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Published by: Frost & Sullivan
Published: Nov. 11, 2005
Table of Contents
1. Executive Summary
1. Market Overview
1. Introduction
2. Market Forecasts- World
2. Summary of Major Findings
1. Market Segment Analysis - Total PCB ATE Markets
2. Market Segment Analysis - In-circuit ATE Market
3. Market Segment Analysis - Functional ATE Market
4. Market Segment Analysis - Boundary Scan ATE Market
5. Market Segment Analysis - Manufacturing Defect Analyzers ATE Market
6. Strategic Conclusions 2. Total Printed Circuit Board (PCB) ATE Market
1. Overview
1. Overview and Definition
2. Market Engineering Measurements - Overview
3. Market Engineering Measurements - Sizing Analysis
4. Market Engineering Measurements - Structure Analysis
5. Industry Challenges
6. Market Drivers
a. Testing Policy by Department of Defense (DoD) on Automatic Test Equipment
b. Design-for-test (DFT) and Built-in self-test (BIST) Techniques Lower Costs
c. Increased Levels of Electronic Content and Technology
d. Shift from ATE Hardware to Software
e. Smaller sizes of Automatic Test Equipment
7. Market Restraints
a. Industry Trends Toward Miniaturization and High Density Circuitry Demand New Test Equipment
b. Increasing Quality Standards Have Reduced the Need for Testing
c. High Cost of Automated Test Equipment
2. Forecasts Trends and Revenue Analysis
1. Revenue Forecasts
2. Market and Technology Trends
3. Competitive Structure and Market Share Analysis
1. Competitive Structure
2. Market Share
4. Geographic Analysis
1. Overview
2. North America
3. Europe
4. Asia Pacific
5. Rest-of-World
5. Frost & Sullivan Awards
1. Overview
2. Growth Strategy Leadership Award
3. Vertical Market Penetration Leadership Award
4. Product Line Strategy Leadership Award 3. In-circuit ATE Market
1. Overview
1. Overview and Definition
2. Market Engineering Measurements
3. Market Drivers
a. Production-orientated Approach to Testing Reduces Cost
b. Vectorless Test Techniques have been Developed to Reduce the Test Development Effort for Complex Digital Parts
c. Low-cost ICT Seen to Help Original Equipment Manufacturers (OEMs) Invest in ICT
4. Market Restraints
a. Conventional Methods of In-circuit Test Being Replaced by New Test Technologies
b. High Overhead Costs Due to Unused Tester Resources
c. Changes in Surface Mount Technology (SMT) Manufacturing
2. Forecasts Trends and Revenue Analysis
1. Revenue Forecasts
2. Market and Technology Trends
3. Competitive Structure and Market Share Analysis
1. Competitive Structure
2. Market Share Analysis 4. Functional ATE Market
1. Overview
1. Overview and Definition
2. Market Engineering Measurements
3. Market Drivers
a. Test Strategies Moving Toward More Flexible Software-based Solutions
b. Signal Integrity Drives Functional Testing
c. Shorter Product Life Cycles Increase Demand for Functional ATE
4. Market Restraints
a. Difficulty in Functional Test Diagnostics and Repair
b. Design-for-Test (DFT) Expected to Reduce Dependence on ATE
2. Forecasts Trends and Revenue Analysis
1. Revenue Forecasts
2. Market and Technology Trends
3. Competitive Structure and Market Share Analysis
1. Competitive Structure
2. Market Share Analysis 5. Boundary Scan ATE Market
1. Overview
1. Overview and Definition
2. Market Engineering Measurements
3. Market Drivers
a. Reusing Boundary Scan Tests after Manufacturing Results in Significant Cost and Time Savings
b. Ball Grid Array (BGA) Packaging Driving Market for Boundary Scans
c. High Accessibility of Boundary Scans Expected to Drive Market
4. Market Restraints
a. The Need for Chip Designers to Design Boundary Scans into the Chip
b. Lack of Boundary Scan-compatible Components
2. Forecasts Trends and Revenue Analysis
1. Revenue Forecasts
2. Market and Technology Trends
3. Competitive Structure and Market Share Analysis
1. Competitive Structure
2. Market Share Analysis 6. Manufacturing Defect Analyzers ATE Market
1. Overview
1. Overview and Definition
2. Market Engineering Measurements
3. Market Drivers
a. Lower Cost of Manufacturing Defect Analyzers Makes it a Viable Option for End Users
b. Improvements in Manufacturing Processes Expand Role of Manufacturing Defect Analyzers
c. Manufacturing Defect Analyzers are Upgradable and Hence Avoid Obsolescence
4. Market Restraints
a. Lower-priced and Reduced-functionality ICT Systems Competing with Manufacturing Defect Analyzers
b. Dynamic Testing of Boards is not Possible Using Manufacturing Defect Analyzers
2. Forecasts Trends and Revenue Analysis
1. Revenue Forecasts
2. Market and Technology Trends
3. Competitive Structure and Market Share Analysis
1. Competitive Structure
2. Market Share Analysis 7. Appendix
1. Decision Support Database
1. Annual Telecom Investments
2. Personal Computer Installed Base
3. Printed Circuit Board Sales
4. Global Semiconductor and Semiconductor Equipment Market
5. Total Light Vehicles Sales
List Of Figures
Chapter 2
- Total Printed Circuit Board ATE Markets: Impact of Top Eight Industry Challenges (World), 2005-2011
- Total Printed Circuit Board ATE Markets: Market Drivers Ranked in Order of Impact (World), 2005-2011
- Total Printed Circuit Board ATE Markets: Market Restraints Ranked in Order of Impact (World), 2005-2011
- Total Printed Circuit Board ATE Markets: Unit Shipment and Revenue Forecasts (World), 2001-2011
- Total Printed Circuit Board ATE Markets: Percent of Revenues by Segment (World), 2001-2011
- Total Printed Circuit Board ATE Markets: Competitive Structure (World), 2004
- Total Printed Circuit Board ATE Market: Market Share of Major Market Participants (World), 2004
- Total Printed Circuit Board ATE Markets: Percent of Revenues by Geographic Region (World), 2001-2011
- Total Printed Circuit Board ATE Markets: Revenue Forecasts (North America), 2001-2011
- Total Printed Circuit Board ATE Markets: Revenue Forecasts (Europe), 2001-2011
- Total Printed Circuit Board ATE Markets: Revenue Forecasts (Asia Pacific), 2001-2011
- Total Printed Circuit Board ATE Markets: Revenue Forecasts (Rest-of-World), 2001-2011
Chapter 3
- In-circuit ATE Market: Market Drivers Ranked in Order of Impact (World), 2005-2011
- In-circuit ATE Market: Market Restraints Ranked in Order of Impact (World), 2005-2011
- In-circuit ATE Market: Revenue Forecasts (World), 2001-2011
- In-circuit ATE Market: Competitive Structure (World), 2004
- In-circuit ATE Market: Market Share Trends of Major Market Participants (World), 2004
Chapter 4
- Functional ATE Market: Market Drivers Ranked in Order of Impact (World), 2005-2011
- Functional ATE Market: Market Restraints Ranked in Order of Impact (World), 2005-2011
- Functional ATE Market: Revenue Forecasts (World), 2001-2011
- Functional ATE Market: Competitive Structure (World), 2004
- Functional ATE Market: Market Share Trends of Major Market Participants (World), 2004
Chapter 5
- Boundary Scan ATE Market: Market Drivers Ranked in Order of Impact (World), 2005-2011
- Boundary Scan ATE Market: Market Restraints Ranked in Order of Impact (World), 2005-2011
- Boundary Scan ATE Market: Revenue Forecasts (World), 2001-2011
- Boundary Scan ATE Market: Competitive Structure (World), 2004
- Boundary Scan ATE Market: Market Share Trends of Major Market Participants (World), 2004
Chapter 6
- Manufacturing Defect Analyzers ATE Market: Market Drivers Ranked in Order of Impact (World), 2005-2011
- Manufacturing Defect Analyzers ATE Market: Market Restraints Ranked in Order of Impact (World), 2005-2011
- Manufacturing Defect Analyzers ATE Market: Revenue Forecasts (World), 2001-2011
- Manufacturing Defect Analyzers ATE Market: Competitive Structure (World), 2004
- Manufacturing Defect Analyzer ATE Market: Market Share Trends of Major Market Participants (World), 2004
AbstractShift in Fault Spectrum in PCBs Propels Demand for ATE the World Over Globally, the last five years witnessed a dramatic change in the types of faults found in digital integrated circuits (ICs) and printed circuit boards (PCBs). With the overall defect rate of parts reducing, and a concurrent improvement in component quality (especially for digital ICs), the traditional bed-of-nails fixtures are proving ineffective in defect correction. These ‘bug iron’ or ‘traditional’ in-circuit testers have excess capabilities not called for in simple test jobs. In the whole process, while the tester’s usefulness in dealing with complex boards is not questioned, the hitches that conventional in-circuit test (ICT) systems are adept at correcting occur much less frequently. This restricts the tester’s effectiveness while the excess tester capability leads to higher costs. In these conditions, PCB automatic test equipment (ATE), with its enhanced performance is successfully catering to numerous applications, particularly industrial- and manufacturing-related ones. This Frost & Sullivan research service provides an overview of and an outlook for the global PCB ATE market. The study segments the markets into in-circuit testers, functional testers, combinational/boundary scan testers, and manufacturing defect analyzers. It provides detailed revenue forecasts and market share analysis, and is essential for both large and small market participants seeking maximum return on investments. Specific Demands of DoD Stimulate Development in ATE Technologies In general, the defense sector demands specifically made testers for PCBs. "The requirements are fast migrating toward modular instruments-on-a-card steadily and these devices are usually personal computer (PC)-controlled and use hardware formats and backplanes found commonly in commercial testing, "says the analyst of this research service. Crucially, military services are focusing on achieving a higher degree of standardization across all traditional boundaries in order to reduce costs and boost the efficiency of ATE. The ATE policy of the Department of Defense (DoD) continues to emphasize on inter-linked standards and the level of interoperability, a fact likely to drive the PCB ATE markets. Novel PCBs Necessitate Advanced ATE New electronic goods such as desktop PCs, notebooks, modules, camcorders, and cellular phones are set to become more complex, while they and their constituent components continue to shrink in size. These latest systems will incorporate advanced packaging technologies, and will subsequently demand interconnect tools. End users thus, seek test equipment that would efficiently examine these complex miniature boards. "Automatic optical inspection (AOI) and X-ray check ups are finding wide acceptance due to limited board access," states the analyst. "While these options are likely to gain popularity in the future, their inherent test limitations would prevent them from becoming a dominant testing solution." With the competition in the testers market being fierce, companies are forced to survive in a low-profit margin set-up, where high price cuts are not an ideal solution. Inflation and other economic pressures will be instrumental in bringing about improvements and rationalization in the whole PCB testing industry.
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