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World IC Socket Market

Bishop & Associates
September 1, 2007
SKU: BCBQ1578603

Abstract Table of Contents Related Reports

Countries covered: Global

Bishop and Associates has just released a new report providing a complete analysis of The World IC Socket Market. This new report furnishes detailed 2005/2006 sales statistics for both production IC sockets and test/burn-in sockets. Sales by end-use equipment markets are also provided, as well as five-year projections to the year 2011. Expanded coverage of twelve major socket types is supplied and profiles of leading manufacturers are exhibited. This report provides all the key data needed to analyze the World IC Socket Market.

World demand for IC Socket connectors reached $1,888 million in 2006, up +14.1 percent from the 2005 total of $1,655 million. IC Socket represented 4.7 percent of the total 2006 connector market of $35.5 billion.

The IC socket market will increase to $2,844.4 million in 2011, a five-year CAGR of 8.5 percent. In 2011, the IC socket market will increase to 4.8 percent of world connector demand.

This report examines current and future trends in IC sockets. It discusses the effects that international regulations and globalization has had, and will have on the IC socket market. Business and economic considerations involved in the manufacturing of IC sockets are reviewed and the many applications for IC sockets are discussed.

IC sockets are used in all end-use equipment markets. The computer and peripheral sector is the largest consumer of IC sockets, with a total of $582 million in 2006, or 30.8 percent of total demand for IC sockets. The industrial and data/telecom sectors are also large users of IC sockets.

Chapter 1 - The World IC Socket Connector Market: IC Socket Connectors By Region (2006-2011); IC Socket Connectors By Market (2006-2011); IC Socket Market Size for Two Major Categories and Their Sub Categories; 2006 IC Socket Sales - by Region by Product Line; Major Manufacturers Of IC Socket Connectors; Top Five IC Socket Manufacturers; Tyco Electronics - 12%; Molex Incorporated - 10.8%; Foxconn (Hon Hai) - 3.5%; FCI - 2.6%; 3M - 1.9%; Manufacturers Whose Major Focus is IC Sockets; Aries Electronics - Test & Burn-in Sockets; Chupond Precision Co. Ltd - Production Sockets; Enplas Semiconductor Peripheral Corporation - Test & Burn-in Sockets; Johnstech International - Test & Burn-in Sockets; Loranger International Corp - Test & Burn-in; Mill-Max - Test & Burn-in and Production Sockets; Plastronics Socket Company - Test & Burn-in Sockets; Sensata Technologies -Test & Burn-in Sockets; Win Way Technology Pvt Ltd. - Test & Burn-in; Yamaichi - Test & Burn-in and Production; Worldwide List of IC Socket Manufacturers
Chapter 2 - IC Socket Connectors - Business And Technology Trends: IC Performance; IC Device Packages; Reasons For IC Sockets; Economics of IC Socket Use; IC Sockets as a Tool in Electronic Assembly; IC Sockets Create Flexibility; IC Sockets are Widely Used; Business And Economic Considerations; Our Electronics World; International Expansion of the Global Market for IC Sockets; Response From Countries Outside the US; International Expansion of Electronic Companies Design Centers; Proliferation of IC Socket Suppliers; Mergers and Acquisitions; Intellectual Property, a Key to IC Socket Development; Small Companies Respond to Specialized Requirements; Production Sockets Versus Test and Burn-in Sockets; General; The Necessity of Rapid Response for Test and Burn-in Applications; Profitability in the IC Socket Market; Technology Trends; General; The Affect of RoHS Requirements on IC Socket Manufacturers; RoHS Compliance Not Universal; ROHS Compliance Changes Processes and Products; Standards Organizations; Variations in Contacts and Interconnection Methods; Move to Surface Mounting:; Continued Need for More Connections; Improved Performance Affects IC Packages; The Trend to Test Multiple Devices at Once; Life Cycle Performance Considerations; Factors Affecting Cycles; Metal Plating; Contamination and Degradation; Test Board Considerations; Alignment; Summary of Life Cycle Consideration; Types of IC Sockets; Single In-Line, SIP Sockets; Dual In-Line, DIP Sockets; QFP, Quad Flat Pack Sockets; PQFP, Plastic Quad Flat Pack Sockets; TQFP, Thin Quad Flat Pack Sockets; QFN IC Sockets; SOIC, Small Outline IC Sockets; LCC, Leaded Chip Carrier and PLCC, Plastic Leaded Chip Carrier Sockets; SOJ, Small Outline J-Lead Sockets; Memory Module Sockets; PGA, Pin Grid Array Sockets; BGA, Ball Grid Array Sockets; Coplanarity Issues; Alignment Issues; Fine Pitch Demands Superior Performance; Custom Sockets Develop Into Standard Versions; Styles of BGA Sockets; Photos courtesy of E-Tec Interconnect; Sockets Combine with Adapters; BGA Sockets for Production Testing; LGA, Land Grid Array Sockets; Custom IC Sockets; New and Future Trends in IC Sockets; Future Trends; Summary
Chapter 3 - IC Sockets - World Market By Region & Product Line: North American IC Socket Market; European IC Socket Market; Japanese IC Socket Market; Chinese IC Socket Market; Asia/Pacific IC Socket Market; ROW IC Socket Market; Total IC Socket Market

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