Connector Imperatives to Support Next Generation Electronic Equipment

Bishop & Associates
March 1, 2005
SKU: BCBQ1136232
License type:
Bishop and Associates has just released a new eight-chapter research report analyzing Connector Imperatives to Support Next Generation Electronic Equipment. This new report identifies emerging electrical, mechanical and economic attributes of connectors anticipated by the electronic system design community as well as provide examples of new products connector suppliers have released or are developing in order to address these emerging needs. The report is focused on three industry segments that are experiencing the most rapid and dramatic changes, and represent some of the most fertile markets for innovation in connector technology (Computers, Telecom and Automotive). Statistics are presented showing historical and forecast connector shipments for the years 2003, 2004, 2005 and 2009.

The report identifies a number of specific connector attributes and trends that resulted from extensive (over 50) interviews with designers, engineers, and technology managers within the connector using community. Additional interviews provided input on new interconnect products in development or recently introduced within the connector supplier group.

Some Of The Issues Explored In This Report

Are connectors currently available on the market today capable of providing performance adequate to support systems for the foreseeable future?

What new connector attributes or features will be required that do not exist today? When must these be in place?

How has advanced transceiver chip technology enabled connectors to extend their design bandwidth?

What role will emerging industry standards organizations play in influencing connector design, development and implementation in the future?

What products or market segments are driving the need for higher connector performance? Why?

What is the timetable required for new enhanced feature connectors to meet volume production requirements?

What is the U.S. domestic, European, and Asian connector market value today and forecasts for connectors in the computer, telecom and automotive markets 2005 through 2009?

Will new connector technologies being developed by small independent companies be able to influence system design using non-traditional interfaces or system packaging schemes?

What are the greatest connector challenges now being faced by next generation system design engineers? What new products or technologies are connector users identifying as being critical to the successful development of their new systems?

What new interconnect technologies now in the concept or development stage has the potential to change traditional connector paradigms?

Will contract manufacturers take over an increasing responsibility for actual system design? How will the use of EMS / ODMs in the manufacturing / design process influence the migration of new interconnect technology into new systems? How will that change the OEM/connector vendor relationship?

Is the plated through hole in a PCB reaching a high-speed performance limit? Will surface mounted connectors or some other technology become the high-speed PCB interface of choice?

How must power connectors evolve in order to address the growing thermal management issue?

Is the process by which new connectors are developed and introduced changing? How, why?

How will the lead-free initiative influence connector design, performance, and cost?

What is the design priority of connector attributes as new connectors are developed? Does this match a users list of connector priorities?

Will new materials developed from nanotechnology play a significant role in next generation connector designs?

How should connector manufacturers market new interfaces given the movement of design engineering to offshore locations?

Is the connector using community ready to make major paradigm shifts regarding interconnect technology and architecture?

Which connector suppliers are perceived as leading the industry in new interconnect technology?

How will connector companies protect their intellectual property as the manufacturing and design migration to offshore locations increases?

How will the expansion of wireless technology influence the use of traditional copper connectors?

What is orthogonal midplane architecture and why is interest growing in this design?

Are "smart" connectors a viable solution to increased packaging density demands of new systems?

What is driving interest in designing to industry standards in both the computer and automotive electronic marketplaces?