Smart Houses: ICT Markets and Technologies Development
Practel, Inc.
July 1, 2011 SKU: PT6463150
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This report continues the Practel project on the Smart Grid development and evolution. In particular, it is detailing characteristics and applications for wired and wireless ICT in the Smart Houses environments.
The report addresses the development of wireline and wireless Information and Communications Technologies (ICT) to support the Smart House infrastructure. With each year, Smart Houses communications technologies are becoming more and more affordable and efficient on the industry-wide scale for multiple applications; though the concept was originated in the 80th of the last Century. The importance of Smart Houses proliferation is now tied with the Smart Grid deployments, and Smart Houses communications networks will eventually be a part of a large country-wide project, such as centralized and intelligent automation system, which integrates utilities and consumers.
The report updates the analysis of wireless ICT (Z-wave and ZigBee/IEEE802.15.4) and wireline technologies (HomePlug, HomePNA, G.hn, MOCA); and respective markets. The emphasis is made on mesh networking and the IP environment that only recently became available for home-based communications nodes. Wireline technologies are using the existing Smart Home wiring, while wireless technologies support connectivity between various home network nodes by implementing the necessary wireless networking.
The report also addresses the Smart appliances initiatives, related technologies and markets; as well as the role of smart meters in the evolving smart houses development; HANs and Smart Houses features and market characteristics are also summarized.
The U.S. market for ICT in Smart Houses (with a base of private houses reaching more than 100 million) is huge; it also is supported by the government, which is deeply involved in the Smart Grid project.
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- 1.0 Introduction
- 1.1 General
- 1.2 Scope
- 1.3 Research Methodology
- 1.4 Target Audience
- 2.0 General: Smart Houses
- 2.1 Levels
- 2.2 Components
- 2.3 Benefits
- 3.0 HomePlug: SH
- 3.1 General
- 3.2 HomePlug Alliance
- 3.2.1 ZigBee/HomePlug Smart Energy
- 3.3 Benefits
- 3.4 Details
- 3.5 HomePlug 1.0
- 3.6 HomePlug AV
- 3.7 HomePlug GP
- 3.8 HomePlug Command and Control
- 3.9 Standard Organizations Work
- 3.9.1 IEEE
- 3.9.2 TIA
- 3.9.3 ETSI
- 3.10 HomePlug - SH Market Segment
- 3.11 Vendors - SH PLC
- ActionTec
- Ariane
- Atheros - Qualcomm Atheros
- Arkados
- Asoka
- Bewan
- Corinex
- CopperGate
- Devolo AG
- DS2 (Marvell Acquired DS2 Technology in 2010)
- GigaFast
- Gigle Networks (Acquired by Broadcom in 2010)
- Insteon
- IOGear
- NEC - Renesas Electronics
- Netgear
- Siemens
- Spidcom
- ST&T
- Watteco
- Yitran
- Zyxel
- 4.0 ITU G.hn - HomePNA
- 4.1 HomePNA Alliance
- 4.1.1 General
- 4.1.2 HomePNA Specifications: Major Features
- 4.2 ITU
- 4.2.1 General
- 4.2.2 HomeGrid Forum
- 4.2.3 Mixed Reaction
- 4.2.4 G.hn Details
- 4.2.5 Acceptance
- 4.2.6 HomePNA-G.hn
- 4.2.7 Samples of Vendors
- CopperGate (Sigma Designs)
- NetSys
- 4.3 Directions: IEEE P1905
- 5.0 MOCA
- 5.1 General
- 5.2 Partnerships
- 5.3 Details
- 5.3.1 MOCA 2.0
- 5.3.1.1 MOCA 2.0 Technical Highlights
- 5.4 Samples of Vendors
- Actioncable
- Broadcom
- CommScope
- Entropic
- Netgear
- 6.0 Smart House: Wireless Communications
- 6.1 Z-Wave
- 6.1.2 Z-Wave Alliance
- 6.1.3 Benefits
- 6.1.4 Details
- 6.1.4.1 General
- 6.1.4.2 Characteristics
- 6.1.4.3 ZigBee and Z-Wave
- 6.1.5 Advanced Energy Control Framework
- 6.1.5.1 Z-wave and Smart Metering
- 6.1.6 Selected Vendors
- Aeon Labs
- Mi Casa Verde
- Sigma Designs
- There
- 6.1.7 Pricing
- 6.1.8 Market Estimate: Z-wave Products for Smart Houses
- 6.1.8.1 Model
- 6.1.8.2 Results
- 6.2 ZigBee
- 6.2.1 General
- 6.2.2 Details
- 6.2.2.1 Major Features
- 6.2.2.2 Device Types
- 6.2.3 Protocol Stack
- 6.2.3.1 Physical and MAC layers - IEEE802.15.4
- 6.2.3.2 Frame
- 6.2.3.3 Upper Layers
- 6.2.4 Interoperability
- 6.2.5 Security
- 6.2.6 Platform Considerations
- 6.2.6.1 Battery Life
- 6.2.6.2 ZigBee Technology Benefits and Limitations
- 6.2.7 Standardization Process
- 6.2.7.1 ZigBee Alliance
- 6.2.7.1.1 Objectives
- 6.2.8 Example: Smart Energy Profile
- 6.2.8.1 Features
- 6.2.8.2 Smart Energy Profile v.2.0
- 6.2.9 ZigBee IP
- 6.2.10 802.15.4 - ZigBee Basis
- 6.2.10.1 IEEE 802.15.4 Radio
- 6.2.11 Application Specifics - Profiles Examples
- 6.2.12 Applications
- 6.2.12.1 General
- 6.2.12.2 Home-SH
- 6.2.12.3 PC
- 6.2.12.4 Manufacturing
- 6.2.12.5 WSN and ZigBee
- 6.2.12.6 ZigBee Role
- 6.2.12.7 “Green” ZigBee
- 6.2.12.8 ZigBee Telecom Services
- 6.2.13 Market
- 6.2.13.1 Expectations
- 6.2.13.2 Segments
- 6.2.13.3 Forecast
- 6.2.14 Industry
- Amber (RF Modules)
- Arch Rock (IP) - Acquired by Cisco in 2010
- Atmel (Chipsets)
- CEL (Modules)
- Cirronet-RFM (Modules-Industrial Applications)
- Digi (Radios, Routers, Energy Management)
- Duolog (Transceivers)
- Ember (Chipsets; SH)
- EnergyHub (Smart Home)
- GreenPeak (WSN)
- Helicomm (Modules)
- Jennic (Chipsets-Modules)
- Freescale (Chipsets)
- Nuri Telecom (AMR Application)
- Oki (Chipsets)
- Open Peak (Power Management)
- Renesas (Platforms, AMR)
- Silicon Laboratories (Chipsets, Modules)
- Synapse (Module, Protocols)
- Telegesis (Integrator, Modules)
- TI (Chipsets)
- 7.0 Home Area Networks
- 7.1 General - Advantages
- 7.2 Choices
- 7.2.1 Specification
- 7.3 Technologies
- 7.3.1 IETF and IP/WSN
- 7.3.2 Major Projects
- 7.3.3 6LoWPAN WG
- 7.3.4 6LoWPAN Development
- 7.3.4.1 Industry Support
- 7.3.4.2 NanoStack
- 7.3.4.3 Details
- 7.3.4.4 U-SNAP
- 7.3.5 Example - HAN
- 7.3.6 ROLL WG
- 7.3.6.1 General
- 7.3.6.2 Scope
- 7.3.7 Major Characteristics of IP-WSN
- 7.3.8 IPSO Alliance (IP for Smart Objects)
- 7.3.9 Major Players: Samples
- Control4
- Insteon
- Jennic (NXP Semiconductors acquired this company in 2010)
- Radiocrafts-Sensinode
- Sigma Designs
- SyChip..
- 7.4 HAN Market
- 7.4.1 Drivers
- 7.4.2 Nodes
- 7.4.3 Geography
- 7.4.4 Technologies
- 7.4.5 Market Size
- 8.0 Smart Appliances
- 8.1 Technologies
- 8.1.1 LG Thinq
- 8.1.1.1 Details
- 8.1.1.2 Plans
- 8.1.2 Whirlpool
- 8.1.3 GE - 'Nucleus energy manager' and Other
- 8.1.3.1 ZigBee Certified
- 8.1.3.2 Nucleus Energy Manager
- 8.1.3.3 Brillion
- 8.2 New Standards
- 8.3 Market
- 9.0 Smart Meters
- 9.1 Progress
- 9.2 Characteristics
- 9.2.1 Standards Development
- 9.2.1.1 SMMAA
- 9.3 Vendors Samples
- Echelon
- Itron
- SmartSynch
- 9.4 Market Characteristics
- 10.0 Conclusions
- Figures
- Figure 1: HomePlug C&C
- Figure 2: TAM: HomePlug-Equipped Products Shipped (Mil. Units)
- Figure 3: TAM: HomePlug-Equipped Products Shipped ($B)
- Figure 4: TAM Estimate: U.S. Small SH Z-Wave IC ($US Mil)
- Figure 5: TAM Estimate: U.S. Large SH Z-Wave IC ($US Mil)
- Figure 6: ZigBee Protocol Stack
- Figure 7: Profiles
- Figure 8: TAM: U.S. ZigBee Modules Sales ($B)
- Figure 9: TAM: U.S. ZigBee Modules Sales (M Units)
- Figure 10: ZigBee Market Segmentation (2011)
- Figure 11: ZigBee Market Segmentation (2016)
- Figure 12: Dynamic of HAN Size Growth as Percentage of Total Deployed
- Figure 13: HAN Market Geography (Percentage from total market)
- Figure 14: HAN Technologies Shares (As a percentage of total Market)
- Figure 15: U.S. Addressable HAN Market - Equipment Sales (Million Units)
- Figure 16: U.S. HAN Addressable Market ($B)
- Figure 17: TAM: Global Large Household Appliances ($B)
- Figure 18: TAM: Global Large Household Smart Appliances ($B)
- Figure 19: Smart Meters Development Stages
- Figure 20: TAM: Global Smart Meter Shipping ($B)
- Figure 21: TAM: Global Smart Meter Shipping (Mil. Unis)
- Tables
- Table 1: HomePlug Major Milestones
- Table 2: HomePlug AV Characteristics
- Table 3: HomePlug GP Features
- Table 4: HomePlug GP - PHY Data
- Table 5: HomePlug C&C Characteristics
- Table 6: ITU and HomePNA
- Table 7: Z-Wave and ZigBee
- Table 8: Z-wave Products Retail Pricing
- Table 9: ZigBee Parameters
- Table 10: ZigBee Smart Energy Profile Feature Set
- Table 11: HAN IP-based (Percentage of total networks)
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