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Published by: Freedonia Group Inc
Published: Nov. 1, 2004
Table of Contents
INTRODUCTION
I. EXECUTIVE SUMMARY
II. MARKET ENVIRONMENT
- General
- Macroeconomic Outlook
- Electronics Industry Outlook
- Electronic Components Outlook
- Semiconductors
- Passive Components
- Printed Wiring Boards
- Wafer Outlook
- Silicon Wafers
- Gallium Arsenide & Other Wafers
- Historical Market Trends
- Pricing Trends
- Environmental & Regulatory Issues
- International Activity & Foreign Trade
III. TECHNOLOGY
- General
- Polycrystalline Silicon Production
- Silicon Wafer Production
- Integrated Circuit Fabrication
- Discrete Device Formation
- Interconnect Layer Formation
- Printed Wiring Board Production
- Packaging & Assembly Overview
- Wire-Bond Technology
- Surface Mount Technology
- Chip-on-Board Technology
- Multichip Module Technology
- Chip Scale Packaging
- Ball Grid Arrays
- Flip Chip Technology
- Other Technology Developments
IV. PRODUCTS
- General
- Substrate & Packaging Polymers
- Thermosets
- Epoxy
- Polyimide
- Silicone
- Other Thermosets
- Thermoplastics
- Polysulfone & Polyethersulfone
- Liquid Crystal Polymer
- Nylon
- Polyphenylene Sulfide
- Other Thermoplastics
- Market Share & Producers
- Gases
- Bulk Gases
- Nitrogen
- Argon
- Hydrogen
- Oxygen
- Helium & Other
- Specialty Gases
- Etchant & Cleaning Gases
- Dopant Gases
- Silicon Precursor Gases
- Other Specialty Gases
- Market Share & Producers
- Photoresists & Adjuncts
- Photoresists
- Standard Photoresists
- Advanced Photoresists
- Photoresist Adjuncts
- Market Share & Producers
- Photoresists
- Photoresist Adjuncts
- Acids, Etchants & Solvents
- Hydrogen Peroxide
- Solvents
- Sulfuric Acid
- Hydrofluoric Acid
- Other
- Market Share & Producers
- Semiconducting Materials
- Polycrystalline Silicon
- Gallium Arsenide & Other
- Market Share & Producers
- CMP Slurries
- Plating Chemicals
- Copper
- Other
- Market Share & Producers
- Other
- Electronic Adhesives
- Low-k Dielectrics
- All Other
V. APPLICATIONS
- General
- Semiconductors
- Gases
- Photoresists & Adjuncts
- Semiconducting Substrate Materials
- Substrate & Packaging Polymers
- CMP Slurries
- Other
- Printed Wiring Boards
- Laminate Polymers
- Photoresists & Adjuncts
- Plating Chemicals
- Other
- Passive Components
VI. INDUSTRY STRUCTURE
- General
- Market Share
- Industry Restructuring
- Competitive Strategies
- Cooperative Agreements
- Marketing & Distribution
- Company Profiles
- Ablestik Laboratories, see Imperial Chemical Industries
- Acheson Colloids, see Imperial Chemical Industries
- Advanced Silicon Materials LLC, see Komatsu Limited
- AGA Gas Incorporated, see Linde AG
- Air Liquide America LP, see L’Air Liquide SA
- Air Products and Chemicals Incorporated
- Airgas Incorporated
- Albemarle Corporation
- Arch Chemicals Incorporated
- Ashland Incorporated
- ASM International NV
- Astaris LLC, see FMC Corporation
- Atotech USA Incorporated, see Total SA
- AZ Electronic Materials
- BASF AG
- Bayer AG
- BOC Group plc
- Cabot Microelectronics Corporation
- Celanese Corporation
- Cheil Industries Incorporated
- Chemetall GmbH, see Rockwood Specialties Group
- ChemFirst Incorporated, see DuPont (EI) de Nemours
- Ciba Specialty Chemicals Holding Incorporated
- Clariant International Limited
- Cookson Group plc
- Cyantek Corporation, see Rockwood Specialties Group
- Dow Chemical Company
- Dow Corning Corporation
- DuPont Air Products NanoMaterials, see Air Products and
- DuPont (EI) de Nemours
- DuPont Dow Elastomers, see Dow Chemical and DuPont
- DuPont (EI) de Nemours
- DuPont Teijin Films US Limited Partnership, see DuPont
- Eastman Chemical Company
- EKC Technology, see DuPont (EI) de Nemours
- Electrochemicals, see Rockwood Specialties Group
- Emerson & Cuming, see Imperial Chemical Industries
- EnCompass Materials Group, see Isonics
- Enthone Incorporated, see Cookson Group plc
- FMC Corporation
- FUJIFILM Arch Company Limited, see Arch Chemicals
- GE Silicones, see General Electric Company
- GEM Microelectronic Materials, see Honeywell
- General Chemical Corporation, see GenTek Incorporated
- General Electric Company
- GenTek Incorporated
- HC Starck GmbH, see Bayer AG
- Hemlock Semiconductor, see Dow Corning and Shin-Etsu
- Henkel KGaA
- Hitachi Chemical DuPont MicroSystems, see DuPont and
- Hitachi Limited
- Hitachi Limited
- Holox Limited, see Linde AG
- Honeywell International Incorporated
- Huntsman LLC
- Imperial Chemical Industries plc
- Isonics Corporation
- JSR Corporation
- JT Baker, see Tyco International Limited
- Kanto Kagaku
- Komatsu Limited
- L’Air Liquide SA
- Lanxess, see Bayer AG
- Linde AG
- MacDermid Incorporated
- Mallinckrodt Baker Incorporated, see Tyco International
- Martinswerk GmbH, see Albemarle Corporation
- Matheson Tri-Gas, see Taiyo Nippon Sanso
- MEMC Electronic Materials Incorporated
- Merck KGaA
- Mitsubishi Chemical Corporation
- Mitsui Chemicals Incorporated
- National Starch and Chemical Company, see Imperial Chemical
- Industries plc
- Nippon Sanso, see Taiyo Nippon Sanso Corporation
- OSi Specialties, see General Electric Company
- Planar Solutions, see Arch Chemicals and Wacker-Chemie
- Polyclad Laminates Incorporated, see Cookson Group plc
- Praxair Incorporated
- Resolution Performance Products LLC
- Rhodia SA
- Rockwood Specialties Group Incorporated
- Rodel Incorporated, see Rohm and Haas Company
- Rohm and Haas Company
- SACHEM Incorporated
- Shin-Etsu Chemical Company Limited
- Shipley Company LLC, see Rohm and Haas Company
- Siltronic AG, see Wacker-Chemie GmbH
- Solvay SA
- Sumitomo Chemical Company Limited
- Taiyo Nippon Sanso Corporation
- 3M Company
- Total SA
- Tra-Con Incorporated, see Imperial Chemical Industries
- Tyco International Limited
- Wacker-Chemie GmbH
- Other Companies Mentioned in Study
AbstractUS market value
to grow 11% per
year through 2008
Demand for electronic
chemicals in the US is
projected to increase 11
percent per year to over $6
billion in 2008, led by
extraordinary growth in lowk
dielectric materials, as
well as healthy growth in
higher-value, high-performance
products such as
chemical mechanical
planarization (CMP)
slurries, thermoplastic
packaging materials, and
advanced photoresists.
These chemicals will
principally be involved in
aiding the technological
advances that facilitate
ever greater circuit densities
and smaller, lighter,
more powerful devices.
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