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Printing Technology For Flexible Substrates

Interlingua.com Inc.
May 17, 2006
253 Pages - SKU: LIN1285876

Abstract Table of Contents Related Reports

A huge revolution is emerging in the format and manufacturing process of electronic devices including displays brought on by the use of plastic substrates and printing technology. Flexible substrates enable large displays that can be freely bent, lightweight, and easily transported, as a result. In addition, the new technology has the potential of achieving various new devices such as e-paper, a new display medium, which epitomizes the advantage of hard copy paper; solar cells which are 1/10 the weight; sensors that can be completely embedded in floors; and personal clothing.

This research report analyzes the latest trends in the technology and materials surrounding the manufacturing process of flexible electronic devices, with the above exciting breakthrough features.

Introduction
I. Material technology section
Chapter 1: Flexible substrates: 1.1 Requirements and issues related to flexible substrates; 1.2 Materials comprising flexible substrates; 1.3 Flexible substrate gas barrier technologies; 1.4 Technologies for forming devices and interconnects on flexible substrates; 1.5 Efforts by corporations and research institutions
Chapter 2: Organic Transistor Materials: 2.1 Principle and structure of organic transistors; 2.2 Requirements and issues related to organic semiconductors for transistors; 2.3 Types and characteristics of organic transistor materials; 2.4 Solubility of organic semiconductor materials; 2.5 Technology for controlling the molecular aggregation state; 2.6 Organic transistors as active matrix-driven devices; 2.7 Efforts of corporations and research institutions; 2.8 Future outlook
Chapter 3: Electrode and Interconnect Materials: 3.1 Types and characteristics of interconnect formation technologies; 3.2 Materials used for forming electrodes and interconnects
II. Processing Technologies
Chapter 1: Patterning Technologies: 1.1 Spincoating method; 1.2 Inkjet method; 1.3 Screenprinting method; 1.4 Gravure printing; 1.5 Flexo printing; 1.6 Nanoimprinting technology; 1.7 Dip-pen nanolithography (DPN); 1.8 Self-assembling technologies
Chapter 2: Wiring Formation/Bonding Technology: 2.1 Wiring formation using metal nanopaste; 2.2 Interlayer conduction; 2.3 Use of metal nanopaste in semiconductor bonding; 2.4 Application of metal nanopaste to SIP (System in Package)
Chapter 3: Transfer technology: 3.1 Background on the need for transfer technology; 3.2 Methods of producing plastic substrate TFTs; 3.3 Transfer of TFT circuits to a plastic substrate
Chapter 4: Efforts by Corporations and Research Institutes: 4.1 Seiko Epson; 4.2 ULVAC Corporation/Harima Chemical; 4.3 Dai Nippon Printing; 4.4 Toppan Printing; 4.5 National Institute of Advanced Industrial Science and Technology (AIST); 4.6 Cluster Technology (CTC); 4.7 Technology Research Association for Advanced Display Materials (TRADIM); 4.8 Fuji Electric
III. Application Chapter
Chapter 1: Flexible Printed Circuit Boards: 1.1 FPC manufacturing methods; 1.2 Copper-clad laminates; 1.3 Membrane circuit boards; 1.4 Multi-layer FPC
Chapter 2: Displays (1), Liquid Crystal Displays (LCDs): 2.1 Principles of liquid crystal displays; 2.2 LCD drive methods; 2.3 LCD structure and structural materials; 2.4 Method for LCD formation on flexible substrates; 2.5 Examples of plastic substrate LCDs under development
Chapter 3: Displays (2): Organic Electroluminescent Displays: 3.1 Operational principles of OLEDs; 3.2 Basic construction of organic electroluminescent displays; 3.3 Materials used in organic electroluminescent displays; 3.4 Forming organic electroluminescent elements on a flexible substrate; 3.5 Recently developed organic electroluminescent displays; 3.6 Efforts of corporations and research institutes; 3.7 What the future holds
Chapter 4: Displays (3): Field emission displays (FEDs): 4.1 Principles of FEDs; 4.2 CNT-FED fabrication
Chapter 5: Electronic Paper: 5.1 Concept of electronic paper; 5.2 Electronic paper implementation modes; 5.3 Candidate technologies for electronic paper; 5.4 Technical trends and future outlook of electronic paper
Chapter 6: Solar Cells: 6.1 Types of solar cells; 6.2 Flexible solar cells; 6.3 Principle behind the dye-sensitized solar cell; 6.4 Materials used in dye-sensitized solar cells; 6.5 Semiconductor electrode film formation; 6.6 Current status of solar cells and future outlook
Chapter 7: Batteries: 7.1 Sheet manganese batteries; 7.2 Structure and characteristics of lithium ion secondary battery; 7.3 Expanding applications for lithium ion secondary batteries
Chapter 8: IC card/tag structures: 8.1 IC card/tag structures; 8.2 IC card/tag structure; 8.3 Processing of IC cards/tags into products; 8.4 Current status of IC cards/tags and future outlook
Chapter 9: Flexible Sensors: 9.1 Structure of the flexible, large-area pressure sensor; 9.2 Fabrication of the flexible, large-area pressure sensor; 9.3 Future outlook

Printing Technology For Flexible Substrates

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