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Supply Chain Opportunities in High-Speed Electronics 2009-2014

BPA Consulting Ltd.
November 9, 2009
151 Pages - SKU: OBPC2514955

Abstract Table of Contents Search inside this report Related Reports

A Strategic Review of PCB, Material and Interconnection Trends and Needs for Electronic Assemblies for High-Speed Telecom, Datacom Networks and High-End Computers over the period 2009 to 2014.

KEY TRENDS

40G networks are about to take the next step to 100G.
16G Fibre Channel is emerging in the data storage arena, 32G will follow
The copper and fibre interface continues to change and will penetrate at a system level in the future
Wireless mobile datacom is moving from 3G to 4G.
Convergence of satellite and terrestrial mobile communications
Coreless and thin core packaging solutions for high speed semiconductors

KEY DELIVERABLES

This study provides a totally integrated assessment of the high speed electronics value chain
Identification and quantification of the opportunities for small, medium and large technology vendors
Comprehensive roadmaps detailing the technologies, materials and processes that will be needed to participate in these markets
Identifies key technology and market drivers of this major market sector

1. EXECUTIVE SUMMARY
2. INTRODUCTION: Introduction; Background; Research Methodology
3. HIGH SPEED SYSTEM ARCHITECTURES AND MARKET DRIVERS: Introduction; Standard System Architectures; Proprietary System Architectures; High-End Routers; Optical Transport Equipment; High-End Servers; Data Storage and Network Switch; Wireless Base Station; Military and Aerospace; Automotive
4. HIGH-SPEED CIRCUIT BOARDS: Introduction; Trace Geometry and Copper Skin Effect; Impedance Control; Compensation Techniques; Connectors, Vias and PTHs; Laminate Key Attributes; Low-Loss Laminates; Price Factor; Environmental Issues; Assembly and Test; Lead-Free Assembly; Test Standards and Systems; Conclusions and Implications
5. ADVANCED SEMICONDUCTOR PACKAGING: Introduction; Substrate Constructions for IC Packages; Multilayer Build-Up Substrates; Coreless Substrate Constructions; Substrate Technology Trade-Offs; Embedded Circuit Substrate; Semiconductor and Package Test; Conclusions
6. OPTO-PCBs AND COUPLING: Introduction; Optical Backplane Technologies; Embedded Waveguide Formation Photolithography; Two Photon Initiation; Laser Ablation; Ion Implantation; Hot Embossing and Replication; Embedded Polymer Waveguide Materials; Optical Coupling; Board to Board Optical Interconnect; Chip-to-Chip Optical Interconnect; Optical Transceiver Modules; Transponders and Transceivers; Parallel Optical Transceivers; Optical Sub-Assemblies; Silicon Photonics; Summary
7. MARKET FORECASTS: Introduction; Computer and Datacom; Telecom - Wireless Base Transceiver Station; Combined Telecom/Datacom Market for Low-Loss Laminates; Other Markets for Low-Loss Laminates; Summary of Market Demand for High-Speed PCBs and Laminates; Opto-PCBs; Transceiver Modules; Advanced Flip Chip Substrates
8. CONCLUSIONS AND OPPORTUNITIES: Conclusion; Opportunities
APPENDIX
GLOSSARY
LIST OF TABLES: 1.1 Demand for High-Speed Systems; 1.2 Total Worldwide Demand for High Performance Laminate (000s sq m); 2.1 Transmission Protocols; 2.2 Transmission Protocols Wireless and Mobile; 3.1 High-End Router Technology Roadmap; 3.2 High-End Server Technology Roadmap; 3.3 Air Interface Access Standards Supported by OBSA and BTS Configuration; 3.4 Base Transceiver Station Technology Roadmap; 4.1 Tier 2 Laminate Materials Df: 0.010-0.020 @ 10GHz; 4.2 Tier 3 Laminate Materials Df: 0.007-0.010 @ 10GHz; 4.3 Tier 4 Laminate Materials Df: 0.005-0.007 @ 10GHz; 4.4 Tier 5 Laminate Materials Df: 0.003-0.005 @ 10GHz; 4.5 Tier 6 Laminate Materials RF/Microwave Applications Df: <0.003 @ 10GHz; 5.1 High-Speed Packaging Summary Table; 5.2 Number of Network Processors for a Given Data Rate; 5.3 High End Router Key Characteristics; 5.4 High-Speed Datacom ASIC Package Roadmap; 5.5 IC Packages Used in High-End Router; 5.6 Substrates for Advanced and High-Speed IC Packages; 5.7 Thin Core Substrate Suppliers; 5.8 Coreless Substrate Suppliers; 5.9 Substrate Technology Comparison; 5.10 Coreless Substrate Pros and Cons; 5.11 Advanced Flip Chip Substrate Technology Roadmap; 6.1 Candidate Materials for Embedded Waveguides; 6.2 Active Optical Components; 6.3 Key Transceiver and Transponder MSAS; 6.4 Transceiver Dimensions; 6.5 Key Parallel Optical Transceiver MSAS; 6.6 Opto-PCB Technology Roadmap; 7.1 Laminate Requirements, High-end Router; 7.2 Laminate Requirements, High-end Server; 7.3 Worldwide BTS Transceiver Demand; 7.4 Base Station Board Components Requiring Low Loss Laminate; 7.5 Applications Using Low Loss Laminate; 7.6 Total Worldwide Demand for High Performance Laminate (000s sq m); 7.7 High-end High-speed Systems Potential Candidates for Opto-PCBs; 7.8 IC Package Forecast (Billion Units); 8.1 Summary of Challenges; 8.2 Summary of Opportunities in High-Speed Electronics
Summary of Challenges: 1.1 Low-Loss Laminate Selection; 2.1 Electronic System Supply Chain; 3.1 Global IP Traffic 2008-2013; 3.2 Cisco CRS-1 8-Slot Single-Shelf System; 3.3 Juniper High-End Router; 3.4 FlexplaneTM Implementation; 3.5 Sun SPARC M9000 Architecture; 3.6 Sun Fire M9000 Crossbar; 3.7 IBM Z10 and Multichip Module; 3.8 Z10 Architecture (a) Components, (b) Logical System Structure; 3.9 Data Storage Network; 3.10 Brocade 48000 San Advanced Switching Director; 3.11 Cisco Nexus 7000 Switch; 3.12 BTS Block Diagram Based on OBSAI Specifications; 3.13 Ericsson Single Rack RBS 6000; 3.14 Motorola CTU4 Radio Unit; 3.15 Vehicle Communication Networks; 4.1 Loss Due to Skin Effect and Dielectric; 4.2 Shift to Skin Effect Dominance; 4.3 Skin Loss at Different Surface Roughness; 4.4 Laminate Performance Pyramid Loss Factor at 10GHz; 4.5 Relative Prices of High Performance Laminates; 4.6 Typical Lead-Free Solder Reflow Profile; 5.1 ASIC/GPU/CPU Substrate Roadmap; 5.2 Samsung Coreless Substrate; 5.3 Laser Ablated Circuit Pattern (before and after plating); 6.1 Optical Backplane Solution; 6.2 Molex FlexplaneTM; 6.3 Daimler Chrysler/ERNI Optical Backplane; 6.4 Optical Backplane Interconnection - Daimler Chrysler/ERNI/EADS; 6.5 Embedded Waveguide Formation Using Photolithography; 6.6 Digital Optic Switching Device Using Embossing Process for Waveguide; 6.7 Integration Concept of Opto-PCB by TPA; 6.8 Replication Process Using Fluorinated Polyimide; 6.9 Light Coupling Technologies; 6.10 Beam Coupling with Parabolic Mirror; 6.11 Direct Coupled Optical Devices; 6.12 Xyratex Orthogonal Backplane and Line Card Optical Connect; 6.13 Concept of Low Cost Board Level Optical Interconnection; 6.14 Transceiver Modules; 6.15 Reflex Photonics Optically Enabled ASIC; 6.16 Cross-Section of Intel Optical Transceiver Optical Coupling of Lasers/Photodetectors through 45° Mirror; 6.17 Intel LightpeakTM Transceiver Intel Silicon Modulator (left) and Avalanche Photodiode (right); 6.18 Intel’s Prototype Package for Chip-to-Chip Optical Data Communication; 6.19 Luxtera Optical Modulator in CMOS; 7.1 Demand for High-end Routers (Units); 7.2 Demand for Low Loss Laminate for Routers; 7.3 Demand for Servers; 7.4 Demand for Low Loss Laminate for Servers; 7.5 Worldwide Demand for Wireless Base Stations; 7.6 Demand for Low Loss Laminate for Wireless Base Stations; 7.7 Total Demand for Low Loss Laminates for Routers, Servers and Base Stations; 7.8 Worldwide Demand for High-Speed PCBs; 7.9 Worldwide Demand for Opto-PCBs; 7.10 Demand for Transceiver Modules; 7.11 Worldwide Demand for Advanced Flip Chip Substrates

Supply Chain Opportunities in High-Speed Electronics 2009-2014

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