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Evolving High Speed Backpane, Mezzanine and Cable ConnectorsPublished by: Bishop & Associates Published: Jul. 1, 2004 - 220 Pages Table of Contents
AbstractThe key objectives of this report are to explore the critical issues associated with the development and successful implementation of multi-gigabit backplane, mezzanine and cable connectors.• How has the high-speed backplane, mezzanine, and cable connector landscape changed over the past two years? • What if any are the perceived limits of copper backplane interconnects? • What roles will evolving transceiver and signaling protocols play in achieving multi-gigabit performance? • What role will emerging industry standards organizations such as OIF, and UXPi play in influencing backplane, mezzanine, and cable connector selection in multi-gigabit systems? Will PICMG 3.0 drive multigigabit connectors into the mainstream? • What products or market segments are driving the need for higher backplane, mezzanine and cable interconnect speeds? • What is the timetable required for new high-speed connectors to meet volume production requirements? • What is the U.S. domestic, European, and Asian market value today and forecasts for multi-gigabit connectors 2003 through 2008? • Can 5-10 Gb/s performance be achieved in standard FR-4 board material or must higher grade / cost laminates be used? • What PCB design and fabrication process changes will be necessary in order to achieve multi-gigahertz performance? • What is the cost / reliability impact of these changes? • What high-speed backplane, mezzanine, and cable connectors are available now and what new products are expected in the relatively near future? What are the key characteristics of interfaces currently on the market? What are their pricing trends? • Are new interconnect technologies being developed that can improve high-speed connector performance? Would users consider them in next generation products? • What is the most accurate method of quantifying the performance of high-speed connectors? What new tools such as StatEye are entering the test and measurement arena? Is SPICE a reliable simulation tool in 5+ Gigabit systems? How is S parameter data being used to quantify channel performance? • What tools are suppliers providing users to verify high-speed performance and are they relevant to the needs of specific applications? • Can performance data from competitive connector suppliers be directly compared? • Are fiber optic backplane connectors, as they exist today, a viable alternative to copper interfaces? What is the status of FO backplane developments? • How important are mezzanine connectors and backplane cabling in multi-gigabit systems currently in design? What role will they play in next generation equipment? • What are the key design features that users will demand in next generation interconnect systems? In spite of the economic downdraft that prevailed in the electronics industry over the past three years, solid advances have been made in understanding, designing, measuring, and simulating multi-gigabit circuits. New innovative interconnects have been introduced, and design and measurement tools necessary to successfully implement multi-gigabit channels have pushed the current 3 Gb/s systems to the next plateau of 5+ Gb/s. New transceivers with advanced features are capable of compensating for losses and distortion extending the effective length of high-speed circuits. Innovative alternative solutions to the problems associated with the connector launch are changing the way connectors will be attached to the PCB. Users are reporting greater confidence in their ability to upgrade systems without stretching their economic and technology comfort zones. Our research on this report included: • Interviews with knowledgeable electronics industry personnel involved in the design and development of products that utilize high-speed connectors. • Interviews with representatives of applicable industry standards organizations. • Interviews with independent consultants in high-speed system design and simulation. • Collection and review of technical articles and advertising in industry trade publications. • Interviews with manufacturers of high-speed backplane and mezzanine and cable connectors. • Extensive Internet searches for related data. • Discussion with suppliers of active devices, advanced printed circuit board materials, and high speed simulation tools. • Utilization of the Bishop and Associates database of electronic connectors. Get Full Details About This Report >> |
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