Strategic Assessment of Asia Pacific Integrated Smart Card IC Technology on Different Form FactorsFrost & SullivanSeptember 2, 2008 48 Pages - SKU: MC1903936 |
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Printed Circuit Board Manufacturing in China
4/17/2012 | published by: IBISWorld
Printed Circuit Board Manufacturing in China Businesses in the Printed Circuit Board Manufacturing industry in China manufacture printed circuit boards and specialized electrical components. Printed circuit boards (PCBs) and specialized components are made of conducting components,
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$910.00
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The Taiwanese LCD TV Video Processing IC Market, 1Q 2012
4/18/2012 | published by: Market Intelligence & Consulting Institute
This research presents Taiwanese LCD video processing IC market size forecasts. Also included are recent quarter reviews of market volume, market value, ASP, and solution provider ranking. The content of this research is based on
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$1,930.00
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Top 550 Printed Circuit Board Manufacturers (Global)
4/1/2012 | published by: Plimsoll Publishing Ltd.
This report is an in-depth financial evaluation of the GlobalPrinted Circuit Board Manufacturers. Using the unique Plimsoll method of analysis, each of the top 550 companies included is individually assessed and ranked against each other
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$1,500.00
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Smart Card Market in Japan 2011-2015
4/13/2012 | published by: Infiniti Research Limited
TechNavio’s analysts forecast the Smart Card market in Japan to grow at a CAGR of 18.8 percent over the period 2011–2015. One of the key factors contributing to this market growth is the growth in
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$1,500.00
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Global Programmable Logic Devices Market 2011-2015
4/5/2012 | published by: Infiniti Research Limited
TechNavio’s analysts forecast the Global Programmable Logic Devices market to grow at a CAGR of 10.4 percent over the period 2011–2015. One of the key factors contributing to this market growth is the increasing demand
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$1,500.00
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Global and China IC Substrate Industry Report, 2011-2012
4/1/2012 | published by: Research in China
With the improvement of IC operating frequency and integration, traditional leadframe packaging is out of use, and IC has to be packaged by substrates. By packaging mode, the mainstream IC substrates include BGA (Ball Grid
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$2,100.00
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Three-dimensional Integrated Circuit (3D IC/Chip) & Through-Silicon Via (TSV) Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016)
4/5/2012 | published by: MarketsandMarkets
Three-dimensional Integrated Circuit (3D IC/Chip) & Through-Silicon Via (TSV) Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016)
3D IC/Chip & TSV Interconnects Market - Global Forecast & Trend Analysis
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$4,650.00
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Global WLAN IC Market 2011-2015
4/5/2012 | published by: Infiniti Research Limited
TechNavio’s analysts forecast the Global WLAN IC market to grow at a CAGR of 5.2 percent over the period 2011–2015. One of the key factors contributing to this market growth is the increasing demand for
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$1,500.00
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Freedonia Focus on Smart Card Industry Overview: United States
2/29/2012 | published by: Freedonia Focus
This report discusses US smart cards for the years 2006 and 2011, with forecasts for 2016. Topics covered include world overview, smart card product and service overview, application segmentation, technology and product developments, regulatory and
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$600.00
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Global and China Printed Circuit Board (PCB) Industry Report, 2011-2012
3/1/2012 | published by: Research in China
The report highlights the rigid PCB. In 2010, the output value of PCB, a full-blown industry, grew by 23.8%, a record high since 1998. In 2011, the growth in output value slowed down to only
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$2,600.00
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