Flex And Flex-rigid Printed Circuits 2010-2016

Importance of this Report Flexible and flex-rigid substrates are key technologies in future generation electronic system design and development. The market for flex and rigid-flex printed circuit boards for all sectors will increase to $12.7bn by 2016. Mobile phone and display interconnects dominate Asian production and markets. These segments account for nearly half of all FPC production. Flex and flex-rigid production in China will increase from $2 billion in 2010 to more than $4 billion by 2016 accounting for 25% of worldwide production. Asia in total will account for more than 90% of worldwide flex production by 2016. Benefits to you Identifies opportunities for small, medium and large players Identifies and examines the technologies, materials and processes that you will need to participate in these markets Identifies winning strategies for successful players Provides a totally integrated assessment of the global flexible and flex-rigid substrate supply chain.

Additional Information

Why BPA?

BPA has monitored and reported on the demand for advanced substrates, packaging and interconnection for thirty years and is seen by the global electronics community as a leading authority on this market.

BPA has a unique capability to understand the inter-relationships between all the major elements within the electronics industry supply chain.

BPA has an in-depth and detailed knowledge of developments at the system, component, process equipment and materials sectors and how they relate to each other. This allows BPA to forecast demand for materials, components and equipment.

Proven analytical capability developed through nearly a thousand previous studies enables BPA to successfully analyse, qualify and quantify technologies and markets; and thereby identify opportunities for the electronics industry supply chain.