Bishop and Associates, Inc. has just released a new 13-chapter research report providing a complete analysis of Evolving High-Speed Connectors. This new report details backplane, midplane, and high-speed backplane cable assemblies. Connector values are provided for each category for the years 2007, 2008,2009, and 2013, as well as region of the world.
Connectors designed to operate in multi-gigabit applications have
proliferated over the past four years providing system designers
greatly expanded interconnect options and performance levels.
Advances in connector as well as signal conditioning technology
have pushed interface bandwidth from 3 Gb/s to 20+ Gb/s, with at
least one supplier introducing a 40 Gb backplane connector. This
market research report addresses the many aspects of the highspeed
interconnect market from what is driving demand for faster
channels, to defining the key characteristics of the leading
connector families that are currently available. Detailed market
estimates and forecasts extending to 2013 for backplane and cable
connectors by application and region of the world are featured.
A variety of factors associated with high-speed channels have a
major influence on their behavior. Chapters are devoted to
reviewing related system elements including driver and receiver
technology, printed circuit board materials, as well as channel
modeling, and performance measurement systems.
A new chapter focused on innovation provides examples of new creative approaches to addressing some of
the challenges associated with interconnection and packaging of next generation electronic equipment.
This market research report also includes several tutorial chapters on connector and high-speed design
issues that enable a non-technical reader to gain from the information provided.
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- Chapter 1 - Report Scope And Methodology
- Report Scope And Methodology
- Methodology and Approach
- Connector Manufacturer Survey
- Users Survey
- Chapter 2 - Introduction And Definitions
- Preface
- Introduction
- Chapter 3 - High Speed Connector Basics
- High Speed Connector Basics
- Common Backplane Architecture
- Midplane Architecture
- Orthogonal Midplane Architecture
- High-Speed Transmission Line Issues
- Defining Features of High-Speed Interfaces
- Connector Selection Criteria
- Bandwidth Rating of Connectors
- The Second Sourcing Imperative
- Performance Measurement Systems
- Test and Analysis Equipment
- Comparison of Electrical Performance
- Design Support Provided by Connector Manufacturers
- Chapter 4 - The Need For Speed
- The Need For Speed
- Market Drivers to Higher Speed Interfaces
- Speed Versus Density
- The Influence of Industry Standards
- Chapter 5 - High Speed Interconnect System Elements
- High-Speed Interconnect System Elements
- Driver and Receiver Technology
- Printed Circuit Board Materials
- Printed Circuit Board Design and Fabrication
- Chapter 6 - High-Speed Connector And Market Trends, 2006-2008
- High-Speed Connector And Market Trends 2006-2008
- High-Speed Backplane Connector Families
- Chapter 7 - Overview Of Current High-Speed Backplane / Midplane
- Connectors
- Overview Of Current High-Speed Backplane / Midplane Connectors
- Amphenol TCS
- VHDM, VHDM-HSD, VHDM H-Series, e-HSD, GbX, Ventura, Aptera,
- Crossbow, XCede, VIPER
- ERNI Components
- ERmetZD, ERmet zero XT and ERmetZD plus
- FCI Electronics
- Metral 4000®, AirMax VS®, ZipLine™
- 3M Electronic Solutions Division
- HSHM, UHM
- Molex
- VHDM / VHDM-HSD, GbX, GbX I-Trac, Impact, EdgeLine
- Tyco Electronics
- Z-Pack HS3, Z-PACK™ HM-Zd, Z-PACK™ HM-Zd+,
- TinMan, TinMan+ MultiGig RT, Z-Pack Slim UHD, STRADA
- Whisper
- Chapter 8 - High-Speed Copper Connector And Cable
- Assemblies
- High-Speed Copper Cable Connectors And Assemblies
- Bringing Cable To The Backplane
- Cable Assembly Construction
- High-Speed Cable Assembly Types
- Typical Applications
- Chapter 9 - Overview Of Selected High-Speed Copper
- Backplane Cable Assembly Suppliers
- Overview Of Selected High-Speed Backplane Cable Assembly
- Suppliers
- W.L. Gore & Associates
- Meritec
- Molex
- Samtec
- Sanmina-SCI
- Carlisle Interconnect Technologies
- FCI Electronics
- Tyco Electronics
- Amphenol InterCon Systems
- 3M Electro Communications Business Group
- LEONI
- Chapter 10 - Backplane And Cable Connector Design Feature
- Charts
- Backplane And Cable Connector Design Feature
- Introduction
- Backplane Connector Design Features
- Amphenol TCS
- Amphenol ABS
- ERNI Electronics
- FCI Electronics
- Molex
- Tyco Electronics
- 3M
- Chapter 11 - Market Analysis / Forecasts
- Market Analysis - Forecast
- Measurement Criteria
- World Connector Market
- High-Speed Backplane & Midplane Connectors
- Market Forecast by World Region
- High-Speed Backplane & Midplane Connectors
- World Market - End User Forecast
- High Speed Backplane & Midplane Connectors
- World Market Forecast
- High-Speed Copper Cable Assemblies
- Market Forecast by World Region
- 3- 12+ Gb/s Copper Cable Assemblies
- World Market - End User Forecast
- High Speed Copper Cable Assemblies
- Chapter 12 - High-Speed Connector Innovation
- High-Speed Connector Innovation
- Introduction
- Chapter 13 - Major Findings And Conclusions
- Major Findings And Conclusions
- General
- Backplane Connectors
- Midplane Connectors
- High-Speed Cable Connectors and Assemblies
- Appendix A - Terms And Definitions
- Appendix B - List Of Contributors
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