Equipment & Materials for 3DIC and Wafer-Level-PackagingYole DeveloppementJune 1, 2011 SKU: YOLD6655565 |
THE BULDING FLAVORS OF THE "MID-END" Wafer-level-packages have emerged as the fastest growing semiconductor packaging technology with more than 27% CAGR in unit shipments over the next 5 years to come. Rather than a single solution, wafer-level-packaging technologies are an array of solutions: historically supported by the market growth in flip-chip wafer bumping with electroplated gold, solder bumps and today copper pillars, wafer-level-packages are actually coming in many different flavors, namely Fan-in WLCSP packages, 3D WLP, FO WLP packages, 2.5D Glass / Silicon interposers and of course 3DIC integration with TSV interconnects. As this wafer-level-packaging industry develops over time, we are observing that a real infrastructure has emerged by itself into what is now being called the "Mid-end" of the semiconductor manufacturing environment. Indeed, wafer-level-packages are true "Mid-end" technologies in the sense that they can all be served in the 'blur zone' of overlap between the IDMs or CMOS foundries' back-end-of-line (BEOL) wafer fabs and the back-end wafer bumping assembly facilities of the OSATs and wafer bumping houses. DETAILED 3DIC & WLP PROCESS FLOWS ANALYSIS It's worth noting that there's a significant difference in how manufacturing is generally performed in the front-end versus in the back-end worlds. The back-end has generally a much greater cost sensitivity but can face scaling issues with time when semiconductor ICs continue to reduce in chip size while increasing in pin-count number. On the other hand, front-end related technologies are more expensive initially but could be preferable because of higher repeatability, yield, throughput and because of better perspectives in the long run when it comes to be able to scale down the technology to smaller pitch dimension while maintaining cost pressure. For the first time, Yole's analysts have been able to gather all the information necessary to benchmark and compare all the different alternatives offered by the present equipment and material tool-box for wafer-level-packaging. All main scenarios are analyzed, including flip-chip wafer bumping trends, Fan-in WLCSP, 3D WLP, FOWLP, 2.5D silicon interposers, 3DIC Via Middle & Via Last process scenarios. The analysis also include an specific chapter on future trends for PANEL scale packaging such as Embedded die in PCB, FOWLP 2nd generation and poly-silicon or glass sheet interposers based on LCD / PCB / Solar infrastructures. MARKET FORECASTS FOR 3DIC / WLP EQUIPMENT & MATERIALS The wafer-level-packaging market shows the greatest potential for significant future growth in the semiconductor industry. It's a huge business opportunity, especially with the 3DIC technology which is fundamentally changing how processing is done and offers the opportunity for new equipment modifications and new materials development. We expect the equipment & material market for wafer-level-packaging to grow significantly in total revenue over the next five years with a CAGR over 60%. The growth will be mainly driven by the expansion of flip-chip, WLCSP and FOWLP technologies into the wireless mobile industry along with the emergence of 3DIC technology into 3D TSV stacked memories, wide I/O interfaces in logic and memory ICs as well as in CMOS image sensors, MEMS and other heterogeneous 3D stacking applications. Our analysis quantifies the wafer-level-packaging equipment market evolution for wafer bonders / die pick & place bonders / C2W Bonders / DRIE etching & drilling tools / CVD / PVD / Plating / Exposure & Lithography / Spray coating / Temporary Bonding & De-Bonding / Grinding-Thinning-CMP / Wafer-molding / Inspection & Metrology / Test tools. On the material side, we are quantifying the complete wafer-level-packaging materials market evolution for photoresist & coatings / adhesive tapes / pre-applied & wafer-level underfills / molding compounds / thermal interface materials (TIM) / plating, etching & cleaning chemistries / slurries for CMP / temporary bonding materials / gas & precursors / sputtering targets / silicon & glass wafer carriers, cap , 2.5D interposer and TGV substrates. DATABASE with 350+ key equipment & material suppliers for 3DIC / WLP We can already feel that some consolidation is ahead in the semiconductor equipment and material market. Indeed, because only three players will possibly drive further the 18/14 nm tool market, front-end equipment companies are already anticipating that we are rapidly approaching the end of an era. One of the first moves was Applied Materials' acquisition of Semitool last year, enabling the company to expand and sustain in this back-end / WLP direction. Along with this new research report, Yole will be delivering a 350+ players excel database screening and profiling the detailed activity of small to medium to giant equipment & material suppliers coming either from Front-end, Back-end assembly, PCB, LCD or Solar industries and providing actual solutions for the 3DIC & wafer-level-packaging tool-box. KEY FEATURES OF THE REPORT
Equipment & Material suppliers
Monitor the global activity and consolidation currently happing in the semiconductor equipment & material business in order to identify new partners, targets and take the right decision before committing to one particular supplier IDMs, CMOS foundries & OSAT players
Please note: this is delivered as a PowerPoint presentation. |
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