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Evolving High Speed Backpane, Mezzanine and Cable Connectors

Bishop & Associates
July 1, 2004
220 Pages - SKU: BCBQ1136344

Abstract Table of Contents Related Reports

The key objectives of this report are to explore the critical issues associated with the development and successful implementation of multi-gigabit backplane, mezzanine and cable connectors.

• How has the high-speed backplane, mezzanine, and cable connector landscape changed over the past two years?
• What if any are the perceived limits of copper backplane interconnects?
• What roles will evolving transceiver and signaling protocols play in achieving multi-gigabit performance?
• What role will emerging industry standards organizations such as OIF, and UXPi play in influencing backplane, mezzanine, and cable connector selection in multi-gigabit systems? Will PICMG 3.0 drive multigigabit connectors into the mainstream?
• What products or market segments are driving the need for higher backplane, mezzanine and cable interconnect speeds?
• What is the timetable required for new high-speed connectors to meet volume production requirements?
• What is the U.S. domestic, European, and Asian market value today and forecasts for multi-gigabit connectors 2003 through 2008?
• Can 5-10 Gb/s performance be achieved in standard FR-4 board material or must higher grade / cost laminates be used?
• What PCB design and fabrication process changes will be necessary in order to achieve multi-gigahertz performance?
• What is the cost / reliability impact of these changes?
• What high-speed backplane, mezzanine, and cable connectors are available now and what new products are expected in the relatively near future? What are the key characteristics of interfaces currently on the market? What are their pricing trends?
• Are new interconnect technologies being developed that can improve high-speed connector performance? Would users consider them in next generation products?
• What is the most accurate method of quantifying the performance of high-speed connectors? What new tools such as StatEye are entering the test and measurement arena? Is SPICE a reliable simulation tool in 5+ Gigabit systems? How is S parameter data being used to quantify channel performance?
• What tools are suppliers providing users to verify high-speed performance and are they relevant to the needs of specific applications?
• Can performance data from competitive connector suppliers be directly compared?
• Are fiber optic backplane connectors, as they exist today, a viable alternative to copper interfaces? What is the status of FO backplane developments?
• How important are mezzanine connectors and backplane cabling in multi-gigabit systems currently in design? What role will they play in next generation equipment?
• What are the key design features that users will demand in next generation interconnect systems?

In spite of the economic downdraft that prevailed in the electronics industry over the past three years, solid advances have been made in understanding, designing, measuring, and simulating multi-gigabit circuits. New innovative interconnects have been introduced, and design and measurement tools necessary to successfully implement multi-gigabit channels have pushed the current 3 Gb/s systems to the next plateau of 5+ Gb/s. New transceivers with advanced features are capable of compensating for losses and distortion extending the effective length of high-speed circuits. Innovative alternative solutions to the problems associated with the connector launch are changing the way connectors will be attached to the PCB. Users are reporting greater confidence in their ability to upgrade systems without stretching their economic and technology comfort zones.

Our research on this report included:

• Interviews with knowledgeable electronics industry personnel involved in the design and development of products that utilize high-speed connectors.
• Interviews with representatives of applicable industry standards organizations.
• Interviews with independent consultants in high-speed system design and simulation.
• Collection and review of technical articles and advertising in industry trade publications.
• Interviews with manufacturers of high-speed backplane and mezzanine and cable connectors.
• Extensive Internet searches for related data.
• Discussion with suppliers of active devices, advanced printed circuit board materials, and high speed simulation tools.
• Utilization of the Bishop and Associates database of electronic connectors.

Chapter 1 - Report Scope and Methodology: Report objectives; Study methodology; Data collection forms; Backplane connector manufacturer; Backplane connector user; Mezzanine connector questions
Chapter 2 - Introduction and Definitions: Preface; Introduction; Connector definitions / technologies
Chapter 3 - High Speed Connector Basics: Common backplane architectures; High-speed transmission line issues; Defining features of high speed connectors; The second sourcing imperative; Performance measurement systems
Chapter 4 - The Need for Speed: Market drivers to higher speed interfaces; Speed vs. density; The influence of industry standards; Market trends
Chapter 5 - High Speed Interconnect System Elements: Driver and receiver technology; Printed circuit board materials; Printed circuit board design and fabrication
Chapter 6 - Overview Of High-Speed Backplane Connectors: Erni – ERmet ZD, Ermet zeroXT; FCI – Metral 3000, 4000, AirMax VS; Hirose -Hx2; ITT Industries Cannon, Tempus 4000/6000; 3M– HSHM.; Molex – VHDM, VHDM-HSD,GbX; Teradyne – VHDM, L, H, VHDM-HSD, GbX, GbX-L; Tyco –HS3,HM Zd, Multigig RT; Winchester Electronics –, SIP-1000; Alternative Backplane Technologies
Chapter 7 - High-Speed Mezzanine Connectors: Mezzanine connector architecture; Advantages of mezzanine packaging; Interface types/ configurations; Mezzanine connector applications; The role of standards; Overview of current High-Speed Mezzanine Connectors; AVX – MMA; ERNI – MicroSpeed; FCI – Meg / Gig Array; Fujitsu – MicroGiGaCN; Hirose – IT2; Molex – Plateau HS Mezz / VHDM Stacker; Samtec – Q Series; Teradyne – Stacker, NexLev; Tyco Electronics – Mictor, STEP-Z
Chapter 8 - High-Speed Backplane Cable Assemblies: Bringing Cable to the backplane; Cable assembly characteristics; Typical applications; W.L Gore & Associates; Molex; Sanmina SCI8; Tensolite; Tyco Electronics; Other suppliers
Chapter 9 - Connector Design Features: Backplane Connectors; Mezzanine Connectors; High Speed Cable Assemblies; Comparison of physical attributes; Comparison of electrical performance; Differentiating features
Chapter 10 - Market Analysis / Forecasts: Measurement criteria; High Speed backplane connectors; World market size by bandwidth segment; World market forecast 2003-2008 by bandwidth segment; World market by geographic region; Market forecast 2003-2008 by region; World market by end user; World market forecast 2003-2008 by end user; High Speed Mezzanine Connectors; World market size by bandwidth segment; World market forecast 2003-2008 by bandwidth segment; World market by geographic region; Market forecast 2003-2008 by region; World market by end user; World market forecast 2003-2008 by end user; High Speed Copper Cable Assemblies; World market size by bandwidth segment; World market forecast 2003-2008 by bandwidth segment; World market by geographic region; Market forecast 2003-2008 by region; World market by end user; World market forecast 2003-2008 by end user
Chapter 11 - The Fiber Optic Option: Current Fiber optic backplane products; Evolving optic technology; Polymer Optic interconnect
Chapter 12 - High-Speed Backplane, Mezzanine Connector and Cable Assembly Trends: Backplane and mezzanine connector trends; High Speed cable trends; Connector pricing trends
Chapter 13 - Major findings and conclusions: Appendix; List of contributors

Evolving High Speed Backpane, Mezzanine and Cable Connectors

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