Connector Types And Technologies Poised For Growth

Bishop & Associates
February 1, 2010
SKU: BCBQ2604638
License type:
Table of Contents Related Reports
Bishop and Associates, Inc. has just released a 23 chapter report providing a detailed analysis of Connector Types and Technologies Poised for Growth. This new report addresses a list of 19 specific connector types that are expected to experience greater than average growth in either volume or sales based on the rapid expansion of markets for existing and new products that utilize these interfaces. New technologies already driving the market as well as emerging technologies that are poised to influence connector design and/or application are reviewed. A discussion of market trends that are changing the way electronic connectors are used is included.

Each connector type is defined with a product description including key mechanical and electrical performance characteristics, as well as the rational for its selection. Typical applications are also identified. A global market value and forecast to 2013 documents our growth expectations for each connector type.

Many of the selected interfaces have existed in the market for several years, but emerging applications will propel their growth well beyond that of the general connector market. Some legacy connector types, for instance, are being adapted to high-speed differential signaling, which will allow implementation in next-generation equipment. In other cases, entirely new interfaces will show logarithmic percentage growth from near zero as they are implemented in new high-volume applications.

Issues covered in this report include:
  • Which existing connector types are poised for exceptional sales growth?
  • What new electronic products and technologies are driving this connector growth?
  • How will the current global economic recession and recovery impact the adoption rate of new interfaces?
  • Which industry segments will utilize these connectors? Which segments will require the development of entirely new interfaces to address specific applications?
  • Who are the leading manufacturers of these connectors?
  • How are power connectors being adapted to provide greater power and signal density while supporting system thermal management strategies?
  • How do connector manufacturers differentiate their products defined by an industry specification?
  • What specific applications will drive the growth of these connectors?
  • What is the forecasted global market value of these growth connectors over the 2009 through 2013 period?
  • How much of this growth will be influenced by formal, defacto or special-interest-group-generated standards?
  • What is driving increasing interest in electronic system design that conforms to standardized hardware platforms?
  • Which exiting connectors, defined by an industry standard, will continue to evolve in terms of bandwidth and signal density?
  • Will new system packaging techniques such as orthogonal midplane designs become widely adopted over the next three to five years?
  • Will new material technology change the way connectors are designed, fabricated and utilized?
  • Will systems based on 85-ohm impedance dominate the industry or co-exist with 100-ohm systems?
  • How will system designer demand for higher speed and density interfaces influence the development of next-generation connector technology?
  • Are one-piece, high-performance edge connectors experiencing a resurgence? Why?
  • Has the performance/cost curve of fiber-optic connectors finally tipped the advantage to fiber over copper in I/O applications?
  • How will global environmental mandates influence the design of future interconnects?
  • How is the convergence of computing, communications and consumer entertainment influencing the design of interconnects?
  • What new classes of products, such as wireless video, light-emitting diode illumination and alternative energy generation, will require the development of new interconnect systems?
  • What technology gaps exist that must be addressed in order to satisfy next-generation equipment interconnect requirements?
  • What effect will the adoption of wireless devices have on copper cabling and connectors?
  • How are design engineers addressing potentially conflicting objectives of signal density, power density and thermal density?
  • How is the trend toward mobile computing, communication and entertainment influencing the ability to deliver power?
  • Will smaller semiconductor geometries suffer from reduced resistance to ESD damage?
  • In what applications are high-speed Ethernet and Infiniband protocols most effectively applied?
  • How are global demographics influencing the development of new electronic products as well as overall market size?
  • How are high-speed backplane and I/O connectors evolving to address the issues of 40 to 100 Gb/s bandwidth? Are copper 40+ Gb/s interfaces a viable solution, or has copper finally reached its practical bandwidth limit?
  • How will connector manufacturers address potentially conflicting requirements for identical second sources and protection of intellectual property?
  • Will Serial ATA and SAS continue to dominate the storage interconnect landscape?
  • What new interfaces will dominate emerging automotive applications including infotainment, networking, power management and battery charging?
  • How will cloud computing and hardware virtualization influence the markets for computing equipment in the future?
  • All of these topics and others are discussed in this new report on Connector Types and Technologies Poised for Growth.


 

Share this report


Other tasks

 
 

Research Assistance

Ask a question
 

Related Markets


Connectors Reports

 
 

Free Alert Me service

Receive bi-weekly email alerts on new market research

Sign Up Today!