Breakdown of Dollar Sales for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets for Years 2000, 2005 & 2010 (include corresponding Graphs/Chart)

4e. Rest of Europe

A. Market Analysis

Outlook

Technological Development/Breakthrough

Strategic Developments

Key Player

ASM International NV (The Netherlands)

B. Market Analytics

Table 40: Rest of Europe Recent Past, Current & Future Analysis for Advanced Electronic Packaging-by Product Segment for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (include corresponding Graphs/Chart)

Table 41: Rest of Europe 10-Year Perspective for Advanced Electronic Packaging by Product Segment-Percentage Breakdown of Dollar Sales for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets for Years 2000, 2005 & 2010 (include corresponding Graphs/Chart)

5. Asia-Pacific

A. Market Analysis

Outlook

A Brief Review

China-A Promising Market

Taiwan-Looking Ahead

Technological Developments/Breakthroughs

Product Launches

Strategic Developments

Key Players

Advanced Semiconductor Engineering Group (Taiwan)

ASAT Holdings Limited (Hong Kong)

STATS ChipPAC Ltd (Singapore)

B. Market Analytics

Table 42: Asia-Pacific Recent Past, Current & Future Analysis for Advanced Electronic Packaging-by Product Segment for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (include corresponding Graphs/Chart)

Table 43: Asia-Pacific 10-Year Perspective for Advanced Electronic Packaging by Product Segment-Percentage Breakdown of Dollar Sales for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets for Years 2000, 2005 & 2010 (include corresponding Graphs/Chart)

6. Rest of World

Market Analysis

Table 44: Rest of World Recent Past, Current & Future Analysis for Advanced Electronic Packaging-by Product Segment for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (include corresponding Graphs/Chart)

Table 45: Rest of World 10-Year Perspective for Advanced Electronic Packaging by Product Segment-Percentage Breakdown of Dollar Sales for Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets for Years 2000, 2005 & 2010

IV. COMPETITION

1. Aavid Thermalloy LLC (USA)

2. Advanced Interconnect Technologies (Singapore)

Advanced Interconnect Technologies, Inc. (USA)

3. Advanced Semiconductor Engineering Group (Taiwan)

4. Amkor Technology, Inc. (USA)

Table 46: First Quarter Sales Comparison: 2003-2004 (Q1) (In US$ million)

Amkor Japan (Japan)

5. Analog Devices, Inc. (USA)

Table 47: Half Yearly Sales Analysis: 2003-2004 (H1) (In US$ million)

6. Asat Holdings Limited (Hong Kong)

Table 48: Annual Sales Analysis: 2003-2005 (In HK$ million)

Table 49: Annual Sales Analysis By Product Segment: 2003-2004 (In HK$ million)

Table 50: Annual Sales Analysis By Geographic Region: 2003-2004 (In HK$ million)

Asat, Inc. (USA)

7. ASM International NV (The Netherlands)

Table 51: Half Yearly Sales Comparison: 2004-2005 (H1) (In US $ million)

Table 52: Annual Sales Comparison: 2003-2004 (In US $ million)

ASM Pacific Technology Ltd. (Hong Kong)

Table 53: Half yearly Sales Comparison by Business Segment: 2003-2004 (H1) (In HKS billion)

Table 54: Half yearly Sales Comparison by Geographical Region: 2003-2004 (H1) (In HKS billion)

8. Atmel Corporation (USA)

Table 55: First Quarter Sales Analysis: 2004-2005 (Q1) (In US$ million)

Table 56: Annual Sales Analysis: 2003-2004 (In US$ million)

Table 57: Annual Sales Analysis by Quarter: 2003-2004 (In US$ million)

Table 58: Annual Sales Analysis by Segment: 2003-2004 (In US$ million)

Table 59: Annual Sales Analysis by Geographical Region: 2003-2004 (In US$ million)

9. California Micro Devices Corporation (USA)

Table 60: First Quarter Sales Analysis: 2003-2004 (Q1) (In US$ million)

10. Carsem (M) Sdn. Bhd. (Malaysia)

Carsem, Inc. (USA)

11. Chipscale, Inc. (USA)

12. Datacon Semiconductor Equipment GmbH (Austria)

13. Dupont Electronic Technologies (USA)

14. Fairchild Semiconductor International, Inc. (USA)

Table 61: Half Yearly Sales Analysis: 2004-2005 (H1) (In US$ million)

Table 62: Half Yearly Sales Analysis by Product: 2004-2005 (H1) (In US$ million)

Table 63: Annual Sales Analysis: 2003-2004 (In US$ million)

Table 64: Annual Sales Analysis by Product: 2003-2004 (In US$ million)

Table 65: Annual Sales Analysis by Geographical Region: 2003-2004 (In US$ million)

15. Flextronics Semiconductor (USA)

16. Flip chip International LLC (USA)

17. Fujitsu Limited (Japan)

Table 66: Annual Sales Analysis by Business Segment: 2003-2004 (In ¥ billion)

Table 67: Annual Sales Analysis by Geographic Region: 2003-2004 (In ¥ billion)

Fujitsu Microelectronics America, Inc. (USA)

18. Global Advanced Packaging Technology Ltd. (China)

19. Globetronics Technology Bhd (Malaysia)

Table 68: Half-Yearly Sales Comparison by Geographical Region: 2003-2004 (H1) (In RM million)

20. Hitachi Ltd. (Japan)

Table 69: Annual Sales Analysis: 2003-2005 (In ¥ billion)

Table 70: Annual Sales By Segment: 2004-2005 (In ¥ billion)

Table 71: Annual Sales Analysis By Geographic Region: 2004-2005 (In ¥ billion)

Hitachi Cable America, Inc. (USA)

Renesas Technology Corporation (Japan)

21. Hynix Semiconductor, Inc. (Korea)

Table 72: Annual Sales Analysis: 2003-2004 (In KWN billion)

22. Ibiden Circuits Of America Corporation (USA)

23. Infineon Technologies AG (Germany)

Table 73: Nine Months Sales Analysis: 2003-2004 (Nine Months Ended, June) (In € billion)

Table 74: Nine Months Sales Analysis by Segment: 2003-2004 (Nine Months Ended, June) (In € billion)

Table 75: Nine Months Sales Analysis by Geographical Region: 2003-2004 (Nine Months Ended, June) (In € billion)

24. Integrated Device Technology, Inc. (USA)

Table 76: First Quarter Sales Analysis: 2004-2005 (Q1) (In US$ million)

Table 77: Annual Sales Analysis: 2002-2004 (In US$ million)

Table 78: Quarterly Sales Analysis: 2003-2004 (In US$ million)

Table 79: Annual Sales Analysis By Business Segment: 2003-2004 (In US$ million)

Table 80: Annual Sales Analysis by Geographic Region: 2003-2004 (In US$ million)

25. Intel Corporation (USA)

Table 81: First Quarter Sales Analysis by Segment: 2003-2004 (Q1) (In US$ million)

Table 82: First Quarter Sales Analysis by Geographical Region: 2003-2004 (Q1) (In US$ million)

26. Interconnect Systems, Inc. (USA)

27. Interpoint Corporation (USA)

28. Intersil Corporation (USA)

Table 83: First Quarter Sales Comparison: 2003-2004 (Q1) (In US$ million)

29. Ironwood Electronics, Inc. (USA)

30. Kingpak Technology, Inc. (USA)

31. Royal Philips Electronics NV (The Netherlands)

Table 84: Half-Yearly Sales Analysis: 2004-2005 (H1) (In € billion)

Table 85: Half-Yearly Sales Analysis by Division: 2004-2005 (H1) (In € billion)

Table 86: Half-Yearly Sales Analysis by Geographical Region: 2004-2005 (H1) (In € billion)

Table 87: Annual Sales Analysis: 2002-2004 (In € billion)

Table 88: Annual Sales Analysis by Division: 2003-2004 (In € billion)

Table 89: Annual Sales Analysis by Geographical Region: 2003-2004 (In € billion)

32. Kyocera America, Inc. (USA)

33. Lattice Semiconductor Corporation (USA)

Table 90: Half Yearly Sales Analysis: 2003-2004 (H1) (In US$ million)

34. LG Electronics (South Korea)

Table 91: First Quarter Sales Analysis: 2004-2005 (Q1) (In KRW billion)

Table 92: First Quarter Sales Analysis By Segment: 2004-2005 (Q1) (In KRW billion)

Table 93: Annual Sales Analysis: 2003-2004 (In KRW billion)

Table 94: Annual Sales Analysis by Division: 2003-2004 (In KRW billion)

LG Innotek Co., Ltd. (Korea)

35. LSI Logic Corporation (USA)

Table 95: First Quarter Sales Comparison: 2003-2004 (Q1) (In US$ million)

36. Maxtek Components Corporation (USA)

37. Micron Technology, Inc. (USA)

Table 96: Half Yearly Sales Analysis: 2003-2004 (H1) (In US$ million)

38. Micronic Laser Systems AB (Sweden)

Table 97: Half-Yearly Sales Comparison by Geographical Region: 2003-2004 (H1) (In SK million)

39. Microsemi Corporation (USA)

Table 98: Half Yearly Sales Analysis By Geographic Region: 2003-2004 (H1) (In US$ million)

40. Mitsubishi Electric and Electronics USA, Inc. (USA)

41. Mitsui High-Tec, Inc. (Japan)

42. Motorola, Inc. (USA)

Table 99: First Quarter Sales Analysis: 2004-2005 (Q1) (In US$ billion)

Table 100: First Quarter Sales Analysis by Segment: 2004-2005 (Q1) (In US$ billion)

Table 101: Annual Sales Analysis: 2003-2004 (In US$ billion)

Table 102: Annual Sales Analysis by Business Segment: 2003-2004 (In US$ billion)

Table 103: Annual Sales Analysis by Geographical Region: 2003-2004 (In US$ billion)

Table 104: Annual Sales Analysis by Quarter: 2003-2004 (In US$ billion)

43. M-Systems Flash Disk Pioneers Ltd. (Israel)

Table 105: First Quarter Sales Analysis: 2003-2004 (Q1) (In $ million)

M-Systems, Inc. (USA)

44. National Semiconductor Corporation (USA)

Table 106: Annual Sales Analysis: 2003-2005 (In US$ million)

Table 107: Annual Sales Analysis by Quarter: 2004-2005 (In US$ million)

45. NEC Electronics Corporation (Japan)

Table 108: Annual Sales Comparison: 2004-2005 (In ¥ billion)

Table 109: Annual Sales Comparison by Segment: 2004-2005 (In ¥ billion)

Table 110: Annual Sales Comparison by Geographic Region: 2004-2005 (In ¥ billion)

Table 111: Annual Sales Comparison by Segment: 2003-2004 (In ¥ billion)

Table 112: Annual Sales Comparison by Geographic Region: 2003-2004 (In ¥ billion)

NEC Electronics America, Inc. (USA)

46. NemeriX SA (Switzerland)

47. NTK Technologies, Inc. (USA)

48. Ohmite Manufacturing Co. (USA)

49. OKI Semiconductor Company (USA)

50. Orient Semiconductor Electronics Ltd. (Taiwan)

51. Pantronix Corporation (USA)

52. Parelec, Inc. (USA)

53. Philips Semiconductors (The Netherlands)

54. Phoenix Precision Technology Corporation (Taiwan)

Table 113: First Quarter Sales Comparison: 2003-2004 (Q1) (In NT$ million)

55. Polymer Assembly Technology, Inc. (USA)

56. Samsung Electro-Mechanics Co., Ltd. (South Korea)

Table 114: Half Yearly Sales Analysis: 2003-2004 (H1) (In Won Hundred Million)

57. Sanmina-SCI Corporation (USA)

Table 115: Half Yearly Sales Analysis By Geographic Region: 2003-2004 (H1) (In US$ billion)

58. Semtech Corporation (USA)

Table 116: Half-Yearly Sales Analysis: 2005-2006 (H1) (In US$ million)

Table 117: Annual Sales Analysis: 2003-2005 (In US$ million)

Table 118: Annual Sales Analysis by Quarter: 2004-2005 (In US$ million)

Table 119: Annual Sales Analysis by Segment: 2004-2005 (In US$ million)

Table 120: Annual Sales Analysis by Geographical Region: 2004-2005 (In US$ million)

59. Sharp Microelectronics of the Americas (USA)

60. Shellcase Limited (Israel)

61. Shinko Electric Co., Ltd. (Japan)

62. Silicon Storage Technology (USA)

Table 121: Half Yearly sales Analysis: 2003-2004 (H1) ( In US$ million)

63. Siliconware Precision Industries Co., Ltd. (Taiwan)

64. Skyworks Solutions, Inc. (USA)

Table 122: Nine Months Ended Sales Comparison by Quarters: 2003-2004 (Nine-Months Ended June) (In US$ million)

65. ST Assembly Test Services (Singapore)

Table 123: Half Yearly Sales Comparison: 2003-2004 (H1) (In US$ thousand)

66. ST Microelectronics, Inc. (USA)

67. Stats Chippac, Ltd. (Singapore)

Table 124: Annual Sales Analysis: 2003-2004 (In US$ million)

68. TDA Systems, Inc. (USA)

69. Tessera Technologies, Inc. (USA)

Table 125: Half yearly Sales Analysis: 2004-2005 (H1) (In US$ million)

Table 126: Half yearly Sales Analysis by Business Segment: 2004-2005 (H1) (In US$ million)

Table 127: Annual Sales Analysis: 2003-2004 (In US$ million)

Table 128: Annual Sales Analysis by Business Segment: 2003-2004 (In US$ million)

70. Texas Instruments, Inc. (USA)

Table 129: Half-Yearly Sales Analysis By Quarters: 2004-2005 (H1) (In US$ billion)

Table 130: Half-Yearly Sales Analysis by Segment: 2004-2005 (H1) (In US$ billion)

Table 131: Annual Sales Analysis By Quarters: 2003-2004 (In US$ billion)

Table 132: Annual Sales Analysis by Segment: 2003-2004 (In US$ billion)

Table 133: Annual Sales Analysis by Geographic Region: 2003-2004 (In US$ billion)

71. Toshiba America Electronic Components, Inc. (USA)

72. Traquair Data System, Inc. (USA)

73. Unimicron Corporation (Taiwan)

74. Unitive, Inc. (USA)

75. White Electronic Designs Corporation (USA)

76. WJ Communications, Inc. (USA)

Table 134: Half Yearly Sales Analysis By Product Segment: 2003-2004 (H1) (In US$ million)

77. Yamaichi Electronics USA, Inc. (USA)

Abstract

This report analyzes the worldwide markets for Advanced Electronic Packaging in Millions of US$. The specific product segments analyzed are Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), Latin America, and Rest of World. Annual forecasts are provided for each region and product segment for the period of 2000 through 2010. The report profiles 77 companies including many key and niche players worldwide such as Advanced Semiconductor Engineering Group, Amkor Technology, Inc., ASAT Holdings Limited, ASM International NV, ChipScale, Inc., Fairchild Semiconductor International, Motorola, Inc., NEC Electronics Corporation, Semtech Corporation, STATS ChipPAC Ltd., Tessera, Inc., Texas Instruments, Inc., and Toshiba America Electronic Components, Inc.

Please note: Reports are sold as single-site single-user licenses. The delivery time for hard copies is between 3-5 business days, as each hard copy is custom printed for the organization ordering it. Electronic versions require 24-48 hours as each copy is customized to the client with digital controls and custom watermarks. The Publisher uses digital controls protecting against copying and printing is restricted to one full copy to be used at the same location. Adobe Acrobat Reader 7.0 is required to view the report. Upon ordering an electronic version, the Publisher will provide a link to download the purchased report.

Titles available via "online download" are not affected by this and are still delivered to your reading room immediately.

Prior to fulfillment of an order, the client will be required to sign a document detailing the purchase terms for a publication from this publisher.

Get Full Details About This Report >>

US: 800.298.5699

Int'l: +1.240.747.3093

About MarketResearch.com
MarketResearch.com is an online aggregator selling over 160,000 market research reports, company profiles and country profiles from over 600 research firms. Our reports will provide you with the critical business and competitive intelligence you need for strategic planning and marketing research. Coverage includes the US, UK, Europe, Asia and global markets.

Advanced Electronic Packaging

Table of Contents

Abstract