Global Mixed Signal System-on-Chip (MxSOC) Market by Intellectual Property (IP), Design Architecture, Fabrication Technology, Processor Type, Technology Nodes & Applications 2011 - 2016

MarketsandMarkets
December 28, 2011
342 Pages - SKU: MKMK6738046
License type:
Countries covered: Global

Global Mixed Signal System-on-Chip (MxSOC) Market by Intellectual Property (IP), Design Architecture, Fabrication Technology, Processor Type, Technology Nodes & Applications 2011 - 2016

System-on-a-Chip (SoC) technology, as the name suggests, is basically a technology of integrating several electronic components on a single IC chip to form an electronic system.

A standard SoC consists of the application processing IP and peripherals. It also consists of analog IP, digital IP, memory IP, ASIC/FPGA/Programmable Logic IP and others. Mixed Signal System-on-a-Chip (MxSoC) is a relatively new category in SoC which is designed for mixed signal (handling both analog and digital purposes). Today the application area of mixed signal technology has spread in all end user sectors from Computers, ICT sectors to Consumer Electronics, Industrial and others. Technological advancements of IC technology have enabled a system level integration on a System-on-a-Chip making MxSoC a suitable and efficient solution for applications in the LSI industry.

This report gives a detailed insight into the MxSoC design, development and establishment mainly focusing on its present market (market overviews) and its future market (forecasts). It provides in-depth research into market overviews of allied market segments of MxSoC such as Foundries, Fabless, IDM, WLP, EDA and others. It provides in-depth research of various above mentioned IPs in MxSoC. It also gives an in-detail analysis of the design markets by various classifications such as SoC design types, SoC processor types and SoC Architecture Strategy. Several other analyses of various concepts related to the MxSoC are provided in this report.

Our report analyzes in detail the global MxSoC market. All important classifications of MxSoC have been considered. We have also included our in-depth research and analysis on the MxSoC design technologies and fabrication technologies like 0.15um, 0.35um, 0.25um, 0.18um, 130nm, 90nm, 65nm, 45nm, 40 nm, 32nm, 28nm and 22nm. This report also discusses the market drivers, restraints and opportunities of MxSoCs from a global perspective. The markets of vast-spread applications of Mixed Signal ICs like Micro Processors, Micro Controllers, Computer Peripherals, Wireless Applications, DSP Applications, Smart Phones, Portable Media Players, DVD and Blu-ray Players, LED and LCD Displays, Set-top Boxes, Video Decoders, Power Management Chips, Automotive Body Electronics, Automotive Infotainment Applications, Solid State Electromechanical Systems, Field Programmable Mixed Signal Arrays, Radiation-Hard Mixed Signal ASICs, Implantable Medical Devices, Medical Oscilloscopes have been included and analyzed in this report. Applications of two rapidly growing products namely, Smart Sensors and Smart Fusion SoCs in several end user verticals have been given special attention. We have done an in-depth geographic analysis for each of the markets and their sub-segments, covering the major regional markets.

We have used various secondary sources such as directories and databases to identify and collect information useful for this extensive commercial study of MxSoC. The primary sources - selected experts from related industries and selected suppliers have been interviewed to obtain and verify critical information as well as to assess the future prospects.

We have also profiled leading players of this industry with their recent developments and other strategic industry activities. Key players profiled include Apple Inc., ARM Holdings PLC, Broadcom Corp., Elpida Memory Inc., Freescale Semiconductor, Fujitsu, Infineon Corporation A.G, Intel Corp., LSI Corp., Marvell, Microsemi Corp., MIPS Technologies Inc., NEC Corp., Qualcomm Inc., Texas Instruments, NVIDIA Corp., and Palmchip Corp. A complete competitive landscape, along with key growth strategies and market share analysis of the key industry players has also been included.


More Global Electronic Manufacturing Reports

Value-Added & Application Specific Ceramic Capacitors: World Markets, Technologies & Opportunities: 2012- 2017 by Paumanok Publications
This market, technologies & opportunities report from Paumanok Publications, Inc. is an update to the popular 2005 title. This study provides an in-depth analysis of ...

Worldwide IDC Electronics Manufacturing Services Market Forecast, 2012–2016 by IDC
This IDC update provides IDC's electronics manufacturing services (EMS) industry forecast from 2012 through 2016. It includes forecasts for the EMS and original design manufacturing ...

Global and China IC Substrate Industry Report, 2011-2012 by Research in China
With the improvement of IC operating frequency and integration, traditional leadframe packaging is out of use, and IC has to be packaged by substrates. By ...

Global Semiconductor Industry - Porter's Five Forces Strategy Analysis by Aruvian's R'search
The economic recession had a major impact on the global semiconductor industry and the market experienced a decline from 2008 till mid-2010. The year 2011 ...

Global Semiconductor & Electronic Parts Manufacturing by IBISWorld
Global Semiconductor & Electronic Parts Manufacturing Warning - high volatility! Volatility in this industry occurs for varying reasons. The average semiconductor plant is short lived before it ...

See all reports like this >>