“Progress in Short-range Wireless Communications Developments”Practel, Inc.January 1, 2013 SKU: PT4940203 |
- 1.0 Introduction
- 1.1 General
- 1.2 NFC Specifics
- 1.3 TransferJet
- 1.4 Short-range Radio Specifics
- 1.5 Report Structure
- 1.6 Methodology
- 1.7 Intended Audience
- 2.0 Short-reach Radio: Technologies and Markets
- 2.1 Ultra Wideband
- 2.1.1 Downturn
- 2.1.2 General: History
- 2.1.3 Benefits
- 2.1.4 Definition
- 2.1.5 Rates
- 2.1.6 Spectrum Allocation
- 2.1.7 Regulations
- 2.1.8 Major Features
- 2.1.9 Standards
- 2.1.9.1 Multiband OFDM
- 2.1.9.2 DS-UWB
- 2.1.9.3 Groups
- 2.1.9.4 ECMA
- 2.1.9.4.1 PHY
- 2.1.9.5 WiNET
- 2.1.9.6 EC-ETSI
- 2.1.9.7 IEEE 802.15.4a - 2007
- 2.1.9.8 IEEE 802.15.4f
- 2.1.10 Major Applications
- 2.1.10.1 Example: Characteristics and Requirements: WSN-UWB
- 2.1.11 Market Estimate
- 2.1.11.1 General
- 2.1.11.2 Geographical Segmentation
- 2.1.11.3 Forecast
- 2.1.12 Industry
- Alereon (chipsets)
- Camero (radar, equipment for first responders)
- Decawave
- Gefen (HDMI Extender)
- General Atomics (Chipsets)
- Gemtek
- Multispectral (Zebra)-Sensors
- Pulse~ Link (Chipsets)
- RealTek (IC)
- Samsung (WUSB)
- Sensiotec (Sensor/Radar Health Care)
- Time Domain (Chipsets-fusion of communications & radar)
- TiaLinx (Sensor)
- Ubisense (RFID-tracking)
- Veebeam (Device)
- Wisair (WUSB-chipsets)
- 2.2 Z-Wave
- 2.2.1 General
- 2.2.2 Z-Wave Alliance
- 2.2.3 Benefits
- 2.2.4 Details
- 2.2.4.1 General
- 2.2.4.2 Characteristics
- 2.2.4.2.1 ITU G.9959 (2/2012)
- 2.2.5 ZigBee and Z-Wave
- 2.2.6. Advanced Energy Control Framework
- 2.2.6.1 Z-wave and Smart Metering
- 2.2.7 Summary
- 2.2.8 Selected Vendors
- Aeon Labs (Aeotec)
- Mi Casa Verde
- Sigma Designs
- There
- 2.2.9 Pricing
- 2.2.10 Market Estimate: Z-wave Products for HAN
- 2.2.10.1 Model
- 2.2.10.2 Results
- 2.3 ZigBee
- 2.3.1 General
- 2.3.2 Details
- 2.3.2.1 Major Features
- 2.3.3 Device Types
- 2.3.4 Protocol Stack
- 2.3.4.1 Physical and MAC layers – IEEE802.15.4
- 2.3.4.2 Frame
- 2.3.4.3 Upper Layers
- 2.3.5 Interoperability
- 2.3.6 Security
- 2.3.7 Platform Considerations
- 2.3.8 Battery Life
- 2.3.9 ZigBee Technology Benefits and Limitations
- 2.3.10 Standardization Process
- 2.3.10.1 ZigBee Alliance
- 2.3.10.2 Objectives
- 2.3.10.3 Smart Energy Profile-ICT for Smart Grid
- 2.3.10.3.1 Further Developments
- 2.3.10.4 Features-Energy Service Portal
- 2.3.10.5 ZigBee IP
- 2.3.11 802.15.4 - ZigBee Basis
- 2.3.11.1 IEEE 802.15.4 Radio - Details
- 2.3.12 Application Specifics - Profiles
- 2.3.12.1 Applications - General
- 2.3.12.2 Home
- 2.3.12.3 PC
- 2.3.12.4 Manufacturing
- 2.3.12.5 WSN-UGS and ZigBee
- 2.3.12.6 “Green” ZigBee
- 2.3.13 Market
- 2.3.13.1 Expectations
- 2.3.13.2 Segments
- 2.3.13.3 Forecast
- 2.3.14 Industry
- Amber (RF Modules)
- Atmel (Chipsets)
- CEL (Modules)
- Chipcon –TI (Chipsets)
- Cirronet-RFM (Modules-Industrial Applications)
- Digi (Radios, Routers, Energy Management)
- Ember - Silicon Labs (Chipsets)
- EnergyHub (Smart Home)
- GreenPeak (WSN)
- Helicomm (Modules)
- Jennic - NXP (Chipsets-Modules)
- Freescale (Chipsets)
- Libelium (Router)
- Nuri Telecom (AMR Application)
- Renesas Electronics (Platforms, AMR)
- Silicon Laboratories (Chipsets, Modules)
- Synapse (Modules, Protocols)
- Telegesis (Integrator, Modules)
- TI (Chipsets)
- 2.4 IEEE 802.15.1 (Bluetooth-BT)
- 2.4.1 BT Protocol Stack
- 2.4.1.1 Transport layer
- 2.4.1.1.1 Radio Layer
- 2.4.1.1.2 Baseband and Link Manager Layers
- 2.4.1.2 Middleware Layer
- 2.4.2 Profiles
- 2.4.2.1 Power Consumption - ULP
- 2.4.2.2 Medical Profile
- 2.4.3 Bluetooth Security
- 2.4.4 Highlights
- 2.4.4.1 The Standard:
- 2.4.4.2 The Technology:
- 2.4.5 Evolution
- 2.4.5.1 BT v2.1
- 2.4.5.2 BT v3.0
- 2.4.5.3 BT v4.0 and Up
- 2.4.6 Market Estimate
- 2.4.7 BT Industry-HDP
- Bluegiga
- Cambridge Consultants
- CSR
- iFoundry-Nestronics
- Laird Technologies
- Nonin
- Nordic Semiconductor
- Stollmann
- 2.5 IEEE 802.11n WLAN
- 2.5.1 Major Enhancements
- 2.5.1.1 General
- 2.5.1.2 MIMO
- 2.5.1.2.1 “True MIMO”
- 2.5.1.2.2 BeamFlex
- 2.5.1.2.3 Atheros
- 2.5.1.3 Spatial Division Multiplexing
- 2.5.1.4 OFDM
- 2.5.1.5 Channel Bonding
- 2.5.1.6 Packet Aggregation
- 2.5.2 Features
- 2.5.2.1 Specifics
- 2.5.2.2 Channel Bandwidth
- 2.5.3 Adaptation
- 2.5.4 Benefits and Applications
- 2.5.4.1 Benefits
- 2.5.4.2 Applications
- 2.5.5 Market
- 2.5.5.1 General Drivers
- 2.5.5.2 Market Forecast
- 2.5.5.2.1 Model Assumptions
- 2.5.5.2.2 Forecast
- 2.5.5.2.2.1 Chipsets
- 2.5.6 Industry
- Aerohive (AP)
- Aruba (AP)
- Buffalo (Router, AP)
- Belkin (Router, Adaptor)
- Broadcom (Chipsets; combo)
- Cisco (AP)
- CSR (Chips)
- D-Link (Router, Adapter)
- Encore (Adapter, router)
- Edimax (Router, Adapter)
- Extreme (AP)
- Extricom (AP)
- Gemtek (Router)
- HP (AP)
- Intel (Chipsets)
- Marvell (Chipsets)
- Meru (Family of Products)
- Motorola (Tools, AP)
- NEC (Router)
- Netgear (Router, AP)
- Qualcomm Atheros
- RedPine (Chipsets)
- Ruckus (AP)
- Ralink (Chipsets)
- Siemens (AP)
- TrendNet (Routers, AP)
- ZyXel (AP, Router, Adapter)
- 3.0 Ultra-short Reach Wireless Communications
- 3.1 Near Field Communications
- 3.1.1 General
- 3.1.2 Characteristics
- 3.1.3 Standardization
- 3.1.3.1 General
- 3.1.3.2 ECMA -340
- 3.1.3.3 ISO
- 3.1.3.4 NFC Forum
- 3.1.3.4.1 General
- 3.1.3.4.2 Specifications
- 3.1.3.5 Summary
- 3.1.4 Single Wire Protocol
- 3.1.5 Host Controller Interface
- 3.1.6 Security
- 3.1.7 Comparison
- 3.1.7.1 Bluetooth
- 3.1.7.2 RFID
- 3.1.8 Applications
- 3.1.8.1 General
- 3.1.8.2 Primary Users
- 3.1.8.3 Mobile Phone – Major Application
- 3.1.8.3.1 Example
- 3.1.8.4 Danger
- 3.1.8.5 WPAN Applications
- 3.1.8.6 Smart Poster
- 3.1.8.7 NFC and Wi-Fi
- 3.1.8.8 NFC and UWB
- 3.1.9 Trials
- 3.1.10 NFC Market
- 3.1.10.1 General
- 3.1.10.2 Market Drivers
- 3.1.10.3 Estimate
- 3.1.11 Industry
- Alvin
- Arygon (Identive Technologies)
- Infineon
- Innovision
- Inside Secure
- Legic
- Mocapay
- Motorola Solutions
- NEC
- Nokia
- Nexperts
- NXP
- OTI
- Qualcomm Atheros
- Reslink
- STmicroelectronics
- TI
- Toppan Forms
- Twinlinx
- UPM Raflatac
- Zenius
- 3.1.12 Major Developmental Trends
- 3.2 TransferJet
- 3.2.1 General
- 3.2.2 Basis
- 3.2.2.1 Goal and Development
- 3.2.3 Technology
- 3.2.4 Major Features
- 3.2.5 ECMA/ISO
- 3.2.7 Applications and Industry
- 3.2.8 Industry
- Allion
- Murata
- SONY
- Toshiba
- 4.0 Conclusions
- Attachment I: NFC Tags Types
- Figures
- Figure 1: Illustration - UWB Spectrum
- Figure 2: Global Regulations
- Figure 3: DS-UWB Spectrum Characteristics
- Figure 4: Spectrum Regulations-UWB
- Figure 5: ECMA – Architectural Reference Model
- Figure 6: TAM: Global UWB IC Revenue ($B)
- Figure 7: TAM: Global UWB IC (Unit Bil)
- Figure 8: TAM: U.S. Small SH Z - Wave IC ($US Mil)
- Figure 9: TAM: U.S. Large SH Z - Wave IC ($US Mil)
- Figure 10: ZigBee Protocol Stack
- Figure 11: Profiles
- Figure 12: TAM: U.S. ZigBee Modules Sales ($B)
- Figure 13: TAM: U.S. ZigBee Modules Sales (Mil. Units)
- Figure 14: ZigBee Market Segmentation (2010)
- Figure 15: ZigBee Market Segmentation (2014) - Projection
- Figure 16: Bluetooth Protocol Stack
- Figure 17: Piconets Illustration
- Figure 18: BT ULP Layers
- Figure 19: TAM: BT Modules Shipped (Bil. Units)
- Figure 20: TAM: BT Modules Shipped ($B)
- Figure 21: BT Market Geographical Segmentation
- Figure 22: Two-antenna MIMO system with two-stream SDM example
- Figure 23: 802.11 Protocol Family MAC Frame Structure
- Figure 24: TAM: Worldwide Legacy Wi-Fi Chipsets Sales (Unit Bil)
- Figure 25: TAM: 802.11n Chipsets Worldwide Sales (Unit Bil)
- Figure 26: TAM: Wi-Fi Chipsets Worldwide Sales ($B)
- Figure 27: Market Geography: IEEE 802.11n
- Figure 28: Standardization
- Figure 29: NFC ECMA and ISO Standards
- Figure 30: ISO Protocols
- Figure 31: NFC Forum Activities
- Figure 32: Mobile Phone with NFC
- Figure 33: TAM: Sales – Cell Phones with NFC Global (Mil. Units)
- Figure 34: NFC-able Cell Phone Rate of Penetration (%)
- Figure 35: TAM: Global Sales – NFC ICs ($B)
- Figure 36: NFC Market Geography
- Figure 37: TransferJet Communication Channel
- Figure 38: TransferJet Applications
- Tables
- Table 1: List of FCC Regulations
- Table 2: China – Regulations
- Table 3: Korea – Regulations
- Table 4: Japan – Regulations
- Table 5: Europe - Regulations
- Table 6: MB-OFDM UWB Frequencies Designation
- Table 7: Comparison: DS-UWB and MB-OFDM
- Table 8: ETSI Documents
- Table 9: Standard: Characteristics
- Table 10: Z-Wave and ZigBee
- Table 11: Z-wave Products Retail Pricing
- Table 12: ZigBee Parameters
- Table 13: ZigBee Smart Energy Profile Feature Set
- Table 14: Bluetooth Profiles
- Table 15: Wi-Fi Transfer Rates
- Table 16: 802.11n Advantages
- Table 17: Channels Utilization
- Table 18: NFC Features
- Table 19: NFC History
- Table 20: NFC Development
- Table 21: Bluetooth and NFC
- Table 22: TransferJet Major Characteristics
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