MEMS : MEMS Packaging


April 3, 2012
296 Pages - SKU: YOLD3918456
License type:
Table of Contents Related Reports
The MEMS packaging, assembly, test & calibration market will reach $2.3B value by 2016, growing three times faster than the overall IC packaging industry.

MEMS PACKAGING MARKET IS GROWING FASTER THAN IC PACKAGING MARKET

In package unit shipments, the MEMS packaging market is growing 2x faster (~ 20% CAGR) than what is predicted for the overall IC package market. WLP / TSV platform is set to grow the fastest while leadframe and organic laminate based packages are poised to grow a comfortable 16% CAGR over the next 5 years to come.

There are plenty of MEMS and sensors to be found in recent smartphone designs: MEMS accelerometers, gyroscopes, pressure sensors, electronic compass magnetometers, multiple silicon MEMS microphones, FBAR / BAW filters & duplexers, RF switches and MEMS oscillators: there is no doubt that MEMS content is growing faster than standard IC content.

CHANGING THE PARADIGM

In terms of how the packaging is involved, it’s all about orchestrating the assembly of MEMS sensor and their related ASIC inside a module. But this is costly: packaging, assembly, test and calibration steps account for nearly 35% to 60% of a total MEMS packaged module’s cost.

MEMS types of packaging are more complex than most standard IC packages because they require “System-in-Package” type of assembly. Additionally, most MEMS packages are connecting sensors to their final environment, bringing very specific constraints at the module level such as building a cavity, a hole in the substrate or metal lead for pressure sensor and microphones, an optical window for optical MEMS, a full vacuum hermeticity at the die level.

The application scope of MEMS is broad and very diversified. Since its early beginnings, the MEMS industry faced the issue of being a highly fragmented market, with NO manufacturing standards clearly emerging Packaging always needed to cope with the very specific end-applications requirements of MEMS modules

However, the MEMS law “One MEMS = 1 Device with 1 Process with 1 Package” is now changing as several packaging platform standards are now clearly emerging (such as WLP & TSV interconnects, SiP module assembly based on molded or cavity packaging for e.g.)

This report is featuring a full analysis of packaging, assembly & test requirements application by application as well as a dedicated focus on MEMS package substrates such as ceramic, leadframe and organic laminates.


Additional Information

KEY FEATURES OF THE REPORT
    To provide market data on key MEMS packaging industry market metrics & dynamics

  • Focus on key MEMS applications (including Silicon microphones, gyroscopes, accelerometers, magnetometers, fusion sensor combo units & IMU, pressure sensors, TPMS modules, micro-mirrors, micro-bolometers, oscillators & resonators, switches, FBAR/BAW filters, SAW filters, ink-jet MEMS modules, microfluidic & Biochips, micro-displays, micro-actuator auto-focus, etc…)
  • MEMS package and substrate unit shipments and revenues application by application
  • Market shares for key MEMS player with detailed breakdown inside each MEMS applicative segment


    • To provide technical insight about key MEMS packaging technology trends & challenges

  • From MEMS-ASIC integration trends (SiP module versus SOC) to interconnect trends (wire-bond versus flip-chip versus WLP / TSV) to substrate approach (ceramic, leadframe, organic laminate, silicon/glass interposers)
  • Teardowns module analysis and reverse costing analysis of the main key MEMS package modules design wins from top tiers player leaders in their respective applicative market space
  • Specific requirements in each MEMS packaging applications along with packaging technologies roadmaps
  • Focus on final test and calibration trends which represent more than 20-30% of the total MEMS modules value


    • To provide a deep understanding of the MEMS packaging value chain, infrastructure & players

  • Who are the key players (IDMs, fab-less, wafer foundries, packaging & test subcontractors) involved in the MEMS packaging business and how are they related?
  • Where is the value in the MEMS packaging, assembly, test & calibration area depending on each application? How this value is shared among the different business models in this space and how does this value flows?
COMPANIES CITED IN THIS REPORT

AAC Acoustic Technologies, Aichi MI, AKM, Akustica, Amkor, Analog Devices, ASE, Avago Technologies, bTendo, Bosch, Carsem, Canon, China WLCSP, Colibrys, DALSA / Teledyne, DelfMEMS, Denso, Discera, DRS, Epcos – TDK, EPWorks, FLIR Systems, Freescale, Fujifilm Dimatix, Fujikura, GE Sensing, Goodrich-AIS, Hana Microelectronics, Honeywell, Hosiden, HP, Infineon, Invensense, Ion Torrent, JCAP, J-Devices, Kionix, Knowles Electronics, KYEC, Kyocera, Lemoptix, Lexmark, Lingsen, MEM Hitech, Melexis, MEMJET, MEMSiC, Microvision, Miradin, Murata, NEC / Schott, Oak-Mitsui, NXP Semiconductor, Olympus, Omron, Panasonic, PlanOptik, PoLight, Pyreos, Qualcomm MEMS Technologies, Raytheon, Rohm, Rood Microtec, Sand9, Sencio, Seiko-Epson, Sensata, Sensonor, Sensor Dynamics, Shinko, SiTime, Silex Microsystems, Silicon Sensing Systems, Sony, SPIL, StatsChipPAC, STMicroelectronics, Systron Donner Inertial, Taiyo-Yuden, Tecnisco, Teramikros, Texas Instruments, Tong Hsing Electronics, Triquint Semiconductor, Tronics Microsytems, TSMC, ULIS, Unimicron, Unisem, UTAC, VTI Technologies, WiSOL, Wispry, X-Fab, Xintec, Yamaha…

WHO SHOULD BUY THE REPORT?
  • Assembly & test service packaging subcontractors (OSATs)
  • Understand the MEMS packaging industry market dynamics and its key future applications
  • Get the list of today’s and tomorrow key MEMS players to drive your business
  • Understand the key MEMS modules cost structures through explicit teardown analysis
  • Plan ahead for needed investments capacity related to this field
  • MEMS IDM’s (Integrated Device Manufacturers) and fabless companies
  • Get the list of the top assembly, packaging & test packaging subcontractors active in the MEMS packaging business
  • Benchmark competition activity and choose the right package and partner for your future MEMS module applications
  • Substrate suppliers
  • Understand the differentiated value of your products and technologies in the MEMS market
  • Evaluate your related TAM ‘Total Accessible Market’ in this market
  • Get the list of today’s and tomorrow key MEMS players to drive your business
  • MEMS and CMOS wafer foundries
  • Spot new opportunities and define diversification strategies, especially related to the MEMS Wafer-Level-Packaging opportunity (with wafer bonding, TSV, RDL and bumping features)
  • Electronic module makers and OEMs
  • Evaluate the benefits of using these new technologies in your end system
  • Monitor new application and package trends

 
Research assistance
We can help you find what you need. Call us or write us:
US: 800.298.5699
Int'l: +1.240.747.3093
Need help in your search?
 
Related Markets

Packaging Reports
 
 

Share this report


Other tasks

 
 
Join Alert Me now!
Receive bi-weekly email alerts on new market research

Sign up today!