World Printed Circuit Board Automatic Test Equipment Markets

Frost & Sullivan
November 11, 2005
SKU: MC1194250
License type:
Countries covered: Global

Shift in Fault Spectrum in PCBs Propels Demand for ATE the World Over

Globally, the last five years witnessed a dramatic change in the types of faults found in digital integrated circuits (ICs) and printed circuit boards (PCBs). With the overall defect rate of parts reducing, and a concurrent improvement in component quality (especially for digital ICs), the traditional bed-of-nails fixtures are proving ineffective in defect correction. These ‘bug iron’ or ‘traditional’ in-circuit testers have excess capabilities not called for in simple test jobs. In the whole process, while the tester’s usefulness in dealing with complex boards is not questioned, the hitches that conventional in-circuit test (ICT) systems are adept at correcting occur much less frequently. This restricts the tester’s effectiveness while the excess tester capability leads to higher costs. In these conditions, PCB automatic test equipment (ATE), with its enhanced performance is successfully catering to numerous applications, particularly industrial- and manufacturing-related ones.

This Frost & Sullivan research service provides an overview of and an outlook for the global PCB ATE market. The study segments the markets into in-circuit testers, functional testers, combinational/boundary scan testers, and manufacturing defect analyzers. It provides detailed revenue forecasts and market share analysis, and is essential for both large and small market participants seeking maximum return on investments.

Specific Demands of DoD Stimulate Development in ATE Technologies

In general, the defense sector demands specifically made testers for PCBs. "The requirements are fast migrating toward modular instruments-on-a-card steadily and these devices are usually personal computer (PC)-controlled and use hardware formats and backplanes found commonly in commercial testing, "says the analyst of this research service.

Crucially, military services are focusing on achieving a higher degree of standardization across all traditional boundaries in order to reduce costs and boost the efficiency of ATE. The ATE policy of the Department of Defense (DoD) continues to emphasize on inter-linked standards and the level of interoperability, a fact likely to drive the PCB ATE markets.

Novel PCBs Necessitate Advanced ATE

New electronic goods such as desktop PCs, notebooks, modules, camcorders, and cellular phones are set to become more complex, while they and their constituent components continue to shrink in size. These latest systems will incorporate advanced packaging technologies, and will subsequently demand interconnect tools. End users thus, seek test equipment that would efficiently examine these complex miniature boards. "Automatic optical inspection (AOI) and X-ray check ups are finding wide acceptance due to limited board access," states the analyst. "While these options are likely to gain popularity in the future, their inherent test limitations would prevent them from becoming a dominant testing solution."

With the competition in the testers market being fierce, companies are forced to survive in a low-profit margin set-up, where high price cuts are not an ideal solution. Inflation and other economic pressures will be instrumental in bringing about improvements and rationalization in the whole PCB testing industry.



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