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Thermal Management Technologies (Heat Sinks)

Global Industry Analysts
July 1, 2009
678 Pages - SKU: GJOB2383608

Abstract Table of Contents Related Reports

Countries covered: Global

This report analyzes the worldwide markets for Thermal Management Technologies (Heat Sinks) in Millions of US$. The report on ‘Thermal Management Technologies (Heat Sinks)’ analyzes the Heat Sinks market by the following product segments: Metal Extruded Heat Sinks, Stamped Heat Sinks, Bonded or Fabricated Fin Heat Sinks, and Folded Fin Heat Sinks. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual forecasts are provided for each region for the period of 2006 through 2015. The report profiles 180 companies including many key and niche players worldwide such as Aavid Thermalloy, LLC, Aerocool Advanced Technologies Corp., ADDA Corp., Advanced Thermal Solutions, Inc., Ajigo Corp., Akasa Group, Alpha Company Ltd., Asia Vital Components Co. Ltd., ASUSTeK Computer Inc., Chaun Choung Technology Corp., Cooler Master Co. Ltd., Dynatron Corp., Enertron Inc., GlacialTech, Inc.. JMC Products, Inc., Melcor Corp., Neng Tyi Co. Ltd., Polo Tech Co. Ltd., R-Theta Thermal Solutions, Inc., Radian Heat Sinks, Sumitomo Electric Industries, Ltd., Swiftech, Taisol Electronics Co. Ltd., TennMax United, Thermal Integration Technology, Inc., Thermacore, Thermalright, Inc., Thermaltake Technology Co., Ltd., Titan Computer Co. Ltd., Verax Ventilatoren GmbH, Vette Corp., and Wakefield Thermal Solutions, Inc. Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.

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I.INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS: Study Reliability and Reporting Limitations; Disclaimers; Data Interpretation & Reporting Level; Metal Extruded Heat Sinks; Computers; Consumer Electronics
II. EXECUTIVE SUMMARY: 1.INDUSTRY OVERVIEW; Heat Sinks - Market Outlook; 2.MARKET TRENDS AND ISSUES; Hybrid Technologies Gaining Popularity Over TraditionalHeat Sinks; 3.INNOVATIONS IN HEAT SINK TECHNOLOGY; Dual Material Heat Sinks; New Heat Sink Attached to the Module with Adhesive; New Ceramic-based Heat Sink; 4.PRODUCT OVERVIEW; Comparison between Aluminum and Copper by PhysicalParameters - Thermal Conductivity, Cost, Weight,Production Method and Pressure on mounting devise; Necessity of a Heat Sink:; Classification of Heat Sinks; Passive Heat Sink; Bonded or Fabricated Fins; 5.END USE APPLICATIONS OF HEAT SINKS; Telecommunication; Consumer Electronics; 6.THERMAL MANAGEMENT PRODUCTS - CLASSIFICATION; Metal Backplanes; Table 1: Leading Players in the Worldwide Thermal Management Hardware Market (2006 & 2007) - Percentage Share Breakdown by Value Sales forAavid Thermalloy, Thermacore, Lytron, and Others(includes corresponding Graph/Chart); Interfaces and Substrates; 7.RECENT INDUSTRY ACTIVITY; Modine Sells Thermacore (USA); Waytronx Takes Over CUI (USA); Modine Sets up Production Unit (India); ATS Launched the New Star™ Series Heat Sinks (USA); Vette Corp. Forms Allies with Asia Aluminum (China); Onscreen Technologies Revamps Business Strategy (US); Mouser Signs Distribution Agreement with ComairRotron (US); Vette Corp Announces Production Expansion (North America); CPS Enters Into Partnership with DiamondTechnologies (US); iCurie Re-named as Celsia Technologies (US); Intel Acquires 5% Stake in Neng Tyi (Taiwan); Vette Announces New BGA Thermal Solutionsfor Integrated Circuits (US); Wakefield Expands DC/DC Converter HeatSink Line (US); 8.HEAT SINKS AND RELATED PRODUCT LAUNCHES AND DEVELOPMENTS; Alpha Launches Low Profile LPD Series HeatSinks (Japan); Vantec Unveils New AeroFlow FX Series CPUCoolers (US); ATS Offers Two New Heat Sinks for BGA Packages(US); ATS Offers New Heat Sink Cooling Solutions for LinearLED Lighting Products (US); Alpha Launches ST Series Heat Sinks (Japan); Thermalright Launches HR-01 X CPU Cooler (US); Thermalright Unveils HR-09 Mosfet Cooler (US); ATS Offers Passive and Active Heat Sinks forFreescale’s Processors (US); Schaffner Expands Product Line with SeifertElectronics Products (Switzerland); THERMALTAKE Presents Two Turion CPUCoolers (US); ATS Offers Online Tutorials for ThermalManagement (US); Emulation Technology Launches Heat Sinks withElliptical Fin BGA Chipset (US); Advanced Thermal Solutions Launches blackDIAMONDHeat Sink (US); 9.FOCUS ON SELECT GLOBAL PLAYERS; Ajigo Corp. (USA); Asia Vital Components Co. Ltd. (Taiwan); Cooler Master Co. Ltd. (Taiwan); GlacialTech, Inc. (Taiwan); Neng Tyi Co. Ltd (Taiwan); Sumitomo Electric Industries, Ltd. (Japan); TennMax United (USA); Thermalright, Inc. (USA); Verax Ventilatoren GmbH (Germany); 10.GLOBAL MARKET PERSPECTIVE; Table 3: World 10-year Perspective for Heat Sinks Marketby Geographic Region - Percentage Share of Dollar Salesfor North America, Japan, Europe, Asia-Pacific andRest of World for 2006, 2009, and 2015 (includescorresponding Graph/Chart); Analysis by Product Segment; Table 5: World 10-year Perspective for Metal Extruded Heat Sinks Market by Geographic Region - Percentage Share Breakdown of Dollar Sales for North America, Japan, Europe,Asia-Pacific and Rest of World for 2006, 2009, and 2015(includes corresponding Graph/Chart); Table 6: World Recent Past, Current & Future Analysis for Stamped Heat Sinks Market by Geographic Region - US,Canada, Japan, Europe, Asia-Pacific and Rest of WorldMarkets Independently Analyzed with Annual Salesin US$ Million for Years 2006 through 2015(includes corresponding Graph/Chart); Table 7: World 10-year Perspective for Stamped Heat Sinks Market by Geographic Region - Percentage Share Breakdown of Dollar Sales for North America, Japan,Europe, Asia-Pacific and Rest of World for 2006, 2009,and 2015 (includes corresponding Graph/Chart); Table 8: World Recent Past, Current & Future Analysis for Bonded Fins Heat Sinks Market by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Salesin US$ Million for Years 2006 through 2015(includes corresponding Graph/Chart); Table 9: World 10-year Perspective for Bonded Fins Heat Sinks Market by Geographic Region - Percentage Share Breakdown of Dollar Sales for North America, Japan,Europe, Asia-Pacific and Rest of World for 2006, 2009,and 2015 2015 (includes corresponding Graph/Chart); Table 10: World Recent Past, Current & Future Analysis for Folded Fins Heat Sinks Market by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific and Rest of WorldMarkets Independently Analyzed with Annual Salesin US$ Million for Years 2006 through 2015(includes corresponding Graph/Chart); Table 11: World 10-year Perspective for Folded Fins HeatSinks Market by Geographic Region - Percentage Share Breakdown of Dollar Sales for North America, Japan,Europe, Asia-Pacific and Rest of World for 2006, 2009,and 2015 2015 (includes corresponding Graph/Chart); Analysis By End-Use Market; Table 13: World 10-year Perspective for Heat Sinks inComputers Sector by Geographic Region - PercentageShare of Dollar Sales for US, Canada, Japan, Europe,Asia-Pacific and Rest of World Markets for 2006,2009 & 2015 (includes corresponding Graph/Chart); Table 14: World Recent Past, Current & Future Analysisfor Heat Sinks in Telecom Sector by Geographic Region -US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzedwith Annual Sales in US$ Million for Years2006 through 2015 (includes correspondingGraph/Chart); Table 15: World 10-year Perspective for Heat Sinks inTelecom Sector by Geographic Region - Percentage Shareof Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets for 2006, 2009 &2015 (includes corresponding Graph/Chart); Table 16: World Recent Past, Current & Future Analysisfor Heat Sinks in Consumer Electronics Sector byGeographic Region - US, Canada, Japan, Europe,Asia- Pacific and Rest of World Markets IndependentlyAnalyzed with Annual Sales in US$ Million forYears 2006 through 2015 (includes correspondingGraph/Chart); Table 17: World 10-year Perspective for Heat Sinks in Consumer Electronics Sector by Geographic Region - Percentage Share of Dollar Sales for US, Canada,Japan, Europe, Asia-Pacific and Rest of WorldMarkets for 2006, 2009 & 2015 (includescorresponding Graph/Chart); Table 18: World Recent Past, Current & Future Analysisfor Heat Sinks in Medical Electronics and Office Equipment Sectors by Geographic Region - US, Canada, Japan,Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years2006 through 2015 (includes correspondingGraph/Chart); Table 19: World 10-year Perspective for Heat Sinks inMedical and Office Equipment Sectors by GeographicRegion - Percentage Share of Dollar Sales for US,Canada, Japan, Europe, Asia-Pacific and Rest of WorldMarkets for 2006, 2009 & 2015 (includescorresponding Graph/Chart); Table 20: World Recent Past, Current & Future Analysisfor Heat Sinks in Industrial and Military Sector byGeographic Region - US, Canada, Japan, Europe,Asia-Pacific and Rest of World Markets IndependentlyAnalyzed with Annual Sales in US$ Million forYears 2006 through 2015 (includes correspondingGraph/Chart); Table 21: World 10-year Perspective for Heat Sinks inIndustrial and Military Sector by Geographic Region -Percentage Share of Dollar Sales for US, Canada,Japan, Europe, Asia-Pacific and Rest of World Marketsfor 2006, 2009 & 2015 (includes correspondingGraph/Chart); Table 22: World Recent Past, Current & Future Analysisfor Heat Sinks in Automotive Sector by Geographic Region -US, Canada, Japan, Europe, Asia-Pacific and Rest ofWorld Markets Independently Analyzed with AnnualSales in US$ Million for Years 2006 through 2015(includes corresponding Graph/Chart); Table 23: World 10-year Perspective for Heat Sinks inAutomotive Sector by Geographic Region - PercentageShare of Dollar Sales for US, Canada, Japan, Europe,Asia-Pacific and Rest of World Markets for 2006, 2009 &2015 (includes corresponding Graph/Chart)
III. MARKET: 1.THE UNITED STATES; Product Innovations; Product Launches/Developments; Strategic Corporate Developments; Select Players; CTS Corp. (USA); Enertron, Inc. (USA); Swiftech (US); Thermalright, Inc. (USA); Vantec Thermal Technologies, Inc. (US); B. Market Analytics; Table 25: US 10-year Perspective for Heat Sinks Market by Product Segment - Percentage Share Breakdown of Dollar Sales for Metal Extruded, Stamped, Bonded Fin, andFolded Fin Heat Sinks for 2006, 2009, and 2015(includes corresponding Graph/Chart); Table 26: US Recent Past, Current & Future Analysis for Heat Sinks by End-Use Sector - Computers, Telecom, Consumer Electronics, Medical and Office Equipment, Industrial and Military, and Automotive MarketsIndependently Analyzed with Annual Sales Figuresin US$ Million for Years 2006 through 2015(includes corresponding Graph/Chart); Table 27: US 10-Year Perspective for Heat Sinks byEnd-Use Sector: Percentage Share Breakdown ofDollar Sales for Computers, Telecom, ConsumerElectronics, Medical and Office Equipment,Industrial and Military and AutomotiveMarkets for 2006, 2009 & 2015 (includescorresponding Graph/Chart); 2.CANADA; B. Market Analytics; Table 29: Canadian 10-year Perspective for Thermal Management Heat Sinks Market by Product Segment - Percentage Share Breakdown of Dollar Sales for MetalExtruded, Stamped, Bonded Fin, and Folded FinHeat Sinks for 2006, 2009, and 2015 (includescorresponding Graph/Chart); Table 30: Canadian Recent Past, Current & FutureAnalysis for Heat Sinks by End-Use Sector - Computers, Telecom, Consumer Electronics, Medical/OfficeEquipment, Industrial and Military, and AutomotiveMarkets Independently Analyzed with Annual SalesFigures in US$ Million for Years 2006 through2015 (includes corresponding Graph/Chart); Table 31: Canadian 10-Year Perspective for HeatSinks by End-Use Sector: Percentage ShareBreakdown of Dollar Sales for Computers,Telecom, Consumer Electronics, Medical and Office Equipment, Industrial/ Military, andAutomotive Markets for 2006, 2009 & 2015(includes corresponding Graph/Chart); 3.JAPAN; Strategic Corporate Developments; Select Players; Sumitomo Electric Industries, Ltd. (Japan); Table 33: Japanese 10-year Perspective for Heat Sinks Market by Product Segment - Percentage Share Breakdown of Dollar Sales for Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks for 2006, 2009, and 2015 (includes corresponding Graph/Chart); Table 34: Japanese Recent Past, Current & FutureAnalysis for Heat Sinks by End-Use Sector - Computers, Telecom, Consumer Electronics, Medical/OfficeEquipment, Industrial and Military, and AutomotiveMarkets Independently Analyzed with Annual SalesFigures in US$ Million for Years 2006 through 2015(includes corresponding Graph/Chart); Table 35: Japanese 10-Year Perspective for Heat Sinks by End-Use Segment - Percentage Share Breakdown of Dollar Sales for Computers, Telecom, Consumer Electronics, Medical and Office Equipment, Industrial and Military, and Automotive Markets for 2006, 2009 & 2015 (includes corresponding Graph/Chart); 4.EUROPE; Strategic Corporate Developments; Verax Ventilatoren GmbH (Germany); B. Market Analytics; Table 37: European 10-year Perspective for HeatSinks Market by Product Segment - Percentage ShareBreakdown of Dollar Sales for Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks for 2006,2009, and 2015 (includes correspondingGraph/Chart); Table 38: European Recent Past, Current & FutureAnalysis for Heat Sinks by End-Use Sector - Computers, Telecom, Consumer Electronics, Medical/OfficeEquipment, Industrial and Military, and AutomotiveMarkets Independently Analyzed with Annual SalesFigures in US$ Million for Years 2006 through2015 (includes corresponding Graph/Chart); Table 39: European 10-Year Perspective for HeatSinks by End-Use Sector: Percentage ShareBreakdown of Dollar Sales for Computers, Telecom, Consumer Electronics, Medical and Office Equipment, Industrial/ Military, and AutomotiveMarkets for 2006, 2009 & 2015 (includescorresponding Graph/Chart); 5.ASIA PACIFIC; Product Innovations; Product Launches/Developments; Strategic Corporate Developments; Select Players; Aerocool Advanced Technologies Corp. (Taiwan); ASUSTeK Computer, Inc. (Taiwan); Cooler Master Co. Ltd. (Taiwan); Neng Tyi Co. Ltd (Taiwan); Thermal Integration Technology, Inc (Taiwan); B. Market Analytics; Table 41: Asia Pacific 10-year Perspective for HeatSinks Market by Product Segment - Percentage Share Breakdown of Dollar Sales for Metal Extruded,Stamped, Bonded Fin, and Folded Fin Heat Sinksfor 2006, 2009, and 2015 (includescorresponding Graph/Chart); Table 42: Asia Pacific Recent Past, Current & Future Analysis for Heat Sinks by End-Use Sector - Computers, Telecom, Consumer Electronics, Medical/OfficeEquipment, Industrial and Military, and AutomotiveMarkets Independently Analyzed with Annual SalesFigures in US$ Million for Years 2006 through2015 (includes corresponding Graph/Chart); Table 43: Asia Pacific 10-Year Perspective forHeat Sinks by End-Use Sector: PercentageShare Breakdown of Dollar Sales for Computers, Telecom, Consumer Electronics, Medical and Office Equipment, Industrial/ Military, andAutomotive Markets for 2006, 2009 & 2015(includes corresponding Graph/Chart); 6.REST OF WORLD; B. Market Analytics; Table 45: Rest of World 10-year Perspective forHeat Sinks Market by Product Segment - PercentageShare Breakdown of Dollar Sales for Metal Extruded, Stamped, Bonded Fin, and FoldedFin Heat Sinks for 2006, 2009, and2015 (includes corresponding Graph/Chart); Table 46: Rest of World Recent Past, Current &Future Analysis for Heat Sinks by End-Use Sector - Computers, Telecom, Consumer Electronics,Medical/ Office Equipment, Industrial and Military,and Automotive Markets Independently Analyzedwith Annual Sales Figures in US$ Million forYears 2006 through 2015 (includescorresponding Graph/Chart); Table 47: Rest of World 10-Year Perspective forHeat Sinks by End-Use Sector: Percentage ShareBreakdown of Dollar Sales for Computers,Telecom, Consumer Electronics, Medicaland Office Equipment, Industrial/ Military,and Automotive Markets for 2006, 2009 &2015 (includes correspondingGraph/Chart)
IV. COMPETITIVE LANDSCAPE: Total Companies Profiled:; Region/Country Players; The United States; Canada; Japan; Europe; Asia-Pacific (Excluding Japan)

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