World Advanced Printed Circuit Board Markets

Published by: Frost & Sullivan

Published: Aug. 13, 2004

Table of Contents

Abstract

Revival in Data and Voice Communications Drives Revenue Growth

The revival of data and voice communications signals exciting new opportunities for printed circuit boards (PCBs) in third-generation mobile phones and personal consumer electronics. This, coupled with the growth in the telecommunications and computing industry, is likely to stimulate demand for backplanes across various applications such as telecommunications and networking infrastructure and testing equipment boards. Since backplanes are priced relatively higher, and are more technologically advanced than other high-density boards, their growing demand is likely to boost revenues in the multi-layer PCB segment. Increased usage of backplanes is also expected to raise the layer count in electronic devices and drive growth in the flexible PCB market. PCB manufacturers must not discount the importance of emerging technologies such as micro-electromechanical systems, nanotechnologies, and smart cards having the potential to significantly raise their market share.

This Frost & Sullivan research analyzes key industry drivers and challenges in the world printed circuit boards market. It also provides revenue growth analysis for various segments such as rigid and flexible backplanes, single-sided, double-sided, and multi-layered PCBs. An overview of trends in various vertical markets and a demand analysis allow participants to explore emerging opportunities in this market.

Rise in Laminate Prices Increases Revenue for PCB Manufacturers

The improved laminate capabilities in terms of better thermal and stress resistance are expected to increase the raw material prices. PCB manufacturers must cash in on this trend by commanding a higher price for their products to boost revenue growth. "Price pressures experienced during the economic downturn are expected to ease, resulting in a gradual increase in the per layer price of the PCB," explains the analyst. PCB manufacturers can also explore new market opportunities with the entry of lead-free and halogen-free compatible laminates.

Innovation in High-Density Interconnect Market to Create New Opportunities

Advances in the high-density interconnect (HDI) market such as sequential build-up, deep microvia and stacked microvia technologies allow PCB manufacturers to derive numerous benefits. "Sequential build-up and deep microvia, when coupled with shrinking component sizes and increasing density, develop the capabilities to build higher layer counts without the use of backplanes," says the analyst. Increase in the layer count and inter-layer connectivity assist the new HDI technologies in gaining rapid acceptance in applications such as mobile phones, computing, and networking devices.

About MarketResearch.com
MarketResearch.com is an online aggregator selling over 160,000 market research reports, company profiles and country profiles from over 600 research firms. Our reports will provide you with the critical business and competitive intelligence you need for strategic planning and marketing research. Coverage includes the US, UK, Europe, Asia and global markets.