Countries covered: Global
This report analyzes the Global Market for Nanomemory in Millions of US$. The types of Nanomemory technologies discussed in the report include: Ferroelectric Random Access Memory or FRAM, Magnetoresitive Random Access Memory or MRAM, Ovonic Unified Memory, Holographic Memory, Nano-RAM or NRAM, Molecular Memory, and Polymer memory. Annual forecasts are provided for the period of 2010 through 2015. The report profiles 40 companies including many key and niche players worldwide such as Advanced Micro Devices, Inc., California Molecular Electronics Corporation, Cavendish Kinetics, Colossal Storage Corporation, Cypress Semiconductor Corporation, Everspin Technologies, Inc., Fujitsu Limited, Hewlett-Packard Development Company, L.P, Hitachi, Ltd., Honeywell International Inc., International Business Machines Corp., Infineon Technologies AG, Intel, Nanochip, Inc., Nanosys, Inc., Nantero, Inc., NVE Corporation, Ovonyx, Inc., Ramtron International Corporation, Samsung Electronics Co., Ltd., SanDisk Corporation, STMicroelectronics NV, Texas Instruments Inc., and ZettaCore, Inc. Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.
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- I.INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS
- Study Reliability and Reporting Limitations
- Disclaimers
- Data Interpretation & Reporting Level
- Product Definitions and Scope of Study
- II. EXECUTIVE SUMMARY
- 1.MARKET OVERVIEW
- Modern Day Storage Woes
- Nanomemory to the Rescue
- Table 1: World Long Term Projections for Nanomemory Market- Annual Sales Figures in US$ Billion for the Years 2010 through 2015 (includes corresponding Graph/Chart)
- Who Leads the Pack?
- Conventional Vs Emerging Storage Options
- Comparison Between Traditional and Emerging Memory Types
- Nanotechnology to Alter Memory Storage in Electronics
- MRAM: Pros and Cons
- What’s in Store for MRAM?
- Ovonic Memory Gathering Momentum
- Holographic Memory in Future
- R&D in Nanomemory: A Sneak Peak
- Carbon Nanotubes Based Memory
- Nanodots
- Nanocrystalline Memory
- Nano-Ionic Memory
- Patent Protection Vital for Investment
- Table 2: Number of Patents Filed for Select Nanomemory Types from 2003 Onwards in the US, Japan, Europe, and WIPO (includes corresponding Graph/Chart)
- 2.PRODUCT OVERVIEW
- Nanotechnology: Breaking Conventional Size Barriers
- Volatile and Non-Volatile Memory
- Nanomemory: An Introduction
- Select Nanomemory Types - Features, and Applications
- Comparison of Select Nanomemory Technologies- FRAM, MRAM, and Ovonic Unified Memory
- FRAM
- MRAM
- Ovonic Unified Memory
- Holographic Memory
- NRAM
- Molecular Memory
- Polymer Memory
- 3.TECHNOLOGICAL DEVELOPMENTS
- Researchers Develop New Nanotube Flash Memory Design
- Researchers to Develop Graphene Memory
- Physicists Succeed in Controlling Electron Spin
- Chemists Develop New Method to Synthesize Nanorods and Nanowires
- Researchers Develop Nanowires to Store Data
- IBM Develops New Memory Device
- KAIST Develops 8nm NVM Flash Memory
- University of Southampton Develops Optical Memory Element
- Researchers Develop the Largest Memory Bit Array
- Physicists Develop Optical Memory Using Single Gallium Nanoparticle
- 4.PRODUCT INNOVATIONS/INTRODUCTIONS
- Toshiba Unveils New 16-Gigabit Memory Chip
- Micron Launches 8-Gb SLC high speed NAND
- AMD Launches New Stream Processor, AMD FireStream™ 9250
- AMD Introduces Two New Graphics Card with TeraFlops Graphics Chip
- AMD to Use GDDR5 Memory in New Advanced ATI Radeon™ Graphics Systems
- AMD Introduces New Graphics Accelerator, ATI FirePro™ V 8700
- AMD Releases New Graphic Processor, ATI Radeon™ E2400
- Hitachi Announces Nanotechnology Milestone for Hard Disk Drives Capacity
- Ramtron’s New Integrated EDR Incorporates F-RAM Capabilities
- Ramtron Unveils New Serial F-RAM with 2Mb Memory
- Ramtron Unveils FM3135
- Samsung’s Sampling of Smallest-ever 2Gb DDR3 Utilizes 50nm Class Circuiting
- Samsung’s New High-Performing Smart Card IC Utilizes 90nm Technology
- SanDisk Releases a New WORM Digital Memory Card for Data-Write-Protection
- SanDisk’s New Advanced Memory Stick PRO-HG Duo™, Ideal for SLR cameras
- Everspin Includes Small Footprint and byte-wide BGA Products into MRAM family
- Infineon Technologies Launches X-GOLD™102
- Nanochip Unveils a Breakthrough Storage Technology
- Ramtron Unveils FM25V05, Serial 512-Kilobit F-RAM
- Ramtron Releases High-Speed FM28V100
- Ramtron Releases FM25V10, Flexible 1-Megabit Serial F-RAM
- Ramtron Enhances Its Range of AEC-Q100-Specified F-RAM Memory Devices
- Samsung Introduces First 30nm Flash Memory in the World
- Virage Unveils New 65nm Product Lines
- RIC Launches 4Mb FRAM
- Samsung Launches 8GB Flash Memory
- Hewlett-Packard Launches Nanotechnology Based New Computer Chip
- Ramtron Unveils 4Mb Non-Volatile FRAM Memory
- Samsung Develops a New Chip for Digital TVs
- Samsung Launches 8GB moviNAND for Mobiles
- Samsung Launches 30nm Process Node Based Primary Flash Memory Chip
- Virage Expands the Range of Silicon Aware IP Line
- Toshiba Corp to Manufacture NAND Flash Memory Chips with 43nm Technology
- Impinj Releases AEON@OTP Nonvolatile Memory Cores
- Scientists in South Korea Create the World’s First 8-nanometer Flash Memory Part
- Epson and Fujitsu Develop Next-Generation FRAM Technology
- Fujitsu Introduces Embedded FRAM for Digital Televisions
- Ramtron Extends Grade 1 Automotive Devices Product Range
- Ramtron Announces Expansion of +125ºC F-RAM-based Automotive Devices
- Ramtron Unveils a New 2Mb Parallel High-Density F-RAM memory device
- Ramtron Expands Versa 8051Series by Unveiling a 2 KB F-RAM Microcontroller
- Ramtron Expands Nonvolatile State Saver Line by Unveiling a 4-bit F-RAM Device
- Ramtron Expands F-RAM-based Grade 1 Automotive parts
- FRAM Memory from Ramtron Incorporated in Car Audio Platform by Daesung-Eltec
- Ramtron Announces Upgrading of Grade 1 Automotive line
- Ramtron Introduces Improved F-RAM-Enhanced™ Processor Companions
- Samsung Unveils GDDR5 Memory Chip Transfers data at Speeds of 6Gb/s
- Samsung Introduces 64Gb MLC NAND Flash Memory for High Density Storage
- Samsung Unveils 60nm 2Gb DDR2 DRAM Using Class Processing Technology
- Samsung Introduces a Multi-chip High-Density moviMCP Memory Package
- Samsung Commences Sampling of 16Gb NAND Flash Utilizing 50nm Processing Technology
- Hitachi and Renesas Launch Circuit Technology for On-Chip Nonvolatile Memory Applications
- Hitachi Launches 0.05mm x 0.05mm Contactless RFID IC Chip
- Infineon Unveils XE166 Family of Real-Time Signal Controllers
- Impinj Releases AEON® for Production in TSMC
- Ramtron and TI to Launch 4-Mbit FRAM
- 5.RECENT INDUSTRY ACTIVITY
- Hynix to Acquire Stake in ProMOS
- Lockheed Martin Acquires Government Business Unit of Nantero
- BAE Systems and MAST to Develop Nano-Sensor Technology
- Qimonda Partners with Elpida
- SVTC Partners with Nantero
- Hynix Partners with Nanosys
- Qimonda AG in Partnership with Elpida Memory Inc. to Develop Nano-Chips
- Nantero Partners with SVTC Technologies to Develop Carbon Nanotube Process
- Aewin Technologies Enters into an Agreement with Ramtron
- Numonyx Commences Prototype Production of 45nm Wafers
- Hynix to Commence Production of 50nm DRAM
- SanDisk to Commence Production of MLC NAND Flash Memory
- Crocus Technology Raises Funds to Develop MRAM Technology
- Samsung and Sun Microsystems Collaborate on SLC Flash Memory Development
- ATMI and Ovonyx to Collaborate on High-Volume Manufacture of PCM Products
- SanDisk and Toshiba Co-Develop NAND Flash Memory
- Energy Optimizers Enters into an Agreement with Ramtron
- Freescale Forms New Company for MRAM Development
- Hynix Joins the Memory Technology Access Program (M-TAP) of Nanosys
- Toshiba Develops 16-Gigabit NAND Flash Memory
- Ramtron International Selects Shanghai Welltech for FM25L16 Designing
- AMD Partners with TSMC
- TSMC Announces Virage as IP Partner
- RIC Partners with TI
- Samsung and Toshiba Collaborate on Premium NAND Memory Chips
- Ovonyx and Hynix Collaborate on PCM Products Development
- Ovonyx and Qimonda Collaborate on PCRAM Technology
- IBM, Infineon, Freescale, Samsung & Chartered Cooperate on 32-nm Semiconductors
- Spansion Inks Agreement with TSMC
- AMD Enters into an Agreement with SAMSUNG
- Infineon Enters into an Agreement with IBM
- Toshiba to Manufacture 43nm NAND Flash Memory Chips
- Samsung Starts Production of 16-gigabit NAND Flash Memory
- Samsung Commences Production of 60nm DRAM Chips
- Intel Corp Receives Approval for New Computer Chip Plant
- NVE Corp to Receive New Patent
- Intel to Commence Mass Production of Alverstone
- National Semiconductor to Qualify Cavendish Kinetics’ Nanomech Process
- Samsung Commences Mass Production of NAND Flash Memory Chips
- 6.FOCUS ON SELECT GLOBAL PLAYERS
- Advanced Micro Devices, Inc. (US)
- California Molecular Electronics Corporation (US)
- Cavendish Kinetics (US)
- Colossal Storage Corporation (US)
- Cypress Semiconductor Corporation (US)
- Everspin Technologies, Inc. (US)
- Fujitsu Limited (Japan)
- Hewlett-Packard Development Company, L.P. (US)
- Hitachi, Ltd. (Japan)
- Honeywell International Inc. (US)
- International Business Machines Corp. (US)
- Infineon Technologies AG (Germany)
- Intel (US)
- Nanochip, Inc. (US)
- Nanosys, Inc. (US)
- Nantero, Inc. (US)
- NVE Corporation (US)
- Ovonyx, Inc. (US)
- Ramtron International Corporation (US)
- Samsung Electronics Co., Ltd. (Korea)
- SanDisk Corporation (US)
- STMicroelectronics NV (Switzerland)
- Texas Instruments Inc (US)
- ZettaCore, Inc. (US)
- III. COMPETITIVE LANDSCAPE
- Total Companies Profiled:
- Region/Country Players
- The United States
- Japan
- Europe
- Germany
- The United Kingdom
- Rest of Europe
- Asia-Pacific (Excluding Japan)
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